JP2005518473A5 - - Google Patents

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Publication number
JP2005518473A5
JP2005518473A5 JP2003571364A JP2003571364A JP2005518473A5 JP 2005518473 A5 JP2005518473 A5 JP 2005518473A5 JP 2003571364 A JP2003571364 A JP 2003571364A JP 2003571364 A JP2003571364 A JP 2003571364A JP 2005518473 A5 JP2005518473 A5 JP 2005518473A5
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JP
Japan
Prior art keywords
composition
group
acid
accelerator
mixtures
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JP2003571364A
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English (en)
Japanese (ja)
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JP4202931B2 (ja
JP2005518473A (ja
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Priority claimed from US10/080,853 external-priority patent/US6755721B2/en
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Publication of JP2005518473A publication Critical patent/JP2005518473A/ja
Publication of JP2005518473A5 publication Critical patent/JP2005518473A5/ja
Application granted granted Critical
Publication of JP4202931B2 publication Critical patent/JP4202931B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003571364A 2002-02-22 2003-02-18 ニッケル−リン合金に使用するｃｍｐ組成物 Expired - Fee Related JP4202931B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/080,853 US6755721B2 (en) 2002-02-22 2002-02-22 Chemical mechanical polishing of nickel phosphorous alloys
PCT/US2003/004935 WO2003072671A1 (en) 2002-02-22 2003-02-18 Cmp formulations for the use on nickel-phosphorus alloys

Publications (3)

Publication Number Publication Date
JP2005518473A JP2005518473A (ja) 2005-06-23
JP2005518473A5 true JP2005518473A5 (https=) 2005-12-22
JP4202931B2 JP4202931B2 (ja) 2008-12-24

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ID=27765245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003571364A Expired - Fee Related JP4202931B2 (ja) 2002-02-22 2003-02-18 ニッケル−リン合金に使用するｃｍｐ組成物

Country Status (6)

Country Link
US (3) US6755721B2 (https=)
EP (1) EP1476518A1 (https=)
JP (1) JP4202931B2 (https=)
CN (1) CN1284838C (https=)
AU (1) AU2003217577A1 (https=)
WO (1) WO2003072671A1 (https=)

Families Citing this family (44)

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US20040092103A1 (en) * 2000-07-19 2004-05-13 Shigeo Fujii Polishing fluid composition
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
US7553345B2 (en) 2002-12-26 2009-06-30 Kao Corporation Polishing composition
US8025808B2 (en) * 2003-04-25 2011-09-27 Saint-Gobain Ceramics & Plastics, Inc. Methods for machine ceramics
US7306748B2 (en) * 2003-04-25 2007-12-11 Saint-Gobain Ceramics & Plastics, Inc. Methods for machining ceramics
JP4202201B2 (ja) * 2003-07-03 2008-12-24 株式会社フジミインコーポレーテッド 研磨用組成物
JP4707311B2 (ja) * 2003-08-08 2011-06-22 花王株式会社 磁気ディスク用基板
JP4336550B2 (ja) * 2003-09-09 2009-09-30 花王株式会社 磁気ディスク用研磨液キット
US6964600B2 (en) 2003-11-21 2005-11-15 Praxair Technology, Inc. High selectivity colloidal silica slurry
TWI364450B (en) * 2004-08-09 2012-05-21 Kao Corp Polishing composition
JP4836441B2 (ja) * 2004-11-30 2011-12-14 花王株式会社 研磨液組成物
US7241692B2 (en) * 2005-07-26 2007-07-10 Semiconductor Manufacturing International (Shanghai) Corporation Method and structure for aluminum chemical mechanical polishing and protective layer
US7316977B2 (en) * 2005-08-24 2008-01-08 Air Products And Chemicals, Inc. Chemical-mechanical planarization composition having ketooxime compounds and associated method for use
US8353740B2 (en) * 2005-09-09 2013-01-15 Saint-Gobain Ceramics & Plastics, Inc. Conductive hydrocarbon fluid
US7708904B2 (en) * 2005-09-09 2010-05-04 Saint-Gobain Ceramics & Plastics, Inc. Conductive hydrocarbon fluid
US7435162B2 (en) * 2005-10-24 2008-10-14 3M Innovative Properties Company Polishing fluids and methods for CMP
CN1955249B (zh) * 2005-10-28 2012-07-25 安集微电子（上海）有限公司 用于钽阻挡层的化学机械抛光浆料
US20070209287A1 (en) * 2006-03-13 2007-09-13 Cabot Microelectronics Corporation Composition and method to polish silicon nitride
PL1903081T3 (pl) * 2006-09-19 2015-05-29 Poligrat Gmbh Stabilizator do kwaśnych kąpieli polerskich zawierających metal
TWI386468B (zh) * 2006-12-20 2013-02-21 Saint Gobain Ceramics 加工無機非金屬工件之方法
US8083820B2 (en) * 2006-12-22 2011-12-27 3M Innovative Properties Company Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
US7497885B2 (en) * 2006-12-22 2009-03-03 3M Innovative Properties Company Abrasive articles with nanoparticulate fillers and method for making and using them
CN101358125B (zh) * 2007-08-03 2013-07-10 安集微电子（上海）有限公司 一种浓缩化学机械平坦化浆料产品及其使用方法
US8226841B2 (en) 2009-02-03 2012-07-24 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous memory disks
JP4949432B2 (ja) * 2009-05-15 2012-06-06 花王株式会社 ハードディスク用基板の製造方法
US20100288301A1 (en) * 2009-05-15 2010-11-18 Hui Hwang Kee Removing contaminants from an electroless nickel plated surface
WO2011054193A1 (zh) * 2009-11-06 2011-05-12 Wang Chen 一种化学机械抛光液
CN102911605A (zh) * 2011-08-05 2013-02-06 安集微电子（上海）有限公司 一种化学机械抛光液
CN102660198B (zh) * 2012-04-11 2013-10-16 南京航空航天大学 软脆易潮解晶体化学机械抛光用无水无磨料抛光液
US8778212B2 (en) * 2012-05-22 2014-07-15 Cabot Microelectronics Corporation CMP composition containing zirconia particles and method of use
US9039914B2 (en) 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
WO2015057433A1 (en) 2013-10-18 2015-04-23 Cabot Microelectronics Corporation Polishing composition and method for nickel-phosphorous coated memory disks
US9401104B2 (en) 2014-05-05 2016-07-26 Cabot Microelectronics Corporation Polishing composition for edge roll-off improvement
TWI561620B (en) * 2014-06-20 2016-12-11 Cabot Microelectronics Corp Cmp slurry compositions and methods for aluminum polishing
MY186924A (en) 2015-04-06 2021-08-26 Cmc Mat Inc Cmp composition and methods for polishing rigid disks
KR102238349B1 (ko) * 2016-05-03 2021-04-09 엘지전자 주식회사 리니어 압축기
CN105839111A (zh) * 2016-05-05 2016-08-10 西安热工研究院有限公司 一种制备ebsd样品的机械抛光液、制备方法及机械抛光方法
US10968377B2 (en) 2017-04-14 2021-04-06 Cmc Materials, Inc. Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
CN107267993B (zh) * 2017-05-25 2020-06-23 广西大学 双氧水体系抛光液以及在该双氧水体系抛光液中抛光thgem膜的方法
CN109848821A (zh) * 2018-12-28 2019-06-07 大连理工大学 一种镍合金的绿色环保化学机械抛光方法
MY201421A (en) 2019-01-11 2024-02-21 Cmc Mat Llc Dual additive composition for polishing memory hard disks exhibiting edge roll off
CN110183971A (zh) * 2019-06-28 2019-08-30 大连理工大学 一种整体叶轮的绿色环保混合化学机械抛光液与抛光方法
TWI861353B (zh) * 2020-01-31 2024-11-11 美商恩特葛瑞斯股份有限公司 用於研磨硬質材料之化學機械研磨(cmp)組合物
JP7457586B2 (ja) * 2020-06-18 2024-03-28 株式会社フジミインコーポレーテッド 研磨用組成物の濃縮液およびこれを用いた研磨方法

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US5437887A (en) 1993-12-22 1995-08-01 Enthone-Omi, Inc. Method of preparing aluminum memory disks
AU6537000A (en) 1999-08-13 2001-03-13 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
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US6293848B1 (en) * 1999-11-15 2001-09-25 Cabot Microelectronics Corporation Composition and method for planarizing surfaces
US6527817B1 (en) 1999-11-15 2003-03-04 Cabot Microelectronics Corporation Composition and method for planarizing surfaces
US6471884B1 (en) * 2000-04-04 2002-10-29 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with an amino acid-containing composition
US6569215B2 (en) * 2000-04-17 2003-05-27 Showa Denko Kabushiki Kaisha Composition for polishing magnetic disk substrate
US6461227B1 (en) * 2000-10-17 2002-10-08 Cabot Microelectronics Corporation Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition
US6805812B2 (en) 2001-10-11 2004-10-19 Cabot Microelectronics Corporation Phosphono compound-containing polishing composition and method of using same
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys

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