JP2006074036A - 半導体発光装置およびその製作方法 - Google Patents
半導体発光装置およびその製作方法 Download PDFInfo
- Publication number
- JP2006074036A JP2006074036A JP2005241441A JP2005241441A JP2006074036A JP 2006074036 A JP2006074036 A JP 2006074036A JP 2005241441 A JP2005241441 A JP 2005241441A JP 2005241441 A JP2005241441 A JP 2005241441A JP 2006074036 A JP2006074036 A JP 2006074036A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor light
- light emitting
- emitting device
- phosphor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 142
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 74
- 239000000463 material Substances 0.000 claims abstract description 23
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 74
- 239000010410 layer Substances 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 239000011230 binding agent Substances 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 5
- 229910004205 SiNX Inorganic materials 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 2
- 239000004713 Cyclic olefin copolymer Substances 0.000 claims description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- BEQNOZDXPONEMR-UHFFFAOYSA-N cadmium;oxotin Chemical compound [Cd].[Sn]=O BEQNOZDXPONEMR-UHFFFAOYSA-N 0.000 claims description 2
- 229920002313 fluoropolymer Polymers 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 238000005304 joining Methods 0.000 claims description 2
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 claims description 2
- 239000012994 photoredox catalyst Substances 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000002845 discoloration Methods 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910020658 PbSn Inorganic materials 0.000 description 1
- 101150071746 Pbsn gene Proteins 0.000 description 1
- 241000227425 Pieris rapae crucivora Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093126439A TWI241728B (en) | 2004-09-01 | 2004-09-01 | Semiconductor light-emitting device and production method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006074036A true JP2006074036A (ja) | 2006-03-16 |
Family
ID=35745894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005241441A Pending JP2006074036A (ja) | 2004-09-01 | 2005-08-23 | 半導体発光装置およびその製作方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2006074036A (ko) |
KR (1) | KR101068649B1 (ko) |
DE (1) | DE102005040522B4 (ko) |
TW (1) | TWI241728B (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010054695A (ja) * | 2008-08-27 | 2010-03-11 | National Institute Of Advanced Industrial Science & Technology | 光デバイスの製造方法 |
WO2010125792A1 (ja) * | 2009-05-01 | 2010-11-04 | 昭和電工株式会社 | 発光ダイオード及びその製造方法、並びに発光ダイオードランプ |
JP2012069977A (ja) * | 2011-11-08 | 2012-04-05 | Citizen Electronics Co Ltd | 発光装置及び発光装置の製造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006026481A1 (de) | 2006-06-07 | 2007-12-13 | Siemens Ag | Verfahren zum Anordnen einer Pulverschicht auf einem Substrat sowie Schichtaufbau mit mindestens einer Pulverschicht auf einem Substrat |
KR100757800B1 (ko) * | 2006-06-30 | 2007-09-11 | 서울옵토디바이스주식회사 | 절연보호막을 갖는 교류용 발광 다이오드 및 그것을제조하는 방법 |
DE102006051746A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer Lumineszenzkonversionsschicht |
DE102006061175A1 (de) * | 2006-12-22 | 2008-06-26 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren |
KR101420214B1 (ko) * | 2008-01-21 | 2014-07-17 | 엘지이노텍 주식회사 | 질화물계 발광 소자 |
WO2010143114A1 (en) * | 2009-06-11 | 2010-12-16 | Koninklijke Philips Electronics N.V. | Led illumination device |
DE102010046966B4 (de) | 2010-09-29 | 2018-05-24 | Infineon Technologies Ag | Baustein und Verfahren zur Herstellung eines Bausteins |
TWI470838B (zh) * | 2012-05-25 | 2015-01-21 | Phostek Inc | 半導體發光裝置的形成方法 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6173100A (ja) * | 1984-09-18 | 1986-04-15 | コニカ株式会社 | 放射線画像情報読取装置 |
JPH09260060A (ja) * | 1996-03-25 | 1997-10-03 | Uchitsugu Minami | エレクトロルミネッセンス素子及びその製造法 |
JPH1140858A (ja) * | 1997-07-17 | 1999-02-12 | Nichia Chem Ind Ltd | 発光ダイオード及びその形成方法 |
JPH1187778A (ja) * | 1997-09-02 | 1999-03-30 | Toshiba Corp | 半導体発光素子、半導体発光装置およびその製造方法 |
JP2002016284A (ja) * | 2000-06-29 | 2002-01-18 | Toshiba Corp | 窒化ガリウム系半導体発光素子の製造方法 |
JP2002151747A (ja) * | 2001-09-03 | 2002-05-24 | Nichia Chem Ind Ltd | 発光ダイオード及びその形成方法 |
WO2003065464A1 (fr) * | 2002-01-28 | 2003-08-07 | Nichia Corporation | Dispositif a semi-conducteur a base de nitrure comprenant un substrat de support, et son procede de realisation |
JP2003243727A (ja) * | 2001-12-14 | 2003-08-29 | Nichia Chem Ind Ltd | 発光装置 |
JP2004006986A (ja) * | 1993-03-19 | 2004-01-08 | Lumileds Lighting Us Llc | 発光ダイオード層と接合されたウェーハとの間の反射性境界面 |
JP2004031669A (ja) * | 2002-06-26 | 2004-01-29 | Seiko Epson Corp | 半導体素子部材及び半導体装置並びにそれらの製造方法、電気光学装置、電子機器 |
JP2004140007A (ja) * | 2002-10-15 | 2004-05-13 | Ricoh Co Ltd | 面発光レーザ及び面発光レーザアレイ及び光送信モジュール及び光送受信モジュール及び光通信システム及びレーザプリンター及び光ピックアップシステム |
JP2004158823A (ja) * | 2002-07-15 | 2004-06-03 | Shogen Koden Kofun Yugenkoshi | 接着層を有する発光ダイオード及びその製造方法 |
JP2004207576A (ja) * | 2002-12-26 | 2004-07-22 | Toshiba Lighting & Technology Corp | 発光ダイオードランプ |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6340824B1 (en) | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
JP4770058B2 (ja) | 2000-05-17 | 2011-09-07 | 日亜化学工業株式会社 | 発光素子及び装置 |
US6650044B1 (en) * | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
JP5110744B2 (ja) | 2000-12-21 | 2012-12-26 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 発光装置及びその製造方法 |
US6642652B2 (en) | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
-
2004
- 2004-09-01 TW TW093126439A patent/TWI241728B/zh active
-
2005
- 2005-07-30 KR KR1020050069967A patent/KR101068649B1/ko active IP Right Grant
- 2005-08-23 JP JP2005241441A patent/JP2006074036A/ja active Pending
- 2005-08-26 DE DE102005040522.3A patent/DE102005040522B4/de active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6173100A (ja) * | 1984-09-18 | 1986-04-15 | コニカ株式会社 | 放射線画像情報読取装置 |
JP2004006986A (ja) * | 1993-03-19 | 2004-01-08 | Lumileds Lighting Us Llc | 発光ダイオード層と接合されたウェーハとの間の反射性境界面 |
JPH09260060A (ja) * | 1996-03-25 | 1997-10-03 | Uchitsugu Minami | エレクトロルミネッセンス素子及びその製造法 |
JPH1140858A (ja) * | 1997-07-17 | 1999-02-12 | Nichia Chem Ind Ltd | 発光ダイオード及びその形成方法 |
JPH1187778A (ja) * | 1997-09-02 | 1999-03-30 | Toshiba Corp | 半導体発光素子、半導体発光装置およびその製造方法 |
JP2002016284A (ja) * | 2000-06-29 | 2002-01-18 | Toshiba Corp | 窒化ガリウム系半導体発光素子の製造方法 |
JP2002151747A (ja) * | 2001-09-03 | 2002-05-24 | Nichia Chem Ind Ltd | 発光ダイオード及びその形成方法 |
JP2003243727A (ja) * | 2001-12-14 | 2003-08-29 | Nichia Chem Ind Ltd | 発光装置 |
WO2003065464A1 (fr) * | 2002-01-28 | 2003-08-07 | Nichia Corporation | Dispositif a semi-conducteur a base de nitrure comprenant un substrat de support, et son procede de realisation |
JP2004031669A (ja) * | 2002-06-26 | 2004-01-29 | Seiko Epson Corp | 半導体素子部材及び半導体装置並びにそれらの製造方法、電気光学装置、電子機器 |
JP2004158823A (ja) * | 2002-07-15 | 2004-06-03 | Shogen Koden Kofun Yugenkoshi | 接着層を有する発光ダイオード及びその製造方法 |
JP2004140007A (ja) * | 2002-10-15 | 2004-05-13 | Ricoh Co Ltd | 面発光レーザ及び面発光レーザアレイ及び光送信モジュール及び光送受信モジュール及び光通信システム及びレーザプリンター及び光ピックアップシステム |
JP2004207576A (ja) * | 2002-12-26 | 2004-07-22 | Toshiba Lighting & Technology Corp | 発光ダイオードランプ |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010054695A (ja) * | 2008-08-27 | 2010-03-11 | National Institute Of Advanced Industrial Science & Technology | 光デバイスの製造方法 |
WO2010125792A1 (ja) * | 2009-05-01 | 2010-11-04 | 昭和電工株式会社 | 発光ダイオード及びその製造方法、並びに発光ダイオードランプ |
JP2010263050A (ja) * | 2009-05-01 | 2010-11-18 | Showa Denko Kk | 発光ダイオード及びその製造方法、並びに発光ダイオードランプ |
JP2012069977A (ja) * | 2011-11-08 | 2012-04-05 | Citizen Electronics Co Ltd | 発光装置及び発光装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101068649B1 (ko) | 2011-09-28 |
DE102005040522B4 (de) | 2022-03-03 |
TW200610174A (en) | 2006-03-16 |
DE102005040522A1 (de) | 2006-03-02 |
KR20060048984A (ko) | 2006-05-18 |
TWI241728B (en) | 2005-10-11 |
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