JP2006024877A - ボンディングパッドとチップ構造 - Google Patents
ボンディングパッドとチップ構造 Download PDFInfo
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- 238000004544 sputter deposition Methods 0.000 description 8
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- 229910052782 aluminium Inorganic materials 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
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- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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Abstract
【解決手段】
チップ構造はチップと少なくとも一つのボンディングパッドで構成する。チップはアクティブ面を有する。ボンディングパッドはチップのアクティブ面上に配置される。ボンディングパッドは多角形本体および複数の第一突出部で構成する。多角形本体は第一平面および対応する第二平面を有する。多角形本体の第二平面はチップと接触する。第一突出部分は、多角形本体のコーナー領域で第一平面上に配置される。ボンディングパッドの形状を適正化することにより、ボンディングパッドでチップ構造と別のデバイスを接続するときの歩留まりが向上する。
【選択図】 図3
Description
添付の図面は本発明をより理解するためのものであり、この明細書に組み込まれ、その一部を構成している。図面は本発明の実施例を示しており、詳細な説明と共に本発明の原理を説明する。
120 チップ
122 アクティブ面
140 ボンディングパッド
160 保護膜層
180 バンプ
300 チップ構造
320 チップ
322 アクティブ面
340 ボンディングパッド
342 多角形体
342a 第一平面
342b 第二平面
344 第一突出部
346 第二突出部
346a 円形状
346b 円リング形状
346c 多角形状
346d 多角リング形状
346e 十字線形状
350 接着層
360 保護膜層
380 バンプ
620 マスク
622 中空部分
640 ターゲット材料ボード
Claims (10)
- 第一面および対応する第二面を有し、チップ上に配置されて前記第二面がチップと接触している本体、および
本体のコーナー領域で第一面上に配置された少なくとも一つの第一突出部
を有することを特徴とするチップ配置用のボンディングパッド。 - 本体の中央領域で第一面に配置した第二突出部を有することを特徴とする請求項1に記載のボンディングパッド。
- 第二突出部が第一突出部と繋がっていることを特徴とする請求項2に記載のボンディングパッド。
- 上方から第一平面を見たときの第二突出部の形状が、十字線形状、円形状、円リング形状、楕円形状、楕円リング形状、多角形状、多角リング形状、直線的形状、幾何学的形状、それらのいずれかを組み合わせた形状からなるグループから選ぶことを特徴とする請求項2に記載のボンディングパッド。
- アクティブ面を有するチップ、および
第一面および対応する第二面を有しチップ上に配置された本体であってその第二面がチップと接触している本体、および本体のコーナー領域で第一面上に配置された少なくとも一つの第一突出部を有し、チップのアクティブ面上に配置された少なくとも一つのボンディングパッド
を有するチップ構造。 - ボンディングパッドが本体の中央領域で第一面に配置された第二突出部を有することを特徴とする請求項5に記載のチップ構造。
- 第二突出部が第一突出部と繋がっていることを特徴とする請求項6に記載のチップ構造。
- 上方から第一平面を見たときの第二突出部の形状が、十字線形状、円形状、円リング形状、楕円形状、楕円リング形状、多角形状、多角リング形状、直線的形状、幾何学的形状、それらのいずれかを組み合わせた形状からなるグループから選ばれることを特徴とする請求項6に記載のチップ構造。
- チップのアクティブ面上に配置され、ボンディングパッドの中央領域を露出させたままでボンディングパッドの周辺領域をカバーする保護膜層を有していることを特徴とする請求項5に記載のチップ構造。
- ボンディングパッド上に配置され、それと電気的に繋がっている少なくとも一つのバンプを有することを特徴とする請求項5に記載のチップ構造。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093120184A TWI237886B (en) | 2004-07-06 | 2004-07-06 | Bonding pad and chip structure |
Publications (1)
Publication Number | Publication Date |
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JP2006024877A true JP2006024877A (ja) | 2006-01-26 |
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Application Number | Title | Priority Date | Filing Date |
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JP2004295273A Pending JP2006024877A (ja) | 2004-07-06 | 2004-10-07 | ボンディングパッドとチップ構造 |
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Country | Link |
---|---|
US (1) | US7064449B2 (ja) |
JP (1) | JP2006024877A (ja) |
KR (1) | KR20060003801A (ja) |
TW (1) | TWI237886B (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI238513B (en) | 2003-03-04 | 2005-08-21 | Rohm & Haas Elect Mat | Coaxial waveguide microstructures and methods of formation thereof |
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- 2004-10-07 JP JP2004295273A patent/JP2006024877A/ja active Pending
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Also Published As
Publication number | Publication date |
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KR20060003801A (ko) | 2006-01-11 |
TWI237886B (en) | 2005-08-11 |
US20060006531A1 (en) | 2006-01-12 |
US7064449B2 (en) | 2006-06-20 |
TW200603364A (en) | 2006-01-16 |
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