JP2006004988A - 回路モジュールおよび回路モジュールの製造方法 - Google Patents
回路モジュールおよび回路モジュールの製造方法 Download PDFInfo
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Abstract
【解決手段】本発明は、半導体チップ100や部品110を、熱可塑性樹脂からなるシートに埋め込んで部品内蔵シート120を形成し、表面に配線パターン130を施した複数の回路ブロックを備えたモジュールシートを回路ブロックの境界で折り畳んで積層し、加熱加圧により溶融し一体化させた積層構造の回路モジュールおよびその製造方法を提供する。これにより、簡単な製造方法で信頼性の高い回路モジュールを作製できる。
【選択図】図1
Description
図1は、本発明の第1の実施の形態に係る回路モジュールの概略構成の一例を示す断面図である。
図6は、本発明の第2の実施の形態に係る回路モジュールの概略構成を示す断面図である。
図8は、本発明の第3の実施の形態に係る回路モジュールの概略構成を示す断面図である。
110 部品
120 部品内蔵シート
130 配線パターン
140 (半導体チップの)バンプ
150 (部品の)突起状電極
160 支持棒
170 第1の被覆シート
180 第2の被覆シート
190 折り畳み部
200 モジュールシート
210 接続電極
220 接続
230 貫通スルーホール
240 導電性部材
300 回路ブロック
310 境界部
900 開口部
Claims (13)
- 電子部品を埋設した部品内蔵シートを重ね合わせることによって積層化した回路モジュールにおいて、
前記電子部品の突起状電極が露出するように埋め込まれた回路ブロックを複数有する前記部品内蔵シートと、
前記部品内蔵シートの前記突起状電極と接続される配線パターンと、
前記配線パターンを被覆する被覆シートとを備え、
前記回路ブロックを、前記回路ブロックの境界に沿って折り畳んで積層し、前記部品内蔵シートおよび前記被覆シートを融着して一体化することを特徴とする回路モジュール。 - 前記配線パターンと電気的に接続されるシート状の受動素子を搭載することを特徴とする請求項1に記載の回路モジュール。
- 前記部品内蔵シート、前記被覆シートが熱可塑性樹脂からなることを特徴とする請求項1または請求項2に記載の回路モジュール。
- 積層した前記部品内蔵シートの前記回路ブロック間が、折り畳み部に施された前記配線パターンによって接続されることを特徴とする請求項1から請求項3までのいずれかに記載の回路モジュール。
- 積層した前記部品内蔵シートの前記回路ブロック間の前記配線パターンが、前記回路ブロック間を貫通するスルーホールによって電気的に接続されることを特徴とする請求項1から請求項3までのいずれかに記載の回路モジュール。
- 前記部品内蔵シートの前記回路ブロック毎に埋め込まれた導電性部材によって、前記配線パターン間が電気的に接続されることを特徴とする請求項1から請求項3までのいずれかに記載の回路モジュール。
- 積層した前記部品内蔵シートの最外層上の配線パターンに外部回路と接続するための接続電極を設けたことを特徴とする請求項1から請求項6までのいずれかに記載の回路モジュール。
- 電子部品を埋設した部品内蔵シートを重ね合わせることによって積層化した回路モジュールにおいて、
前記電子部品の突起状電極が露出するように埋め込まれた回路ブロックを複数有する前記部品内蔵シートと、
前記部品内蔵シートの前記突起状電極と接続される配線パターンと、
前記配線パターンを被覆する被覆シートとを備え、
前記部品内蔵シートを、前記回路ブロックの境界で折り畳むことにより積層する工程と、
積層された前記部品内蔵シートおよび前記被覆シートを熱プレスして互いに融着させて一体化する工程とを
含むことを特徴とする回路モジュールの製造方法。 - シート上に複数の回路ブロック毎に突起状電極が形成された電子部品を載置して熱プレスすることにより、前記シートを仮溶融させて、前記シートに前記突起状電極が露出するように埋め込む部品内蔵シート形成工程と、
前記部品内蔵シートの前記突起状電極と接続される配線パターンを形成する工程と、
前記電子部品を埋め込んだ前記部品内蔵シートを被覆シートでラミネートする工程と、
前記部品内蔵シートを、前記回路ブロックの境界で折り畳むことにより積層する工程と、
積層された前記部品内蔵シートおよび前記被覆シートを熱プレスして互いに融着させて一体化する工程とを
含むことを特徴とする回路モジュールの製造方法。 - 前記配線パターンと電気的に接続されるシート状の受動素子を形成することを特徴とする請求項8または請求項9に記載の回路モジュールの製造方法。
- 前記シート状の受動素子が導電ペーストまたは誘電体の印刷または描画によって形成されることを特徴とする請求項10に記載の回路モジュールの製造方法。
- 前記配線パターンが導電ペーストの印刷によって形成されることを特徴とする請求項8から請求項11までのいずれかに記載の回路モジュールの製造方法。
- 前記回路ブロックの境界線に沿って支持棒を載置し、前記支持棒を支点として折り畳むことを特徴とする請求項8から請求項12までのいずれかに記載の回路モジュールの製造方法。
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US11/147,864 US7375421B2 (en) | 2004-06-15 | 2005-06-08 | High density multilayer circuit module |
CNB200510076316XA CN100420018C (zh) | 2004-06-15 | 2005-06-15 | 电路模块以及电路模块的制造方法 |
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JP4602208B2 (ja) * | 2004-12-15 | 2010-12-22 | 新光電気工業株式会社 | 電子部品実装構造体及びその製造方法 |
US7052290B1 (en) * | 2005-08-10 | 2006-05-30 | Sony Ericsson Mobile Communications Ab | Low profile connector for electronic interface modules |
TWI263313B (en) * | 2005-08-15 | 2006-10-01 | Phoenix Prec Technology Corp | Stack structure of semiconductor component embedded in supporting board |
TWI365524B (en) * | 2007-10-04 | 2012-06-01 | Unimicron Technology Corp | Stackable semiconductor device and fabrication method thereof |
US8174103B2 (en) * | 2008-05-01 | 2012-05-08 | International Business Machines Corporation | Enhanced architectural interconnect options enabled with flipped die on a multi-chip package |
JP2010225943A (ja) * | 2009-03-24 | 2010-10-07 | Toshiba Corp | 半導体装置 |
KR20120079742A (ko) | 2011-01-05 | 2012-07-13 | 삼성전자주식회사 | 폴디드 적층 패키지 및 그 제조방법 |
US9204547B2 (en) * | 2013-04-17 | 2015-12-01 | The United States of America as Represented by the Secratary of the Army | Non-planar printed circuit board with embedded electronic components |
US20150282367A1 (en) * | 2014-03-27 | 2015-10-01 | Hans-Joachim Barth | Electronic assembly that includes stacked electronic components |
US11647678B2 (en) * | 2016-08-23 | 2023-05-09 | Analog Devices International Unlimited Company | Compact integrated device packages |
JP6906228B2 (ja) * | 2017-08-18 | 2021-07-21 | ナミックス株式会社 | 半導体装置 |
JP7044007B2 (ja) * | 2018-07-31 | 2022-03-30 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
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JPH02239695A (ja) | 1989-03-13 | 1990-09-21 | Nec Corp | 多層プリント配線板 |
US6121676A (en) * | 1996-12-13 | 2000-09-19 | Tessera, Inc. | Stacked microelectronic assembly and method therefor |
US6225688B1 (en) * | 1997-12-11 | 2001-05-01 | Tessera, Inc. | Stacked microelectronic assembly and method therefor |
JP3588230B2 (ja) * | 1997-07-31 | 2004-11-10 | 京セラ株式会社 | 配線基板の製造方法 |
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JP3891743B2 (ja) | 1999-09-20 | 2007-03-14 | 松下電器産業株式会社 | 半導体部品実装済部品の製造方法、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品 |
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JP2004363568A (ja) * | 2003-05-09 | 2004-12-24 | Matsushita Electric Ind Co Ltd | 回路素子内蔵モジュール |
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US20050275088A1 (en) | 2005-12-15 |
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