JP2005529760A - 集積化された導電シールドを有するマイクロエレクトロメカニカル・デバイス - Google Patents

集積化された導電シールドを有するマイクロエレクトロメカニカル・デバイス Download PDF

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Publication number
JP2005529760A
JP2005529760A JP2004513168A JP2004513168A JP2005529760A JP 2005529760 A JP2005529760 A JP 2005529760A JP 2004513168 A JP2004513168 A JP 2004513168A JP 2004513168 A JP2004513168 A JP 2004513168A JP 2005529760 A JP2005529760 A JP 2005529760A
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JP
Japan
Prior art keywords
substrate
conductive shield
layer
microelectromechanical device
sensing element
Prior art date
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Pending
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JP2004513168A
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English (en)
Japanese (ja)
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JP2005529760A5 (enExample
Inventor
ストラットン，トーマス・ジー
ラーン，カーティス・エイチ
ガードナー，ゲーリー・アール
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Honeywell International Inc
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Honeywell International Inc
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Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of JP2005529760A publication Critical patent/JP2005529760A/ja
Publication of JP2005529760A5 publication Critical patent/JP2005529760A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Micromachines (AREA)
JP2004513168A 2002-06-17 2003-06-16 集積化された導電シールドを有するマイクロエレクトロメカニカル・デバイス Pending JP2005529760A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/172,865 US6952042B2 (en) 2002-06-17 2002-06-17 Microelectromechanical device with integrated conductive shield
PCT/US2003/019624 WO2003106329A2 (en) 2002-06-17 2003-06-16 Microelectromechanical device with integrated conductive shield

Publications (2)

Publication Number Publication Date
JP2005529760A true JP2005529760A (ja) 2005-10-06
JP2005529760A5 JP2005529760A5 (enExample) 2006-06-22

Family

ID=29733197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004513168A Pending JP2005529760A (ja) 2002-06-17 2003-06-16 集積化された導電シールドを有するマイクロエレクトロメカニカル・デバイス

Country Status (7)

Country Link
US (2) US6952042B2 (enExample)
EP (1) EP1532070A2 (enExample)
JP (1) JP2005529760A (enExample)
CN (1) CN1675124A (enExample)
AU (1) AU2003243713A1 (enExample)
CA (1) CA2490393C (enExample)
WO (1) WO2003106329A2 (enExample)

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US20080042223A1 (en) * 2006-08-17 2008-02-21 Lu-Lee Liao Microelectromechanical system package and method for making the same
US20080075308A1 (en) * 2006-08-30 2008-03-27 Wen-Chieh Wei Silicon condenser microphone
US20080083957A1 (en) * 2006-10-05 2008-04-10 Wen-Chieh Wei Micro-electromechanical system package
US7894622B2 (en) 2006-10-13 2011-02-22 Merry Electronics Co., Ltd. Microphone
DE102007014468A1 (de) * 2007-03-22 2008-09-25 Endress + Hauser Gmbh + Co. Kg Drucksensor-Chip
DE102007027274A1 (de) * 2007-06-11 2008-12-18 Endress + Hauser Gmbh + Co. Kg Differenzdrucksensor
US20090151795A1 (en) * 2007-12-18 2009-06-18 Hsu Shih-Hsien Ice tray with water level detecting device
US7948147B2 (en) * 2009-02-19 2011-05-24 The Boeing Company Sensor network incorporating stretchable silicon
US8196475B2 (en) * 2009-03-16 2012-06-12 Kavlico Corporation Cointegrated MEMS sensor and method
CN102205940A (zh) * 2011-04-25 2011-10-05 北京理工大学 Mems电热双晶体致动器
JP2013012574A (ja) * 2011-06-29 2013-01-17 Toshiba Corp 固体撮像装置および固体撮像装置の製造方法
CN103063339A (zh) * 2011-10-20 2013-04-24 刘胜 带有屏蔽层的硅压阻式压力传感器芯片
JP5877248B2 (ja) * 2012-10-17 2016-03-02 株式会社鷺宮製作所 圧力センサおよび、それを備えるセンサユニット
CN103438936B (zh) * 2013-09-02 2016-06-15 东南大学 基于soi片器件层硅阳极键合的电容式温度、湿度和气压传感器集成制造方法
KR20160067940A (ko) 2013-10-07 2016-06-14 코닌클리케 필립스 엔.브이. 페라이트 막대들을 제조하기 위한 정밀 배치 생성 방법
US9557237B2 (en) 2013-11-18 2017-01-31 Sensata Technologies, Inc. MEMS pressure sensor field shield layout for surface charge immunity in oil filled packaging
US9261419B2 (en) 2014-01-23 2016-02-16 Honeywell International Inc. Modular load structure assembly having internal strain gaged sensing
US9915577B2 (en) 2014-12-02 2018-03-13 Sensata Technologies, Inc. Case isolated oil filled MEMS pressure sensor
EP3112830B1 (en) 2015-07-01 2018-08-22 Sensata Technologies, Inc. Temperature sensor and method for the production of a temperature sensor
US9638559B1 (en) 2016-02-10 2017-05-02 Sensata Technologies Inc. System, devices and methods for measuring differential and absolute pressure utilizing two MEMS sense elements
CN107290099B (zh) 2016-04-11 2021-06-08 森萨塔科技公司 压力传感器、用于压力传感器的插塞件和制造插塞件的方法
EP3236226B1 (en) 2016-04-20 2019-07-24 Sensata Technologies, Inc. Method of manufacturing a pressure sensor
US10428716B2 (en) 2016-12-20 2019-10-01 Sensata Technologies, Inc. High-temperature exhaust sensor
US10545064B2 (en) 2017-05-04 2020-01-28 Sensata Technologies, Inc. Integrated pressure and temperature sensor
US10502641B2 (en) 2017-05-18 2019-12-10 Sensata Technologies, Inc. Floating conductor housing
US10323998B2 (en) 2017-06-30 2019-06-18 Sensata Technologies, Inc. Fluid pressure sensor
US10724907B2 (en) 2017-07-12 2020-07-28 Sensata Technologies, Inc. Pressure sensor element with glass barrier material configured for increased capacitive response
US10557770B2 (en) 2017-09-14 2020-02-11 Sensata Technologies, Inc. Pressure sensor with improved strain gauge
DE102019207963B4 (de) 2018-06-04 2023-11-09 Vitesco Technologies USA, LLC (n.d.Ges.d.Staates Delaware) Csoi - mems-druckerfassungselement mit spannungsausgleichern
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US11933683B2 (en) 2020-09-03 2024-03-19 Te Connectivity Solutions Gmbh Strain gauge and strain measurement assembly
US11573143B2 (en) 2021-04-21 2023-02-07 Vitesco Technologies USA, LLC Mems pressure sensing element with stress adjustors to minimize thermal hysteresis induced by electrical field
DE102021211561A1 (de) * 2020-11-19 2022-05-19 Vitesco Technologies USA, LLC Mems-druckerfassungselement mit spannungsjustierern

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US4771639A (en) * 1987-09-02 1988-09-20 Yokogawa Electric Corporation Semiconductor pressure sensor
JPH0961456A (ja) * 1995-08-29 1997-03-07 Murata Mfg Co Ltd 半導体装置
JP2000022172A (ja) * 1998-06-30 2000-01-21 Matsushita Electric Ind Co Ltd 変換装置及びその製造方法
JP2002307697A (ja) * 2001-03-19 2002-10-23 Xerox Corp マイクロ電気機械システムにおける電気接続の形成方法、及びマイクロ電気機械システムのマイクロ構造

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Patent Citations (5)

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US4463336A (en) * 1981-12-28 1984-07-31 United Technologies Corporation Ultra-thin microelectronic pressure sensors
US4771639A (en) * 1987-09-02 1988-09-20 Yokogawa Electric Corporation Semiconductor pressure sensor
JPH0961456A (ja) * 1995-08-29 1997-03-07 Murata Mfg Co Ltd 半導体装置
JP2000022172A (ja) * 1998-06-30 2000-01-21 Matsushita Electric Ind Co Ltd 変換装置及びその製造方法
JP2002307697A (ja) * 2001-03-19 2002-10-23 Xerox Corp マイクロ電気機械システムにおける電気接続の形成方法、及びマイクロ電気機械システムのマイクロ構造

Also Published As

Publication number Publication date
US7687298B2 (en) 2010-03-30
US6952042B2 (en) 2005-10-04
US20070243654A1 (en) 2007-10-18
US20030230147A1 (en) 2003-12-18
EP1532070A2 (en) 2005-05-25
CA2490393A1 (en) 2003-12-24
CA2490393C (en) 2014-04-29
CN1675124A (zh) 2005-09-28
AU2003243713A1 (en) 2003-12-31
WO2003106329A2 (en) 2003-12-24
WO2003106329A3 (en) 2004-06-10

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