JP2009506527A5 - - Google Patents

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Publication number
JP2009506527A5
JP2009506527A5 JP2008527548A JP2008527548A JP2009506527A5 JP 2009506527 A5 JP2009506527 A5 JP 2009506527A5 JP 2008527548 A JP2008527548 A JP 2008527548A JP 2008527548 A JP2008527548 A JP 2008527548A JP 2009506527 A5 JP2009506527 A5 JP 2009506527A5
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JP
Japan
Prior art keywords
functional element
light
output coupling
light source
light output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008527548A
Other languages
English (en)
Japanese (ja)
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JP2009506527A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2006/052797 external-priority patent/WO2007023411A1/en
Publication of JP2009506527A publication Critical patent/JP2009506527A/ja
Publication of JP2009506527A5 publication Critical patent/JP2009506527A5/ja
Pending legal-status Critical Current

Links

JP2008527548A 2005-08-24 2006-08-14 カラー変換器を備えた発光ダイオードおよびレーザーダイオードのための電気接触システム Pending JP2009506527A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05107760 2005-08-24
PCT/IB2006/052797 WO2007023411A1 (en) 2005-08-24 2006-08-14 Light emitting diodes and lasers diodes with color converters

Publications (2)

Publication Number Publication Date
JP2009506527A JP2009506527A (ja) 2009-02-12
JP2009506527A5 true JP2009506527A5 (enExample) 2009-10-01

Family

ID=37547491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008527548A Pending JP2009506527A (ja) 2005-08-24 2006-08-14 カラー変換器を備えた発光ダイオードおよびレーザーダイオードのための電気接触システム

Country Status (7)

Country Link
US (1) US7863642B2 (enExample)
EP (1) EP1922764A1 (enExample)
JP (1) JP2009506527A (enExample)
KR (1) KR20080048492A (enExample)
CN (1) CN101248535B (enExample)
TW (1) TW200715254A (enExample)
WO (1) WO2007023411A1 (enExample)

Families Citing this family (22)

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WO2008152552A1 (en) * 2007-06-13 2008-12-18 Philips Intellectual Property & Standards Gmbh Led lighting device
US9401461B2 (en) * 2007-07-11 2016-07-26 Cree, Inc. LED chip design for white conversion
US7859000B2 (en) * 2008-04-10 2010-12-28 Cree, Inc. LEDs using single crystalline phosphor and methods of fabricating same
JP5255421B2 (ja) * 2008-12-15 2013-08-07 株式会社小糸製作所 発光モジュール、発光モジュールの製造方法、および灯具ユニット
JP2010219166A (ja) * 2009-03-13 2010-09-30 Nippon Electric Glass Co Ltd 半導体発光素子デバイス
WO2010143114A1 (en) 2009-06-11 2010-12-16 Koninklijke Philips Electronics N.V. Led illumination device
US20110062468A1 (en) * 2009-09-11 2011-03-17 Koninklijke Philips Electronics N.V. Phosphor-converted light emitting diode device
DE102009042205A1 (de) * 2009-09-18 2011-03-31 Osram Opto Semiconductors Gmbh Optoelektronisches Modul
DE102010022561A1 (de) * 2010-06-02 2011-12-08 Osram Opto Semiconductors Gmbh Wellenlängenkonversionselement, optoelektronisches Bauelement mit einem Wellenlängenkonversionselement und Verfahren zur Herstellung eines Wellenlängenkonversionselements
DE102010035490A1 (de) * 2010-08-26 2012-03-01 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelements
TW201217706A (en) * 2010-10-26 2012-05-01 Wistron Corp Light emitting apparatus and using method thereof
DE102011077644A1 (de) * 2011-06-16 2012-12-20 Osram Ag Leuchtvorrichtung mit Metallisierungsbereich bestückt mit Halbleiterleuchtchip
JP6178806B2 (ja) 2012-03-01 2017-08-09 フィリップス ライティング ホールディング ビー ヴィ Ｌｅｄ照明アレンジメント
DE102012101892B4 (de) * 2012-03-06 2021-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Wellenlängenkonversionselement, Licht emittierendes Halbleiterbauelement und Anzeigevorrichtung damit sowie Verfahren zur Herstellung eines Wellenlängenkonversionselements
KR101977278B1 (ko) * 2012-10-29 2019-09-10 엘지이노텍 주식회사 발광 소자
DE202013012118U1 (de) * 2013-05-31 2015-04-29 Jenoptik Polymer Systems Gmbh Substrat und/oder Bauteil zum Schutz von mindestens einem Bonddraht
JP6098439B2 (ja) * 2013-08-28 2017-03-22 日亜化学工業株式会社 波長変換部材、発光装置、及び発光装置の製造方法
DE102017119346A1 (de) * 2017-08-24 2019-02-28 Osram Opto Semiconductors Gmbh Bauteil mit Pufferschicht und Verfahren zur Herstellung eines Bauteils
US10771155B2 (en) * 2017-09-28 2020-09-08 Soraa Laser Diode, Inc. Intelligent visible light with a gallium and nitrogen containing laser source
DE112020000921A5 (de) * 2019-02-25 2021-11-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Kontrollierte benetzung bei der herstellung von elektronischen bauteilen
CN112034442A (zh) * 2020-07-15 2020-12-04 深圳市聚飞光电股份有限公司 一种传感器及其制作方法
DE102022101910A1 (de) * 2022-01-27 2023-07-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauteil, konversionselement und herstellungsverfahren

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Publication number Priority date Publication date Assignee Title
JPS63164482A (ja) 1986-12-26 1988-07-07 Res Dev Corp Of Japan 発光ダイオ−ド装置
US5149958A (en) 1990-12-12 1992-09-22 Eastman Kodak Company Optoelectronic device component package
JPH0832118A (ja) * 1994-07-19 1996-02-02 Rohm Co Ltd 発光ダイオード
JP3487524B2 (ja) * 1994-12-20 2004-01-19 株式会社ルネサステクノロジ 半導体装置及びその製造方法
DE19527026C2 (de) 1995-07-24 1997-12-18 Siemens Ag Optoelektronischer Wandler und Herstellverfahren
DE29724582U1 (de) * 1996-06-26 2002-07-04 OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
JP3965767B2 (ja) * 1998-04-06 2007-08-29 株式会社デンソー 半導体チップの基板実装構造
TW406442B (en) 1998-07-09 2000-09-21 Sumitomo Electric Industries White colored LED and intermediate colored LED
JP3132478B2 (ja) * 1998-08-20 2001-02-05 日本電気株式会社 半導体装置およびその製造方法
CA2312646A1 (en) 2000-06-28 2001-12-28 Institut National D'optique Hybrid micropackaging of microdevices
JP4055405B2 (ja) 2001-12-03 2008-03-05 ソニー株式会社 電子部品及びその製造方法
US20030141563A1 (en) * 2002-01-28 2003-07-31 Bily Wang Light emitting diode package with fluorescent cover
JP3986327B2 (ja) * 2002-03-01 2007-10-03 シチズン電子株式会社 発光装置の製造方法
US20040032728A1 (en) * 2002-08-19 2004-02-19 Robert Galli Optical assembly for LED chip package
US7078737B2 (en) 2002-09-02 2006-07-18 Matsushita Electric Industrial Co., Ltd. Light-emitting device
JP3782411B2 (ja) * 2002-09-02 2006-06-07 松下電器産業株式会社 発光装置
JP2004128057A (ja) 2002-09-30 2004-04-22 Fuji Photo Film Co Ltd 発光装置およびその製造方法
US6885033B2 (en) 2003-03-10 2005-04-26 Cree, Inc. Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same
JP2004342870A (ja) 2003-05-16 2004-12-02 Stanley Electric Co Ltd 大電流駆動用発光ダイオード
KR20050034936A (ko) 2003-10-10 2005-04-15 삼성전기주식회사 형광체를 이용한 파장변환형 발광 다이오드 패키지 및제조방법
KR100613273B1 (ko) 2003-12-30 2006-08-18 주식회사 이츠웰 발광 다이오드 및 그 제조 방법
US7355284B2 (en) 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
KR100662844B1 (ko) * 2005-06-10 2007-01-02 삼성전자주식회사 Ｌｅｄ 패키지 및 그 제조방법과 이를 이용한 ｌｅｄ어레이 모듈

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