TW201426053A - 光電轉換模組 - Google Patents

光電轉換模組 Download PDF

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Publication number
TW201426053A
TW201426053A TW101150701A TW101150701A TW201426053A TW 201426053 A TW201426053 A TW 201426053A TW 101150701 A TW101150701 A TW 101150701A TW 101150701 A TW101150701 A TW 101150701A TW 201426053 A TW201426053 A TW 201426053A
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TW
Taiwan
Prior art keywords
lens
unit
conversion module
photoelectric conversion
circuit board
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TW101150701A
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English (en)
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TWI561873B (en
Inventor
Yi-Zhong Sheu
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Hon Hai Prec Ind Co Ltd
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Publication date
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Priority to TW101150701A priority Critical patent/TWI561873B/zh
Priority to US13/968,419 priority patent/US20140183331A1/en
Publication of TW201426053A publication Critical patent/TW201426053A/zh
Application granted granted Critical
Publication of TWI561873B publication Critical patent/TWI561873B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/0204—Compact construction
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)

Abstract

一種光電轉換模組，包括透鏡單元、電路板和光電單元，所述透鏡單元固設於所述電路板上，所述光電單元電性設置於所述電路板上，所述電路板上具有凹槽，所述光電單元位於所述凹槽內。

Description

光電轉換模組
本發明涉及一種光電轉換模組。
光電轉換模組一般包括透鏡單元、光電單元（包括發光二級管和光電檢測器）和電路板，透鏡單元上會設計凹槽結構，從而使透鏡單元與電路板之間具有一個容置空間以容納光電單元，如此結構，使得透鏡單元的整體厚度較大，進而使光電轉換模組的厚度較大。
有鑒於此，有必要提供一種厚度較小的光電轉換模組。
一種光電轉換模組，包括透鏡單元、電路板和光電單元，所述透鏡單元固設於所述電路板上，所述光電單元電性設置於所述電路板上，所述電路板上具有凹槽，所述光電單元位於所述凹槽內。
相較於先前技術，本實施例的光電轉換模組由於在電路板上設置凹槽，光電單元設置於凹槽內，如此設計，透鏡單元的厚度較小，進而使光電轉換模組的整體厚度較小。
下面將結合附圖對本發明實施例作進一步詳細說明。
請參閱圖1，本發明實施例提供的光電轉換模組10包括透鏡單元11、電路板12、發光二極體13、光電檢測器13’和芯片單元14，發光二極體13和光電檢測器13’合稱光電單元。
透鏡單元11可藉由膠水固設於電路板12上，透鏡單元11包括第一透鏡110、第二透鏡111和反射面112。第一透鏡110的個數與第二透鏡111的個數相等，且第一透鏡110的個數等於發光二極體13和光電檢測器13’的個數之和。第一透鏡110的光軸基本平行電路板12，第二透鏡111的光軸垂直電路板12，反射面112凹設於透鏡單元11上且與第一透鏡110的光軸以及第二透鏡111的光軸之間均具有45度的夾角。
電路板12上具有凹槽120，發光二極體13、光電檢測器13’和芯片單元14電性設置於電路板12的凹槽120內，凹槽120的大小和形狀能夠佈設發光二極體13、光電檢測器13’和芯片單元14即可。
芯片單元14均與發光二極體13、光電檢測器13’相連以控制發光二極體13的發光強度、頻率等以及處理光電檢測器13’接收到的光訊號。
電路板12以陶瓷板更為適當，因陶瓷基板的硬度及散熱較好，當然，也可以由其他材料製成。
發光二極體13發出的光線經第二透鏡111入射到反射面112上，光線被反射面112反射後經第一透鏡110從透鏡單元11出射；從第一透鏡110進入透鏡單元11的光線入射至反射面112上，經反射面112反射後穿過第二透鏡111被設置於電路板12上的光電檢測器13’所接收。
本實施例的光電轉換模組10由於在電路板12上設置凹槽120，光電單元設置於凹槽120內，如此設計，透鏡單元11的厚度較小，進而使光電轉換模組10的整體厚度較小。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
10．．．光電轉換模組
11．．．透鏡單元
110．．．第一透鏡
111．．．第二透鏡
112．．．反射面
12．．．電路板
120．．．凹槽
13．．．發光二極體
13’．．．光電檢測器
14．．．芯片單元
圖1是本發明實施例光電轉換模組的示意圖。
10．．．光電轉換模組
11．．．透鏡單元
110．．．第一透鏡
111．．．第二透鏡
112．．．反射面
12．．．電路板
120．．．凹槽
13．．．發光二極體
13’．．．光電檢測器
14．．．芯片單元

Claims (6)

  1. 一種光電轉換模組，包括透鏡單元、電路板和光電單元，所述透鏡單元固設於所述電路板上，所述光電單元電性設置於所述電路板上，其改良在於，所述電路板上具有凹槽，所述光電單元位於所述凹槽內。
  2. 如請求項1所述的光電轉換模組，其中，所述透鏡單元包括第一透鏡、第二透鏡和反射面，從所述第一透鏡出射的光線經所述反射面反射後入射至所述第二透鏡，從所述第二透鏡出射的光纖經所述反射面反射後入射至所述第一透鏡。
  3. 如請求項2所述的光電在轉換模組，其中，所述第一透鏡的光軸垂直所述第二透鏡的光軸，所述反射面與所述第一透鏡的光軸和所述第二透鏡的光軸之間均具有45度的夾角。
  4. 如請求項1所述的光電轉換模組，其中，所述電路板由陶瓷材料製成。
  5. 如請求項1所述的光電轉換模組，其中，所述光電單元包括發光二極體和光電檢測器。
  6. 如請求項1-5任一所述的光電轉換模組，其中，所述光電轉換模組進一步包括與所述光電單元相連的芯片單元，所述芯片單元位於所述凹槽內。
TW101150701A 2012-12-27 2012-12-27 Optical to electrical coverter TWI561873B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101150701A TWI561873B (en) 2012-12-27 2012-12-27 Optical to electrical coverter
US13/968,419 US20140183331A1 (en) 2012-12-27 2013-08-15 Photoelectric conversion module

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Application Number Priority Date Filing Date Title
TW101150701A TWI561873B (en) 2012-12-27 2012-12-27 Optical to electrical coverter

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TW201426053A true TW201426053A (zh) 2014-07-01
TWI561873B TWI561873B (en) 2016-12-11

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Publication number Priority date Publication date Assignee Title
TWI572922B (zh) * 2013-01-31 2017-03-01 鴻海精密工業股份有限公司 光纖連接器
JP2015064413A (ja) * 2013-09-24 2015-04-09 富士通株式会社 光半導体素子とその製造方法
CN110611754A (zh) * 2018-06-15 2019-12-24 三赢科技（深圳）有限公司 摄像头模组

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Publication number Priority date Publication date Assignee Title
US6939058B2 (en) * 2002-02-12 2005-09-06 Microalign Technologies, Inc. Optical module for high-speed bidirectional transceiver
KR100810284B1 (ko) * 2006-09-28 2008-03-06 삼성전자주식회사 카메라 모듈과 그 제조 방법
US20100096553A1 (en) * 2008-10-22 2010-04-22 Honeywell International Inc. Reflective optical sensor and switches and systems therefrom
US8335411B2 (en) * 2008-11-11 2012-12-18 Ultra Communications, Inc. Fiber optic bi-directional coupling lens
CN202434505U (zh) * 2012-01-18 2012-09-12 青岛海信宽带多媒体技术有限公司 光电芯片组件

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US20140183331A1 (en) 2014-07-03

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