JP2005533896A5 - - Google Patents
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- Publication number
- JP2005533896A5 JP2005533896A5 JP2004523443A JP2004523443A JP2005533896A5 JP 2005533896 A5 JP2005533896 A5 JP 2005533896A5 JP 2004523443 A JP2004523443 A JP 2004523443A JP 2004523443 A JP2004523443 A JP 2004523443A JP 2005533896 A5 JP2005533896 A5 JP 2005533896A5
- Authority
- JP
- Japan
- Prior art keywords
- wet stripping
- formulation
- composition
- stripping composition
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/201,340 US6849200B2 (en) | 2002-07-23 | 2002-07-23 | Composition and process for wet stripping removal of sacrificial anti-reflective material |
| PCT/US2003/022148 WO2004009730A1 (en) | 2002-07-23 | 2003-07-16 | Composition and process for wet stripping removal of sacrificial anti-reflective material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005533896A JP2005533896A (ja) | 2005-11-10 |
| JP2005533896A5 true JP2005533896A5 (enExample) | 2006-09-21 |
Family
ID=30769632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004523443A Withdrawn JP2005533896A (ja) | 2002-07-23 | 2003-07-16 | 犠牲的反射防止材料の湿式剥離除去のための組成物および方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6849200B2 (enExample) |
| EP (1) | EP1551936A4 (enExample) |
| JP (1) | JP2005533896A (enExample) |
| CN (1) | CN1671821A (enExample) |
| AU (1) | AU2003249279A1 (enExample) |
| TW (1) | TW200408003A (enExample) |
| WO (1) | WO2004009730A1 (enExample) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6828289B2 (en) | 1999-01-27 | 2004-12-07 | Air Products And Chemicals, Inc. | Low surface tension, low viscosity, aqueous, acidic compositions containing fluoride and organic, polar solvents for removal of photoresist and organic and inorganic etch residues at room temperature |
| US20030022800A1 (en) * | 2001-06-14 | 2003-01-30 | Peters Darryl W. | Aqueous buffered fluoride-containing etch residue removers and cleaners |
| US8030263B2 (en) | 2004-07-01 | 2011-10-04 | Air Products And Chemicals, Inc. | Composition for stripping and cleaning and use thereof |
| US9217929B2 (en) | 2004-07-22 | 2015-12-22 | Air Products And Chemicals, Inc. | Composition for removing photoresist and/or etching residue from a substrate and use thereof |
| US7867779B2 (en) | 2005-02-03 | 2011-01-11 | Air Products And Chemicals, Inc. | System and method comprising same for measurement and/or analysis of particles in gas stream |
| US7682458B2 (en) * | 2005-02-03 | 2010-03-23 | Air Products And Chemicals, Inc. | Aqueous based residue removers comprising fluoride |
| US7888302B2 (en) * | 2005-02-03 | 2011-02-15 | Air Products And Chemicals, Inc. | Aqueous based residue removers comprising fluoride |
| US20060183055A1 (en) * | 2005-02-15 | 2006-08-17 | O'neill Mark L | Method for defining a feature on a substrate |
| KR101332501B1 (ko) * | 2005-06-07 | 2013-11-27 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 금속 및 유전체 상용성 희생 반사 방지 코팅 세정 및 제거조성물 |
| WO2006138235A2 (en) * | 2005-06-13 | 2006-12-28 | Advanced Technology Materials, Inc. | Compositions and methods for selective removal of metal or metal alloy after metal silicide formation |
| TWI339780B (en) | 2005-07-28 | 2011-04-01 | Rohm & Haas Elect Mat | Stripper |
| TW200722505A (en) * | 2005-09-30 | 2007-06-16 | Rohm & Haas Elect Mat | Stripper |
| SG10201508243UA (en) * | 2005-10-05 | 2015-11-27 | Entegris Inc | Oxidizing aqueous cleaner for the removal of post-etch residues |
| US20070099806A1 (en) * | 2005-10-28 | 2007-05-03 | Stewart Michael P | Composition and method for selectively removing native oxide from silicon-containing surfaces |
| US7960328B2 (en) * | 2005-11-09 | 2011-06-14 | Advanced Technology Materials, Inc. | Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon |
| US20070151949A1 (en) * | 2006-01-04 | 2007-07-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor processes and apparatuses thereof |
| US7534753B2 (en) * | 2006-01-12 | 2009-05-19 | Air Products And Chemicals, Inc. | pH buffered aqueous cleaning composition and method for removing photoresist residue |
| US20080125342A1 (en) * | 2006-11-07 | 2008-05-29 | Advanced Technology Materials, Inc. | Formulations for cleaning memory device structures |
| TWI572746B (zh) * | 2006-12-21 | 2017-03-01 | 恩特葛瑞斯股份有限公司 | 用以移除蝕刻後殘餘物之液體清洗劑 |
| US7879783B2 (en) * | 2007-01-11 | 2011-02-01 | Air Products And Chemicals, Inc. | Cleaning composition for semiconductor substrates |
| JP2011517328A (ja) * | 2008-03-07 | 2011-06-02 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 非選択性酸化物エッチング湿式洗浄組成物および使用方法 |
| US8101561B2 (en) * | 2009-11-17 | 2012-01-24 | Wai Mun Lee | Composition and method for treating semiconductor substrate surface |
| TWI548738B (zh) | 2010-07-16 | 2016-09-11 | 安堤格里斯公司 | 用於移除蝕刻後殘餘物之水性清潔劑 |
| JP6101421B2 (ja) | 2010-08-16 | 2017-03-22 | インテグリス・インコーポレーテッド | 銅または銅合金用エッチング液 |
| TWI502065B (zh) | 2010-10-13 | 2015-10-01 | Entegris Inc | 抑制氮化鈦腐蝕之組成物及方法 |
| JP5933950B2 (ja) | 2011-09-30 | 2016-06-15 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 銅または銅合金用エッチング液 |
| EP2798669B1 (en) | 2011-12-28 | 2021-03-31 | Entegris, Inc. | Compositions and methods for selectively etching titanium nitride |
| SG11201404930SA (en) | 2012-02-15 | 2014-09-26 | Advanced Tech Materials | Post-cmp removal using compositions and method of use |
| US9678430B2 (en) | 2012-05-18 | 2017-06-13 | Entegris, Inc. | Composition and process for stripping photoresist from a surface including titanium nitride |
| WO2014089196A1 (en) | 2012-12-05 | 2014-06-12 | Advanced Technology Materials, Inc. | Compositions for cleaning iii-v semiconductor materials and methods of using same |
| TWI655273B (zh) | 2013-03-04 | 2019-04-01 | 美商恩特葛瑞斯股份有限公司 | 選擇性蝕刻氮化鈦之組成物及方法 |
| KR102338550B1 (ko) | 2013-06-06 | 2021-12-14 | 엔테그리스, 아이엔씨. | 질화 티타늄의 선택적인 에칭을 위한 조성물 및 방법 |
| TWI683889B (zh) | 2013-07-31 | 2020-02-01 | 美商恩特葛瑞斯股份有限公司 | 用於移除金屬硬遮罩及蝕刻後殘餘物之具有Cu/W相容性的水性配方 |
| EP3039098B1 (en) | 2013-08-30 | 2020-09-30 | Entegris, Inc. | Compositions and methods for selectively etching titanium nitride |
| WO2015095175A1 (en) | 2013-12-16 | 2015-06-25 | Advanced Technology Materials, Inc. | Ni:nige:ge selective etch formulations and method of using same |
| TWI662379B (zh) | 2013-12-20 | 2019-06-11 | 美商恩特葛瑞斯股份有限公司 | 移除離子植入抗蝕劑之非氧化強酸類之用途 |
| KR102290209B1 (ko) | 2013-12-31 | 2021-08-20 | 엔테그리스, 아이엔씨. | 규소 및 게르마늄을 선택적으로 에칭하기 위한 배합물 |
| TWI659098B (zh) | 2014-01-29 | 2019-05-11 | 美商恩特葛瑞斯股份有限公司 | 化學機械研磨後配方及其使用方法 |
| WO2015119925A1 (en) | 2014-02-05 | 2015-08-13 | Advanced Technology Materials, Inc. | Non-amine post-cmp compositions and method of use |
| CN105621893B (zh) * | 2014-12-01 | 2018-05-01 | 焦作飞鸿安全玻璃有限公司 | 蚀刻印刷玻璃的生产方法 |
| CN109399947B (zh) * | 2018-10-11 | 2020-01-31 | 海南大学 | 减反射玻璃及其制备方法 |
| JP7395795B1 (ja) * | 2022-03-14 | 2023-12-11 | 日本化薬株式会社 | 処理液およびその使用方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4343677A (en) * | 1981-03-23 | 1982-08-10 | Bell Telephone Laboratories, Incorporated | Method for patterning films using reactive ion etching thereof |
| JPS6039176A (ja) * | 1983-08-10 | 1985-02-28 | Daikin Ind Ltd | エッチング剤組成物 |
| JPS63283028A (ja) * | 1986-09-29 | 1988-11-18 | Hashimoto Kasei Kogyo Kk | 微細加工表面処理剤 |
| US5981454A (en) * | 1993-06-21 | 1999-11-09 | Ekc Technology, Inc. | Post clean treatment composition comprising an organic acid and hydroxylamine |
| DE4303136C1 (de) * | 1993-02-04 | 1994-06-16 | Mtu Friedrichshafen Gmbh | Verfahren zur Herstellung von Schmelzcarbonat-Brennstoffzellen |
| JP3074634B2 (ja) * | 1994-03-28 | 2000-08-07 | 三菱瓦斯化学株式会社 | フォトレジスト用剥離液及び配線パターンの形成方法 |
| US5571447A (en) * | 1995-03-20 | 1996-11-05 | Ashland Inc. | Stripping and cleaning composition |
| JP3236220B2 (ja) * | 1995-11-13 | 2001-12-10 | 東京応化工業株式会社 | レジスト用剥離液組成物 |
| US5698503A (en) * | 1996-11-08 | 1997-12-16 | Ashland Inc. | Stripping and cleaning composition |
| JP3408090B2 (ja) * | 1996-12-18 | 2003-05-19 | ステラケミファ株式会社 | エッチング剤 |
| US6224785B1 (en) * | 1997-08-29 | 2001-05-01 | Advanced Technology Materials, Inc. | Aqueous ammonium fluoride and amine containing compositions for cleaning inorganic residues on semiconductor substrates |
| WO1998056726A1 (en) * | 1997-06-13 | 1998-12-17 | Cfmt, Inc. | Methods for treating semiconductor wafers |
| JPH1167632A (ja) * | 1997-08-18 | 1999-03-09 | Mitsubishi Gas Chem Co Inc | 半導体装置用洗浄剤 |
| US6280651B1 (en) * | 1998-12-16 | 2001-08-28 | Advanced Technology Materials, Inc. | Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent |
| JPH11323394A (ja) * | 1998-05-14 | 1999-11-26 | Texas Instr Japan Ltd | 半導体素子製造用洗浄剤及びそれを用いた半導体素子の製造方法 |
| JP4226216B2 (ja) * | 1998-05-18 | 2009-02-18 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 半導体基板用の剥離用組成物 |
| US6248704B1 (en) * | 1999-05-03 | 2001-06-19 | Ekc Technology, Inc. | Compositions for cleaning organic and plasma etched residues for semiconductors devices |
| US6268457B1 (en) * | 1999-06-10 | 2001-07-31 | Allied Signal, Inc. | Spin-on glass anti-reflective coatings for photolithography |
| US6329118B1 (en) * | 1999-06-21 | 2001-12-11 | Intel Corporation | Method for patterning dual damascene interconnects using a sacrificial light absorbing material |
| US6453914B2 (en) * | 1999-06-29 | 2002-09-24 | Micron Technology, Inc. | Acid blend for removing etch residue |
| US6562726B1 (en) * | 1999-06-29 | 2003-05-13 | Micron Technology, Inc. | Acid blend for removing etch residue |
| US6235693B1 (en) * | 1999-07-16 | 2001-05-22 | Ekc Technology, Inc. | Lactam compositions for cleaning organic and plasma etched residues for semiconductor devices |
| US6344432B1 (en) * | 1999-08-20 | 2002-02-05 | Advanced Technology Materials, Inc. | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures |
| JP2001100436A (ja) * | 1999-09-28 | 2001-04-13 | Mitsubishi Gas Chem Co Inc | レジスト剥離液組成物 |
| KR100341828B1 (ko) * | 2000-05-06 | 2002-06-26 | 박호군 | 표면 박피가 가능한 전단변형장치 |
-
2002
- 2002-07-23 US US10/201,340 patent/US6849200B2/en not_active Expired - Lifetime
-
2003
- 2003-07-16 EP EP03765600A patent/EP1551936A4/en not_active Withdrawn
- 2003-07-16 JP JP2004523443A patent/JP2005533896A/ja not_active Withdrawn
- 2003-07-16 CN CNA038173972A patent/CN1671821A/zh active Pending
- 2003-07-16 AU AU2003249279A patent/AU2003249279A1/en not_active Abandoned
- 2003-07-16 WO PCT/US2003/022148 patent/WO2004009730A1/en not_active Ceased
- 2003-07-21 TW TW092119794A patent/TW200408003A/zh unknown
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