JP2005528782A5 - - Google Patents
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- JP2005528782A5 JP2005528782A5 JP2003585174A JP2003585174A JP2005528782A5 JP 2005528782 A5 JP2005528782 A5 JP 2005528782A5 JP 2003585174 A JP2003585174 A JP 2003585174A JP 2003585174 A JP2003585174 A JP 2003585174A JP 2005528782 A5 JP2005528782 A5 JP 2005528782A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- bonding
- coupling element
- frame
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims 63
- 230000008878 coupling Effects 0.000 claims 30
- 238000010168 coupling process Methods 0.000 claims 30
- 238000005859 coupling reaction Methods 0.000 claims 30
- 238000000034 method Methods 0.000 claims 26
- 239000002131 composite material Substances 0.000 claims 23
- 239000000463 material Substances 0.000 claims 13
- 239000011248 coating agent Substances 0.000 claims 10
- 238000000576 coating method Methods 0.000 claims 10
- 239000011521 glass Substances 0.000 claims 10
- 238000007740 vapor deposition Methods 0.000 claims 10
- 230000003287 optical effect Effects 0.000 claims 7
- 235000012431 wafers Nutrition 0.000 claims 7
- 239000004065 semiconductor Substances 0.000 claims 5
- 238000010276 construction Methods 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 3
- 230000004927 fusion Effects 0.000 claims 2
- 239000013067 intermediate product Substances 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE20205830 | 2002-04-15 | ||
| DE10222964A DE10222964B4 (de) | 2002-04-15 | 2002-05-23 | Verfahren zur Gehäusebildung bei elektronischen Bauteilen sowie so hermetisch verkapselte elektronische Bauteile |
| DE10222958A DE10222958B4 (de) | 2002-04-15 | 2002-05-23 | Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element |
| DE10222609A DE10222609B4 (de) | 2002-04-15 | 2002-05-23 | Verfahren zur Herstellung strukturierter Schichten auf Substraten und verfahrensgemäß beschichtetes Substrat |
| DE10252787A DE10252787A1 (de) | 2002-04-15 | 2002-11-13 | Verfahren zur Herstellung eines Kopierschutzes für eine elektronische Schaltung |
| DE10301559A DE10301559A1 (de) | 2002-04-15 | 2003-01-16 | Verfahren zur Herstellung eines Erzeugnisses mit einer strukturierten Oberfläche |
| PCT/EP2003/003907 WO2003088347A2 (de) | 2002-04-15 | 2003-04-15 | Verfahren zum verbinden von substraten und verbundelement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005528782A JP2005528782A (ja) | 2005-09-22 |
| JP2005528782A5 true JP2005528782A5 (enExample) | 2006-01-26 |
Family
ID=44243021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003585174A Withdrawn JP2005528782A (ja) | 2002-04-15 | 2003-04-15 | 基板およびコンポジット要素の接続方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7396741B2 (enExample) |
| EP (1) | EP1495491B1 (enExample) |
| JP (1) | JP2005528782A (enExample) |
| CN (1) | CN100359653C (enExample) |
| AU (1) | AU2003227626A1 (enExample) |
| CA (1) | CA2485022A1 (enExample) |
| IL (1) | IL164301A0 (enExample) |
| WO (1) | WO2003088347A2 (enExample) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003237668A1 (en) | 2002-05-23 | 2003-12-12 | Schott Ag | Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component |
| DE10350038A1 (de) * | 2003-10-27 | 2005-05-25 | Robert Bosch Gmbh | Verfahren zum anodischen Bonden von Wafern und Vorrichtung |
| DE102004004289A1 (de) * | 2004-01-28 | 2005-08-25 | Infineon Technologies Ag | Integrierte Schaltungsanordnung |
| US7066661B2 (en) * | 2004-03-30 | 2006-06-27 | Stefano Therisod | Small footprint optical fiber transceiver |
| TWI231535B (en) * | 2004-05-26 | 2005-04-21 | Advanced Semiconductor Eng | Photoelectric device grinding process and device grinding process |
| KR100652375B1 (ko) * | 2004-06-29 | 2006-12-01 | 삼성전자주식회사 | 와이어 본딩 패키지를 포함하는 이미지 센서 모듈 구조물및 그 제조방법 |
| DE102006016373A1 (de) * | 2006-04-05 | 2007-10-11 | Merck Patent Gmbh | Großflächige OLED's mit homogener Lichtemission |
| US20080070340A1 (en) * | 2006-09-14 | 2008-03-20 | Nicholas Francis Borrelli | Image sensor using thin-film SOI |
| US20080067652A1 (en) * | 2006-09-18 | 2008-03-20 | Simpler Networks Inc. | Integrated mems packaging |
| US8030754B2 (en) * | 2007-01-31 | 2011-10-04 | Hewlett-Packard Development Company, L.P. | Chip cooling channels formed in wafer bonding gap |
| DE102007027811A1 (de) * | 2007-06-13 | 2008-12-24 | Carl Zeiss Smt Ag | Anwendung des LTB-Verfahrens zur Herstellung optischer Elemente |
| DE102007035788A1 (de) * | 2007-07-31 | 2009-02-05 | Robert Bosch Gmbh | Waferfügeverfahren, Waferverbund sowie Chip |
| JPWO2009110339A1 (ja) * | 2008-03-03 | 2011-07-14 | 日本電気株式会社 | デバイスパッケージ、電子モジュール、及び電子機器 |
| JP5493290B2 (ja) * | 2008-05-07 | 2014-05-14 | パナソニック株式会社 | 電子部品パッケージ |
| DE102008025202B4 (de) * | 2008-05-27 | 2014-11-06 | Epcos Ag | Hermetisch geschlossenes Gehäuse für elektronische Bauelemente und Herstellungsverfahren |
| FR2935537B1 (fr) * | 2008-08-28 | 2010-10-22 | Soitec Silicon On Insulator | Procede d'initiation d'adhesion moleculaire |
| JP5176146B2 (ja) * | 2008-10-08 | 2013-04-03 | 富士通株式会社 | マイクロ可動素子および光スイッチング装置 |
| JP5239722B2 (ja) | 2008-10-10 | 2013-07-17 | 富士通株式会社 | マイクロ可動素子および光スイッチング装置 |
| US8125042B2 (en) * | 2008-11-13 | 2012-02-28 | Samsung Electronics Co., Ltd. | Semiconductor package and method of manufacturing the same |
| US7936033B2 (en) * | 2008-12-29 | 2011-05-03 | Texas Instruments Incorporated | Micro-optical device packaging system |
| FR2943177B1 (fr) | 2009-03-12 | 2011-05-06 | Soitec Silicon On Insulator | Procede de fabrication d'une structure multicouche avec report de couche circuit |
| FR2947380B1 (fr) | 2009-06-26 | 2012-12-14 | Soitec Silicon Insulator Technologies | Procede de collage par adhesion moleculaire. |
| DE102009034532A1 (de) | 2009-07-23 | 2011-02-03 | Msg Lithoglas Ag | Verfahren zum Herstellen einer strukturierten Beschichtung auf einem Substrat, beschichtetes Substrat sowie Halbzeug mit einem beschichteten Substrat |
| TWI546910B (zh) * | 2010-02-26 | 2016-08-21 | 精材科技股份有限公司 | 晶片封裝體及其製造方法 |
| DE102011005612A1 (de) * | 2011-03-16 | 2012-09-20 | Osram Opto Semiconductors Gmbh | Organisches Optoelektronisches Bauelement und Verfahren zur Herstellung eines Optoelektronischen Bauelements |
| WO2013031509A1 (en) * | 2011-08-26 | 2013-03-07 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, electronic device, lighting device, and method for manufacturing the light-emitting device |
| CN102769091B (zh) * | 2012-05-25 | 2015-11-25 | 瑞声声学科技(深圳)有限公司 | Led封装中的陶瓷挡墙制造方法 |
| US9991463B2 (en) * | 2012-06-14 | 2018-06-05 | Universal Display Corporation | Electronic devices with improved shelf lives |
| TW201417250A (zh) * | 2012-07-17 | 2014-05-01 | 海特根微光學公司 | 光學模組,特別是光電模組,及其製造方法 |
| US9434145B2 (en) | 2012-12-07 | 2016-09-06 | Semrock, Inc. | Dichroic filter conformed to optical surface |
| US9741918B2 (en) | 2013-10-07 | 2017-08-22 | Hypres, Inc. | Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit |
| US9105800B2 (en) * | 2013-12-09 | 2015-08-11 | Raytheon Company | Method of forming deposited patterns on a surface |
| US9698376B2 (en) * | 2014-10-24 | 2017-07-04 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Packaging method and packaging structure of substrate |
| CN104362243B (zh) * | 2014-10-24 | 2017-11-03 | 深圳市华星光电技术有限公司 | 基板的封装方法及封装结构 |
| US10234695B2 (en) * | 2015-02-16 | 2019-03-19 | Apple Inc. | Low-temperature hermetic sealing for diffractive optical element stacks |
| US9771258B2 (en) * | 2015-06-24 | 2017-09-26 | Raytheon Company | Wafer level MEMS package including dual seal ring |
| US20170219793A1 (en) * | 2016-01-28 | 2017-08-03 | AAC Technologies Pte. Ltd. | Sealed module with glue guiding features and method for making same |
| JP6714884B2 (ja) | 2016-09-13 | 2020-07-01 | Agc株式会社 | 高周波デバイス用ガラス基板と高周波デバイス用回路基板 |
| CN109103165B (zh) * | 2018-07-03 | 2019-12-10 | 中国电子科技集团公司第二十九研究所 | Ltcc基板三维堆叠结构及其气密封装方法 |
| CN110155934A (zh) * | 2019-04-22 | 2019-08-23 | 武汉衍熙微器件有限公司 | 一种mems器件及其制作方法 |
| DE102019120844A1 (de) * | 2019-08-01 | 2021-02-04 | Horst Siedle Gmbh & Co. Kg | Verfahren zur Herstellung von abgedichteten Funktionselementen |
| DE102019129036A1 (de) * | 2019-10-28 | 2021-04-29 | Schott Ag | Verfahren zur Herstellung von Glasscheiben und verfahrensgemäß hergestellte Glasscheibe sowie deren Verwendung |
| FI131434B1 (en) * | 2020-01-24 | 2025-04-22 | Teknologian Tutkimuskeskus Vtt Oy | Wafer level package for device |
| DE102020111728B4 (de) | 2020-04-29 | 2022-06-23 | Schott Ag | Elektro-optisches Wandlerbauteil mit einem Abstandhalter, sowie Abstandhalter-Wafer zur Herstellung eines elektro-optischen Wandlerbauteils |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4232814A (en) * | 1979-06-14 | 1980-11-11 | Semi-Alloys, Inc. | Method and apparatus for fabricating a sealing cover unit for a container for a semiconductor device |
| US4426768A (en) * | 1981-12-28 | 1984-01-24 | United Technologies Corporation | Ultra-thin microelectronic pressure sensors |
| JPS58172679A (ja) * | 1982-04-01 | 1983-10-11 | Fuji Photo Film Co Ltd | ホログラム作成方法 |
| JPH0810170B2 (ja) * | 1987-03-06 | 1996-01-31 | 株式会社日立製作所 | 半導体絶対圧力センサの製造方法 |
| US5343064A (en) * | 1988-03-18 | 1994-08-30 | Spangler Leland J | Fully integrated single-crystal silicon-on-insulator process, sensors and circuits |
| DE69409257T2 (de) * | 1993-12-13 | 1998-09-10 | Honeywell, Inc., Minneapolis, Minn. | Integrierte silizium-vakuum-mikropackung für infrarot-geräte |
| US5448444A (en) * | 1994-01-28 | 1995-09-05 | United Technologies Corporation | Capacitive pressure sensor having a reduced area dielectric spacer |
| US6969667B2 (en) * | 2002-04-01 | 2005-11-29 | Hewlett-Packard Development Company, L.P. | Electrical device and method of making |
| DE10222964B4 (de) | 2002-04-15 | 2004-07-08 | Schott Glas | Verfahren zur Gehäusebildung bei elektronischen Bauteilen sowie so hermetisch verkapselte elektronische Bauteile |
| DE10222958B4 (de) | 2002-04-15 | 2007-08-16 | Schott Ag | Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element |
| DE10222609B4 (de) | 2002-04-15 | 2008-07-10 | Schott Ag | Verfahren zur Herstellung strukturierter Schichten auf Substraten und verfahrensgemäß beschichtetes Substrat |
-
2003
- 2003-04-15 CA CA002485022A patent/CA2485022A1/en not_active Abandoned
- 2003-04-15 JP JP2003585174A patent/JP2005528782A/ja not_active Withdrawn
- 2003-04-15 WO PCT/EP2003/003907 patent/WO2003088347A2/de not_active Ceased
- 2003-04-15 EP EP03725032.1A patent/EP1495491B1/de not_active Expired - Lifetime
- 2003-04-15 US US10/511,557 patent/US7396741B2/en not_active Expired - Lifetime
- 2003-04-15 AU AU2003227626A patent/AU2003227626A1/en not_active Abandoned
- 2003-04-15 CN CNB03808564XA patent/CN100359653C/zh not_active Expired - Lifetime
-
2004
- 2004-09-27 IL IL16430104A patent/IL164301A0/xx unknown
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