JP2005536870A - ランプ及びランプの製造方法 - Google Patents
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/20—Light sources with three-dimensionally disposed light-generating elements on convex supports or substrates, e.g. on the outer surface of spheres
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
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- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/956—Making multiple wavelength emissive device
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (50)
- ランプを製造する方法であって、
個々の容器内に発光接合部を取り付ける段階と、
三次元アレイを形成するべく、湾曲した支持構造上に前記容器を取り付ける段階と、
前記発光接合部を前記支持構造と電気的に接続する段階と、
を含む方法。 - 前記支持構造は、複数の導電体を含み、前記方法は、前記導電体の中の少なくとも1つを湾曲した構成に形成する段階を更に含む請求項1記載の方法。
- 前記導電体の中の少なくともいくつかは、部分球面構成に形成される請求項2記載の方法。
- 前記少なくともいつかの導電体は、凸状構成に形成される請求項3記載の方法。
- 前記少なくともいくつかの導電体は、凹状構成に形成される請求項3記載の方法。
- 前記発光接合部は、中間導電体により、前記少なくとも1つの湾曲した導電体に接続されている請求項2記載の方法。
- 前記複数の導電体のそれぞれは湾曲しており、該湾曲した導電体の中の1つは、二次元で湾曲しており、前記湾曲した導電体の中の残りのものは、三次元で湾曲している請求項6記載の方法。
- それぞれの接合部は、前記湾曲した導電体の中の2つに接続されている請求項7記載の方法。
- 接合部のグループ内を流れる電流をその他の接合部のグループ内を流れる電流とは別個に制御できるように、前記接合部が導電体に電気的に接続されている請求項2記載の方法。
- いずれかの接合部内を流れる電流をその他のすべての接合部内の電流から独立的に制御できるように、前記接合部が導電体に接続されている請求項2記載の方法。
- 前記容器は、予め形成されたカップである請求項1又は2記載の方法。
- 前記カップは、内部に取り付けられた個々の接合部から出力される光の方向を制御する光学導波器として機能する請求項11記載の方法。
- 前記カップは、一次元又は二次元アレイとして形成された後に、1つずつ分離される請求項11記載の方法。
- 前記カップは、前記支持構造内の個々の空洞内に取り付けられる請求項11記載の方法。
- 前記空洞は、前記支持構造内を延長する孔である請求項14記載の方法。
- 前記カップ内に設置された前記接合部は、それぞれのカップのフランジ上に取り付けられると共に該フランジから絶縁されている導電性領域に電気的に接続されている請求項11記載の方法。
- 装着された発光接合部を有する1つずつに分離されたカップは、テープ及びリール、又はその他のバルクパッケージ内にパッケージングされる請求項13記載の方法。
- 前記支持構造は、リードフレームとして形成される請求項1記載の方法。
- 前記支持構造は、
(a)導電性プレートを既定の構成にスタンピングする段階と、
(b)前記容器を収容するべく、前記導電性プレートの中央部分に空洞を形成する段階と、
(c)前記中央部分上に湾曲した構成をプレス成形する段階と、
によって形成される請求項18記載の方法。 - 前記中央部分は、前記プレス成形段階の前に、別個の導電体に分離される請求項19記載の方法。
- 前記中央部分は、銀又は銀合金によって被覆される請求項19記載の方法。
- 請求項1〜21の中のいずれか一項記載の方法によって形成されたランプ。
- 湾曲した導電性の支持構造と;
三次元アレイを形成するべく、前記支持構造上に取り付けられた複数の容器と、
個々の容器内に配設され、前記支持構造に電気的に接続された複数の発光接合部と、
を含むランプ。 - それぞれの容器はカップである請求項23記載のランプ。
- それぞれのカップは、前記接合部から出力される光を導波するべく構成された側壁を具備し、前記カップは、熱的に結合された前記接合部から生成される熱を放散させるべく更に機能する請求項24記載のランプ。
- それぞれのカップは、電気的に絶縁性のレイヤを更に含み、該レイヤ上には、前記カップ内に取り付けられた前記発光接合部のボンディングワイヤと前記接合部を導電体に接続する中間接続間における電気的な接続を実現し、前記発光接合部を通じて電流が流れるようにするための導電性領域が提供されている請求項24記載のランプ。
- それぞれのカップは、内部に配設された前記接合部の極性を示すべく、その一側に向かって極性インジケータを有するように形成されている請求項24記載のランプ。
- 前記支持構造は、複数の導電体を含み、少なくとも1つの導電体は、湾曲しており、前記容器は、前記発光接合部が三次元アレイを形成するように、前記少なくとも1つの湾曲した導電体上に取り付けられている請求項23記載のランプ。
- 前記接合部の中の1つ又は複数のものは、その他の接合部とは異なる色の光を放射するべく適合されている請求項22又は23記載のランプ。
- 前記発光接合部は、中間導電体によって前記少なくとも1つの湾曲した導電体に接続されている請求項28記載のランプ。
- 前記複数の導電体のそれぞれは、湾曲しており、該湾曲した導電体の中の1つは、二次元で湾曲しており、前記湾曲した導電体の中の残りのものは、三次元で湾曲している請求項30記載のランプ。
- それぞれの接合部は、前記湾曲した導電体の中の2つに電気的に接続されている請求項31記載のランプ。
- 接合部のグループ内を流れる電流をその他の接合部のグループ内を流れる電流とは別個に制御できるように、前記接合部が導電体に電気的に接続されている請求項23記載のランプ。
- いずれかの接合部内を流れる電流をその他のすべての接合部内の電流から独立的に制御できるように、前記接合部が導電体に接続されている請求項23記載のランプ。
- 前記カップは、前記支持構造内の個々の空洞内に取り付けられる請求項24記載のランプ。
- 前記空洞は、前記支持構造内を延長する孔である請求項35記載のランプ。
- 前記導電体の中の少なくともいくつかは、部分球面構成に形成される請求項28記載のランプ。
- 前記導電体の中の少なくともいくつかは、凸状構成に形成される請求項37記載のランプ。
- 前記導電体の中の少なくともいくつかは、凹状構成に形成される請求項37記載のランプ。
- 前記支持構造は、リードフレームとして形成される請求項23記載のランプ。
- 前記リードフレームは、銅又は銅合金から形成される請求項40記載のランプ。
- 前記リードフレームの少なくとも一部は、銀又は銀合金によって被覆される請求項41記載のランプ。
- 前記容器は、銅又は銅合金から形成されている請求項23記載のランプ。
- 前記容器は、銀又は銀合金によって被覆されている請求項43記載のランプ。
- 前記支持構造は、
(a)導電性プレートを既定の構成にスタンピングする段階と、
(b)前記導電性プレートの中央部分を銀又は銀合金によって被覆する段階と、
(c)前記容器を収容するべく前記中央部分内に空洞を形成する段階と、
(d)前記中央部分上に、湾曲した構成をプレス成形する段階と、
によって形成される請求項40記載のランプ。 - 前記中央部分は、前記プレス成形段階の前に、別個の導電体に分離される請求項45記載のランプ。
- 複数の発光接合部を収容してランプを形成するリードフレームであって、
湾曲した導電性の支持構造と、
前記発光接合部が三次元アレイを形成するように、内部に配設された発光接合部を具備する個別の複数の容器を収容するための前記支持構造内の複数の空洞と、
を含むリードフレーム。 - 前記支持構造は、
(a)導電性プレートを既定の構成にスタンピングする段階と、
(b)前記容器を収容するべく、前記導電性プレートの中央部分に空洞を形成する段階と、
(c)前記中央部分上に、湾曲した構成をプレス成形する段階と、
によって形成される請求項47記載のリードフレーム。 - 前記中央部分は、前記プレス成形段階の前に、別個の導電体に分離される請求項48記載のリードフレーム。
- 前記中央部分は、銀又は銀合金によって被覆される請求項48記載のリードフレーム。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPS2979A AUPS297902A0 (en) | 2002-06-14 | 2002-06-14 | A method of producing a lamp |
AU2002950814A AU2002950814A0 (en) | 2002-08-14 | 2002-08-14 | A lamp and a method of producing a lamp |
AU2003901114A AU2003901114A0 (en) | 2003-03-12 | 2003-03-12 | A lamp and a method of producing a lamp |
PCT/AU2003/000724 WO2003107423A1 (en) | 2002-06-14 | 2003-06-11 | A lamp and method of producing a lamp |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008109234A Division JP2008205501A (ja) | 2002-06-14 | 2008-04-18 | Ledのパッケージ方法およびパッケージングされたled |
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JP2005536870A true JP2005536870A (ja) | 2005-12-02 |
JP4620458B2 JP4620458B2 (ja) | 2011-01-26 |
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JP2004514135A Expired - Lifetime JP4620458B2 (ja) | 2002-06-14 | 2003-06-11 | ランプ及びランプの製造方法 |
JP2008109234A Pending JP2008205501A (ja) | 2002-06-14 | 2008-04-18 | Ledのパッケージ方法およびパッケージングされたled |
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JP2008109234A Pending JP2008205501A (ja) | 2002-06-14 | 2008-04-18 | Ledのパッケージ方法およびパッケージングされたled |
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US (2) | US7704762B2 (ja) |
EP (2) | EP1939939A3 (ja) |
JP (2) | JP4620458B2 (ja) |
KR (1) | KR20080064904A (ja) |
CN (1) | CN1663044A (ja) |
AU (1) | AU2003233248B2 (ja) |
CA (2) | CA2488904A1 (ja) |
NZ (1) | NZ531587A (ja) |
TW (1) | TWI297219B (ja) |
WO (1) | WO2003107423A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007123891A (ja) * | 2005-10-27 | 2007-05-17 | Lg Innotek Co Ltd | 発光ダイオードパッケージ及びその製造方法 |
JP2008205501A (ja) * | 2002-06-14 | 2008-09-04 | Lednium Technology Pty Ltd | Ledのパッケージ方法およびパッケージングされたled |
JP2010506377A (ja) * | 2006-05-03 | 2010-02-25 | クリー インコーポレイテッド | 複数素子ledランプパッケージ |
US8362509B2 (en) | 2009-08-04 | 2013-01-29 | Cree, Inc. | Solid state lighting device including heatsink formed by stamping and/or die shaping |
JP2013026237A (ja) * | 2011-07-14 | 2013-02-04 | Sharp Corp | 発光素子の生産装置およびその生産方法、発光モジュールの生産装置およびその生産方法、発光モジュール、光源装置、液晶表示装置 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7320632B2 (en) | 2000-06-15 | 2008-01-22 | Lednium Pty Limited | Method of producing a lamp |
AUPQ818100A0 (en) * | 2000-06-15 | 2000-07-06 | Arlec Australia Limited | Led lamp |
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US8847242B2 (en) | 2006-05-03 | 2014-09-30 | Cree, Inc. | Multi-element LED lamp |
US8362509B2 (en) | 2009-08-04 | 2013-01-29 | Cree, Inc. | Solid state lighting device including heatsink formed by stamping and/or die shaping |
JP2013026237A (ja) * | 2011-07-14 | 2013-02-04 | Sharp Corp | 発光素子の生産装置およびその生産方法、発光モジュールの生産装置およびその生産方法、発光モジュール、光源装置、液晶表示装置 |
Also Published As
Publication number | Publication date |
---|---|
NZ531587A (en) | 2008-06-30 |
US20050285505A1 (en) | 2005-12-29 |
CA2634288A1 (en) | 2003-12-24 |
JP2008205501A (ja) | 2008-09-04 |
CA2488904A1 (en) | 2003-12-24 |
TW200405588A (en) | 2004-04-01 |
EP1552560A4 (en) | 2006-10-25 |
KR20080064904A (ko) | 2008-07-09 |
EP1552560A1 (en) | 2005-07-13 |
JP4620458B2 (ja) | 2011-01-26 |
TWI297219B (en) | 2008-05-21 |
WO2003107423A1 (en) | 2003-12-24 |
AU2003233248A1 (en) | 2003-12-31 |
EP1939939A3 (en) | 2010-03-24 |
AU2003233248B2 (en) | 2006-11-09 |
EP1939939A2 (en) | 2008-07-02 |
CN1663044A (zh) | 2005-08-31 |
US7704762B2 (en) | 2010-04-27 |
US20100163913A1 (en) | 2010-07-01 |
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