JP2005531679A5 - - Google Patents

Download PDF

Info

Publication number
JP2005531679A5
JP2005531679A5 JP2004519139A JP2004519139A JP2005531679A5 JP 2005531679 A5 JP2005531679 A5 JP 2005531679A5 JP 2004519139 A JP2004519139 A JP 2004519139A JP 2004519139 A JP2004519139 A JP 2004519139A JP 2005531679 A5 JP2005531679 A5 JP 2005531679A5
Authority
JP
Japan
Prior art keywords
homogenized mixture
mixture
metal
organic solvent
metal nanopowder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004519139A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005531679A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IL2003/000554 external-priority patent/WO2004005413A1/en
Publication of JP2005531679A publication Critical patent/JP2005531679A/ja
Publication of JP2005531679A5 publication Critical patent/JP2005531679A5/ja
Pending legal-status Critical Current

Links

JP2004519139A 2002-07-03 2003-07-03 低温焼結導電性ナノインク及びその製造方法 Pending JP2005531679A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39312302P 2002-07-03 2002-07-03
PCT/IL2003/000554 WO2004005413A1 (en) 2002-07-03 2003-07-03 Low sintering temperatures conductive nano-inks and a method for producing the same

Publications (2)

Publication Number Publication Date
JP2005531679A JP2005531679A (ja) 2005-10-20
JP2005531679A5 true JP2005531679A5 (zh) 2006-08-10

Family

ID=30115548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004519139A Pending JP2005531679A (ja) 2002-07-03 2003-07-03 低温焼結導電性ナノインク及びその製造方法

Country Status (5)

Country Link
JP (1) JP2005531679A (zh)
KR (1) KR20060012545A (zh)
CN (1) CN1671805B (zh)
AU (1) AU2003237578A1 (zh)
WO (1) WO2004005413A1 (zh)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7585349B2 (en) 2002-12-09 2009-09-08 The University Of Washington Methods of nanostructure formation and shape selection
GB0300529D0 (en) * 2003-01-10 2003-02-12 Qinetiq Nanomaterials Ltd Improvements in and relating to ink jet deposition
US20050173680A1 (en) * 2004-02-10 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
US8257795B2 (en) 2004-02-18 2012-09-04 Virginia Tech Intellectual Properties, Inc. Nanoscale metal paste for interconnect and method of use
JP2007527102A (ja) * 2004-02-18 2007-09-20 バージニア テック インテレクチュアル プロパティーズ インコーポレーテッド 相互接続用のナノスケールの金属ペーストおよび使用方法
JP4721677B2 (ja) * 2004-09-06 2011-07-13 株式会社秀峰 印刷または塗布画像作成方法、およびそれによる、印刷または塗布画像体
TW200902647A (en) * 2004-10-08 2009-01-16 Mitsui Mining & Smelting Co Conductive ink
US20060093732A1 (en) * 2004-10-29 2006-05-04 David Schut Ink-jet printing of coupling agents for trace or circuit deposition templating
JP4756628B2 (ja) * 2004-12-01 2011-08-24 三井金属鉱業株式会社 水系ｉｔｏインク
JP4799881B2 (ja) * 2004-12-27 2011-10-26 三井金属鉱業株式会社 導電性インク
TW200642785A (en) 2005-01-14 2006-12-16 Cabot Corp Metal nanoparticle compositions
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
WO2006076609A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
KR100690360B1 (ko) * 2005-05-23 2007-03-09 삼성전기주식회사 도전성 잉크, 그 제조방법 및 도전성 기판
EP1896634B1 (en) * 2005-06-10 2013-04-17 Cima Nano Tech Israel Ltd. Enhanced transparent conductive coatings and methods for making them
EP1917137A2 (en) 2005-07-28 2008-05-07 High Voltage Graphics, Inc. Flocked articles incorporating a porous film
CN101292362B (zh) * 2005-08-12 2011-06-08 凯博瑞奥斯技术公司 透明导体及其制备方法、层压结构以及显示装置
WO2007038950A1 (en) 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Method for generation of metal surface structures and apparatus therefor
KR100726591B1 (ko) * 2005-12-22 2007-06-12 재단법인 포항산업과학연구원 무기전도성 잉크용 Ｎｉ계 나노 분말의 제조방법
KR100726592B1 (ko) * 2005-12-23 2007-06-12 재단법인 포항산업과학연구원 무기 전도성 잉크용 나노(ｎａｎｏ) 동(Ｃｕ)분말 제조방법
US20080003130A1 (en) 2006-02-01 2008-01-03 University Of Washington Methods for production of silver nanostructures
AT9473U1 (de) * 2006-05-04 2007-10-15 Austria Tech & System Tech Verfahren zur herstellung wenigstens eines leitfähigen elements einer leiterplatte sowie leiterplatte und verwendung eines derartigen verfahrens
US8659158B2 (en) 2006-08-16 2014-02-25 Funai Electric Co., Ltd. Thermally inkjettable acrylic dielectric ink formulation and process
KR101082146B1 (ko) * 2006-09-29 2011-11-09 주식회사 엘지화학 잉크젯 프린트용 잉크 및 상기 잉크에 사용되는 금속나노입자의 제조방법
JP5096735B2 (ja) 2006-12-05 2012-12-12 Ｊｘ日鉱日石エネルギー株式会社 ワイヤグリッド型偏光子及びその製造方法、並びにそれを用いた位相差フィルム及び液晶表示素子
KR100850771B1 (ko) 2007-02-21 2008-08-06 연세대학교 산학협력단 나노금속잉크 제조방법
US7722786B2 (en) 2007-02-23 2010-05-25 Henkel Ag & Co. Kgaa Conductive materials
KR100865124B1 (ko) * 2007-04-13 2008-10-24 삼성전기주식회사 잉크젯용 금속 잉크 조성물
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US20090181172A1 (en) * 2007-10-15 2009-07-16 Nanoink, Inc. Lithography of nanoparticle based inks
US8308993B2 (en) * 2008-01-30 2012-11-13 Basf Se Conductive inks
TWI401205B (zh) * 2008-01-31 2013-07-11 Ind Tech Res Inst 利用光熱效應製作應用基板的方法
WO2009108304A1 (en) 2008-02-26 2009-09-03 Cambrios Technologies Corporation Methods and compositions for ink jet deposition of conductive features
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
CN101597440B (zh) * 2008-06-05 2011-07-27 富葵精密组件(深圳)有限公司 油墨、利用该油墨制作导电线路的方法及线路板
US20100000762A1 (en) 2008-07-02 2010-01-07 Applied Nanotech Holdings, Inc. Metallic pastes and inks
JP2010012714A (ja) * 2008-07-04 2010-01-21 Toda Kogyo Corp 機能性薄膜の製造方法、機能性薄膜、機能性薄膜積層基材の製造方法及び機能性薄膜積層基材
EP2194764A1 (en) * 2008-12-04 2010-06-09 Stichting Dutch Polymer Institute Method for generation of electrically conducting surface structures, apparatus therefor and use
EP2207407A1 (en) 2009-01-13 2010-07-14 Stichting Dutch Polymer Institute Method for generation of electrically conducting surface structures, device and use
JP5740389B2 (ja) 2009-03-27 2015-06-24 アプライド・ナノテック・ホールディングス・インコーポレーテッド 光焼結及び／またはレーザー焼結を強化するためのバッファ層
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
KR100951697B1 (ko) 2009-10-30 2010-04-07 주식회사 연안테크놀로지 은 나노 메탈이 함유된 금속 도금층용 잉크 및 그 잉크의 제조방법
KR101293914B1 (ko) * 2010-02-18 2013-08-07 (주)덕산테코피아 도전성 잉크 및 이를 이용한 전자소자
CN101805538B (zh) * 2010-04-08 2014-05-07 中国科学院宁波材料技术与工程研究所 可低温烧结的导电墨水
KR20210117357A (ko) * 2010-11-03 2021-09-28 알파 어셈블리 솔루션스 인크. 소결 재료 및 이를 이용한 부착 방법
KR101276237B1 (ko) * 2010-12-02 2013-06-20 한국기계연구원 저온소결 전도성 금속막 및 이의 제조방법
WO2012103285A2 (en) * 2011-01-29 2012-08-02 Pchem Associates, Inc. Methods and systems for generating a substantially transparent and conductive substrate
WO2013036523A1 (en) * 2011-09-06 2013-03-14 Henkel Corporation Conductive material and process
WO2013036519A1 (en) * 2011-09-06 2013-03-14 Henkel Corporation Conductive material and process
CN102522342A (zh) * 2011-12-27 2012-06-27 日月光半导体制造股份有限公司 半导体结构及其制造方法
KR20150052083A (ko) * 2012-08-16 2015-05-13 시마 나노 테크 이스라엘 리미티드 투명한 전도성 코팅을 제조하기 위한 에멀션
KR102059805B1 (ko) * 2012-09-28 2019-12-27 돗빤호무즈가부시기가이샤 은 잉크 조성물, 도전체 및 통신 기기
CN104837645A (zh) 2012-10-12 2015-08-12 高压制图公司 柔性可热封装饰性制品及其制造方法
US20150368494A1 (en) * 2013-01-31 2015-12-24 Agency For Science, Technology And Research Electrically conductive ink composition and method of preparation thereof
CN103627255B (zh) * 2013-05-06 2015-05-20 苏州冷石纳米材料科技有限公司 一种纳米银导电墨水及采用该墨水制备的导电薄膜
KR102172950B1 (ko) 2013-08-16 2020-11-03 헨켈 아이피 앤드 홀딩 게엠베하 서브마이크론 은 입자 잉크 조성물, 방법 및 응용
CN103525199B (zh) * 2013-10-24 2015-12-02 北京印刷学院 一种可免加热后处理纳米尺度铜油墨的制备方法
KR102346037B1 (ko) 2017-04-04 2021-12-31 더블유.엘.고어 앤드 어소시에이츠 게엠베하 강화된 엘라스토머 및 통합된 전극을 갖는 유전체 복합재
CN112136367A (zh) 2018-05-08 2020-12-25 W.L.戈尔及同仁股份有限公司 用于皮肤应用的柔性印刷电路
EP3791697A1 (en) 2018-05-08 2021-03-17 W. L. Gore & Associates Inc Flexible and stretchable printed circuits on stretchable substrates
KR20230056056A (ko) 2018-05-08 2023-04-26 더블유.엘. 고어 앤드 어소시에이트스, 인코포레이티드 신장성 및 비신장성 기재 상의 내구성 있는 연성 인쇄 회로
KR102490064B1 (ko) * 2020-11-27 2023-01-19 한국전자기술연구원 전도성 잉크 조성물 및 이를 이용한 전도성 기판
CN113831864A (zh) * 2021-11-11 2021-12-24 苏州诺菲纳米科技有限公司 单层纳米银线可剥导电胶及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2837910B2 (ja) * 1990-03-01 1998-12-16 チタン工業株式会社 エマルション型液膜法を利用する貴金属微粒子の製造方法
JPH0821254B2 (ja) * 1991-02-22 1996-03-04 旭化成工業株式会社 銅合金系組成物、それを用いて印刷された成形物、ペーストおよび接着剤
JP2955985B2 (ja) * 1994-08-31 1999-10-04 ナノパウダース インダストリーズ（イスラエル）リミテッド 高純度超微粒金属粉を製造する方法
CA2280115C (en) * 1997-02-20 2007-11-13 Partnerships Limited, Inc. Low temperature method and compositions for producing electrical conductors
US6379745B1 (en) * 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
JP3266066B2 (ja) * 1997-09-05 2002-03-18 三菱マテリアル株式会社 保存安定性に優れた金属微粒子含有導電膜形成用組成物
US6262129B1 (en) * 1998-07-31 2001-07-17 International Business Machines Corporation Method for producing nanoparticles of transition metals
EP1244530A4 (en) * 1999-10-22 2009-12-16 Philip Morris Usa Inc NANOMETRIC INTERMETALLIC POWDERS
JP3646784B2 (ja) * 2000-03-31 2005-05-11 セイコーエプソン株式会社 薄膜パタ−ンの製造方法および微細構造体
JP2001325831A (ja) * 2000-05-12 2001-11-22 Bando Chem Ind Ltd 金属コロイド液、導電性インク、導電性被膜及び導電性被膜形成用基底塗膜
JP4035968B2 (ja) * 2000-06-30 2008-01-23 セイコーエプソン株式会社 導電膜パターンの形成方法
JP5008216B2 (ja) * 2000-10-13 2012-08-22 株式会社アルバック インクジェット用インクの製法
JP4355436B2 (ja) * 2000-10-25 2009-11-04 森村ケミカル株式会社 配線パターンの形成方法、回路基板の製造方法および遮光パターンの形成された透光体の製造方法

Similar Documents

Publication Publication Date Title
JP2005531679A5 (zh)
JP4636496B2 (ja) 導電性及び透明性を有するナノ被覆物及びナノインクの製造方法、並びにこの製造方法により製造されるナノ粉末被覆物及びインク
JP2005530005A5 (zh)
US8496873B2 (en) Alloy nanoparticles of SN-CU-AG, preparation method thereof and ink or paste using the alloy nanoparticles
JP2005531679A (ja) 低温焼結導電性ナノインク及びその製造方法
US8105472B2 (en) Enhanced transparent conductive coatings and methods for making them
RU2641739C2 (ru) Смеси, способы и композиции, относящиеся к проводящим материалам
CN101684214B (zh) 一种纳米颗粒导电墨水及其制备方法
JP5735788B2 (ja) 圧膜用超低溶融金属ナノ粒子組成物
TWI573846B (zh) 形成具有燒結添加物之透明導電塗層的方法
AU2008229178B2 (en) Shielding based on metallic nanoparticle compositions and devices and methods thereof
JP2011525034A5 (zh)
Yamamoto et al. An electroless plating method for conducting microbeads using gold nanoparticles
JP2013232684A (ja) 金属ナノ粒子遮蔽構造およびその方法
TWI719976B (zh) 製造圖案化透明導電膜及透明導電膜的方法
JPH01195284A (ja) メッキされた網状化機能性重合体粒子、その製造方法、及びその導電性材料製造における使用
CN102732095A (zh) 一种纳米墨水及其制备与应用
TW201042668A (en) Transparent conductive film-laminated substrate and process for producing same
JP6352059B2 (ja) 無電解めっき下地層形成用組成物
Cheng et al. Preparation of micron–sized polystyrene/silver core–shell microspheres by ultrasonic assisted electroless plating
JP2020070489A (ja) 導電性微粒子分散体、導電性パターンの形成方法及び導電性基板の製造方法
Cho et al. Evolution of core-shell structure using functional polystyrene and gold
JP2019077920A (ja) 金属調加飾部品及びその製造方法