JP2006074036A - 半導体発光装置およびその製作方法 - Google Patents

半導体発光装置およびその製作方法 Download PDF

Info

Publication number
JP2006074036A
JP2006074036A JP2005241441A JP2005241441A JP2006074036A JP 2006074036 A JP2006074036 A JP 2006074036A JP 2005241441 A JP2005241441 A JP 2005241441A JP 2005241441 A JP2005241441 A JP 2005241441A JP 2006074036 A JP2006074036 A JP 2006074036A
Authority
JP
Japan
Prior art keywords
semiconductor light
light emitting
emitting device
phosphor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005241441A
Other languages
English (en)
Japanese (ja)
Inventor
Meikun Sha
明勳 謝
Chia-Fen Tsai
嘉芬 蔡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epistar Corp
Original Assignee
Epistar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epistar Corp filed Critical Epistar Corp
Publication of JP2006074036A publication Critical patent/JP2006074036A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/508Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005241441A 2004-09-01 2005-08-23 半導体発光装置およびその製作方法 Pending JP2006074036A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093126439A TWI241728B (en) 2004-09-01 2004-09-01 Semiconductor light-emitting device and production method thereof

Publications (1)

Publication Number Publication Date
JP2006074036A true JP2006074036A (ja) 2006-03-16

Family

ID=35745894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005241441A Pending JP2006074036A (ja) 2004-09-01 2005-08-23 半導体発光装置およびその製作方法

Country Status (4)

Country Link
JP (1) JP2006074036A (ko)
KR (1) KR101068649B1 (ko)
DE (1) DE102005040522B4 (ko)
TW (1) TWI241728B (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010054695A (ja) * 2008-08-27 2010-03-11 National Institute Of Advanced Industrial Science & Technology 光デバイスの製造方法
WO2010125792A1 (ja) * 2009-05-01 2010-11-04 昭和電工株式会社 発光ダイオード及びその製造方法、並びに発光ダイオードランプ
JP2012069977A (ja) * 2011-11-08 2012-04-05 Citizen Electronics Co Ltd 発光装置及び発光装置の製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006026481A1 (de) 2006-06-07 2007-12-13 Siemens Ag Verfahren zum Anordnen einer Pulverschicht auf einem Substrat sowie Schichtaufbau mit mindestens einer Pulverschicht auf einem Substrat
KR100757800B1 (ko) * 2006-06-30 2007-09-11 서울옵토디바이스주식회사 절연보호막을 갖는 교류용 발광 다이오드 및 그것을제조하는 방법
DE102006051746A1 (de) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einer Lumineszenzkonversionsschicht
DE102006061175A1 (de) * 2006-12-22 2008-06-26 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren
KR101420214B1 (ko) * 2008-01-21 2014-07-17 엘지이노텍 주식회사 질화물계 발광 소자
WO2010143114A1 (en) * 2009-06-11 2010-12-16 Koninklijke Philips Electronics N.V. Led illumination device
DE102010046966B4 (de) 2010-09-29 2018-05-24 Infineon Technologies Ag Baustein und Verfahren zur Herstellung eines Bausteins
TWI470838B (zh) * 2012-05-25 2015-01-21 Phostek Inc 半導體發光裝置的形成方法

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6173100A (ja) * 1984-09-18 1986-04-15 コニカ株式会社 放射線画像情報読取装置
JPH09260060A (ja) * 1996-03-25 1997-10-03 Uchitsugu Minami エレクトロルミネッセンス素子及びその製造法
JPH1140858A (ja) * 1997-07-17 1999-02-12 Nichia Chem Ind Ltd 発光ダイオード及びその形成方法
JPH1187778A (ja) * 1997-09-02 1999-03-30 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
JP2002016284A (ja) * 2000-06-29 2002-01-18 Toshiba Corp 窒化ガリウム系半導体発光素子の製造方法
JP2002151747A (ja) * 2001-09-03 2002-05-24 Nichia Chem Ind Ltd 発光ダイオード及びその形成方法
WO2003065464A1 (fr) * 2002-01-28 2003-08-07 Nichia Corporation Dispositif a semi-conducteur a base de nitrure comprenant un substrat de support, et son procede de realisation
JP2003243727A (ja) * 2001-12-14 2003-08-29 Nichia Chem Ind Ltd 発光装置
JP2004006986A (ja) * 1993-03-19 2004-01-08 Lumileds Lighting Us Llc 発光ダイオード層と接合されたウェーハとの間の反射性境界面
JP2004031669A (ja) * 2002-06-26 2004-01-29 Seiko Epson Corp 半導体素子部材及び半導体装置並びにそれらの製造方法、電気光学装置、電子機器
JP2004140007A (ja) * 2002-10-15 2004-05-13 Ricoh Co Ltd 面発光レーザ及び面発光レーザアレイ及び光送信モジュール及び光送受信モジュール及び光通信システム及びレーザプリンター及び光ピックアップシステム
JP2004158823A (ja) * 2002-07-15 2004-06-03 Shogen Koden Kofun Yugenkoshi 接着層を有する発光ダイオード及びその製造方法
JP2004207576A (ja) * 2002-12-26 2004-07-22 Toshiba Lighting & Technology Corp 発光ダイオードランプ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6340824B1 (en) 1997-09-01 2002-01-22 Kabushiki Kaisha Toshiba Semiconductor light emitting device including a fluorescent material
JP4770058B2 (ja) 2000-05-17 2011-09-07 日亜化学工業株式会社 発光素子及び装置
US6650044B1 (en) * 2000-10-13 2003-11-18 Lumileds Lighting U.S., Llc Stenciling phosphor layers on light emitting diodes
JP5110744B2 (ja) 2000-12-21 2012-12-26 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 発光装置及びその製造方法
US6642652B2 (en) 2001-06-11 2003-11-04 Lumileds Lighting U.S., Llc Phosphor-converted light emitting device

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6173100A (ja) * 1984-09-18 1986-04-15 コニカ株式会社 放射線画像情報読取装置
JP2004006986A (ja) * 1993-03-19 2004-01-08 Lumileds Lighting Us Llc 発光ダイオード層と接合されたウェーハとの間の反射性境界面
JPH09260060A (ja) * 1996-03-25 1997-10-03 Uchitsugu Minami エレクトロルミネッセンス素子及びその製造法
JPH1140858A (ja) * 1997-07-17 1999-02-12 Nichia Chem Ind Ltd 発光ダイオード及びその形成方法
JPH1187778A (ja) * 1997-09-02 1999-03-30 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
JP2002016284A (ja) * 2000-06-29 2002-01-18 Toshiba Corp 窒化ガリウム系半導体発光素子の製造方法
JP2002151747A (ja) * 2001-09-03 2002-05-24 Nichia Chem Ind Ltd 発光ダイオード及びその形成方法
JP2003243727A (ja) * 2001-12-14 2003-08-29 Nichia Chem Ind Ltd 発光装置
WO2003065464A1 (fr) * 2002-01-28 2003-08-07 Nichia Corporation Dispositif a semi-conducteur a base de nitrure comprenant un substrat de support, et son procede de realisation
JP2004031669A (ja) * 2002-06-26 2004-01-29 Seiko Epson Corp 半導体素子部材及び半導体装置並びにそれらの製造方法、電気光学装置、電子機器
JP2004158823A (ja) * 2002-07-15 2004-06-03 Shogen Koden Kofun Yugenkoshi 接着層を有する発光ダイオード及びその製造方法
JP2004140007A (ja) * 2002-10-15 2004-05-13 Ricoh Co Ltd 面発光レーザ及び面発光レーザアレイ及び光送信モジュール及び光送受信モジュール及び光通信システム及びレーザプリンター及び光ピックアップシステム
JP2004207576A (ja) * 2002-12-26 2004-07-22 Toshiba Lighting & Technology Corp 発光ダイオードランプ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010054695A (ja) * 2008-08-27 2010-03-11 National Institute Of Advanced Industrial Science & Technology 光デバイスの製造方法
WO2010125792A1 (ja) * 2009-05-01 2010-11-04 昭和電工株式会社 発光ダイオード及びその製造方法、並びに発光ダイオードランプ
JP2010263050A (ja) * 2009-05-01 2010-11-18 Showa Denko Kk 発光ダイオード及びその製造方法、並びに発光ダイオードランプ
JP2012069977A (ja) * 2011-11-08 2012-04-05 Citizen Electronics Co Ltd 発光装置及び発光装置の製造方法

Also Published As

Publication number Publication date
KR101068649B1 (ko) 2011-09-28
DE102005040522B4 (de) 2022-03-03
TW200610174A (en) 2006-03-16
DE102005040522A1 (de) 2006-03-02
KR20060048984A (ko) 2006-05-18
TWI241728B (en) 2005-10-11

Similar Documents

Publication Publication Date Title
TWI813171B (zh) 發光元件
JP6519311B2 (ja) 発光装置
US9627577B2 (en) Semiconductor light-emitting device and method for forming the same
JP2006074036A (ja) 半導体発光装置およびその製作方法
JP5634003B2 (ja) 発光装置
JP6438648B2 (ja) 半導体発光装置およびその製造方法
JP6056150B2 (ja) 半導体発光素子
JP5521325B2 (ja) 発光装置及びその製造方法
JP6331389B2 (ja) 発光装置
JP2021500735A (ja) 発光素子パッケージ及びこれを含む照明装置
JP7182782B2 (ja) 発光素子パッケージ及び光源装置
TWI404228B (zh) 半導體發光裝置與其製造方法
JP2015028997A (ja) 発光装置及びその製造方法
JP6964345B2 (ja) 発光素子パッケージ及び光源装置
JP2008277592A (ja) 窒化物半導体発光素子、これを備える発光装置及び窒化物半導体発光素子の製造方法
JP7252597B2 (ja) 発光素子パッケージ
US9601668B2 (en) Light emitting device
CN109285932A (zh) 发光器件封装
JP2019021919A (ja) 発光素子パッケージ
CN109244224A (zh) 发光器件封装
US9812620B2 (en) Light emitting device and method of manufacturing the light emitting device
US10982823B2 (en) Automotive led light source with glass lens over a glass converter plate containing phosphor
US11342486B2 (en) Light-emitting device package and lighting device having same
JP2020533778A (ja) 発光素子パッケージ
JP6661964B2 (ja) 発光装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080711

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110516

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110524

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110823

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110913

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111212

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120214

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120613

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20120620

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20120810

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130606

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130611