CN1284838C - 用于镍/磷合金的cmp配方 - Google Patents

用于镍/磷合金的cmp配方 Download PDF

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Publication number
CN1284838C
CN1284838C CN03804461.7A CN03804461A CN1284838C CN 1284838 C CN1284838 C CN 1284838C CN 03804461 A CN03804461 A CN 03804461A CN 1284838 C CN1284838 C CN 1284838C
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CN
China
Prior art keywords
weight
acid
accelerator
formulation
mixtures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN03804461.7A
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English (en)
Chinese (zh)
Other versions
CN1639288A (zh
Inventor
D·E·沃德
D·P·索罗莫斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Ceramics and Plastics Inc
Original Assignee
Saint Gobain Industrial Ceramics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Saint Gobain Industrial Ceramics Inc filed Critical Saint Gobain Industrial Ceramics Inc
Publication of CN1639288A publication Critical patent/CN1639288A/zh
Application granted granted Critical
Publication of CN1284838C publication Critical patent/CN1284838C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Detergent Compositions (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CN03804461.7A 2002-02-22 2003-02-18 用于镍/磷合金的cmp配方 Expired - Fee Related CN1284838C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/080,853 US6755721B2 (en) 2002-02-22 2002-02-22 Chemical mechanical polishing of nickel phosphorous alloys
US10/080,853 2002-02-22

Publications (2)

Publication Number Publication Date
CN1639288A CN1639288A (zh) 2005-07-13
CN1284838C true CN1284838C (zh) 2006-11-15

Family

ID=27765245

Family Applications (1)

Application Number Title Priority Date Filing Date
CN03804461.7A Expired - Fee Related CN1284838C (zh) 2002-02-22 2003-02-18 用于镍/磷合金的cmp配方

Country Status (6)

Country Link
US (3) US6755721B2 (https=)
EP (1) EP1476518A1 (https=)
JP (1) JP4202931B2 (https=)
CN (1) CN1284838C (https=)
AU (1) AU2003217577A1 (https=)
WO (1) WO2003072671A1 (https=)

Families Citing this family (44)

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US20040092103A1 (en) * 2000-07-19 2004-05-13 Shigeo Fujii Polishing fluid composition
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
US7553345B2 (en) 2002-12-26 2009-06-30 Kao Corporation Polishing composition
US8025808B2 (en) * 2003-04-25 2011-09-27 Saint-Gobain Ceramics & Plastics, Inc. Methods for machine ceramics
US7306748B2 (en) * 2003-04-25 2007-12-11 Saint-Gobain Ceramics & Plastics, Inc. Methods for machining ceramics
JP4202201B2 (ja) * 2003-07-03 2008-12-24 株式会社フジミインコーポレーテッド 研磨用組成物
JP4707311B2 (ja) * 2003-08-08 2011-06-22 花王株式会社 磁気ディスク用基板
JP4336550B2 (ja) * 2003-09-09 2009-09-30 花王株式会社 磁気ディスク用研磨液キット
US6964600B2 (en) 2003-11-21 2005-11-15 Praxair Technology, Inc. High selectivity colloidal silica slurry
TWI364450B (en) * 2004-08-09 2012-05-21 Kao Corp Polishing composition
JP4836441B2 (ja) * 2004-11-30 2011-12-14 花王株式会社 研磨液組成物
US7241692B2 (en) * 2005-07-26 2007-07-10 Semiconductor Manufacturing International (Shanghai) Corporation Method and structure for aluminum chemical mechanical polishing and protective layer
US7316977B2 (en) * 2005-08-24 2008-01-08 Air Products And Chemicals, Inc. Chemical-mechanical planarization composition having ketooxime compounds and associated method for use
US8353740B2 (en) * 2005-09-09 2013-01-15 Saint-Gobain Ceramics & Plastics, Inc. Conductive hydrocarbon fluid
US7708904B2 (en) * 2005-09-09 2010-05-04 Saint-Gobain Ceramics & Plastics, Inc. Conductive hydrocarbon fluid
US7435162B2 (en) * 2005-10-24 2008-10-14 3M Innovative Properties Company Polishing fluids and methods for CMP
CN1955249B (zh) * 2005-10-28 2012-07-25 安集微电子（上海）有限公司 用于钽阻挡层的化学机械抛光浆料
US20070209287A1 (en) * 2006-03-13 2007-09-13 Cabot Microelectronics Corporation Composition and method to polish silicon nitride
PL1903081T3 (pl) * 2006-09-19 2015-05-29 Poligrat Gmbh Stabilizator do kwaśnych kąpieli polerskich zawierających metal
TWI386468B (zh) * 2006-12-20 2013-02-21 Saint Gobain Ceramics 加工無機非金屬工件之方法
US8083820B2 (en) * 2006-12-22 2011-12-27 3M Innovative Properties Company Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
US7497885B2 (en) * 2006-12-22 2009-03-03 3M Innovative Properties Company Abrasive articles with nanoparticulate fillers and method for making and using them
CN101358125B (zh) * 2007-08-03 2013-07-10 安集微电子（上海）有限公司 一种浓缩化学机械平坦化浆料产品及其使用方法
US8226841B2 (en) 2009-02-03 2012-07-24 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous memory disks
JP4949432B2 (ja) * 2009-05-15 2012-06-06 花王株式会社 ハードディスク用基板の製造方法
US20100288301A1 (en) * 2009-05-15 2010-11-18 Hui Hwang Kee Removing contaminants from an electroless nickel plated surface
WO2011054193A1 (zh) * 2009-11-06 2011-05-12 Wang Chen 一种化学机械抛光液
CN102911605A (zh) * 2011-08-05 2013-02-06 安集微电子（上海）有限公司 一种化学机械抛光液
CN102660198B (zh) * 2012-04-11 2013-10-16 南京航空航天大学 软脆易潮解晶体化学机械抛光用无水无磨料抛光液
US8778212B2 (en) * 2012-05-22 2014-07-15 Cabot Microelectronics Corporation CMP composition containing zirconia particles and method of use
US9039914B2 (en) 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
WO2015057433A1 (en) 2013-10-18 2015-04-23 Cabot Microelectronics Corporation Polishing composition and method for nickel-phosphorous coated memory disks
US9401104B2 (en) 2014-05-05 2016-07-26 Cabot Microelectronics Corporation Polishing composition for edge roll-off improvement
TWI561620B (en) * 2014-06-20 2016-12-11 Cabot Microelectronics Corp Cmp slurry compositions and methods for aluminum polishing
MY186924A (en) 2015-04-06 2021-08-26 Cmc Mat Inc Cmp composition and methods for polishing rigid disks
KR102238349B1 (ko) * 2016-05-03 2021-04-09 엘지전자 주식회사 리니어 압축기
CN105839111A (zh) * 2016-05-05 2016-08-10 西安热工研究院有限公司 一种制备ebsd样品的机械抛光液、制备方法及机械抛光方法
US10968377B2 (en) 2017-04-14 2021-04-06 Cmc Materials, Inc. Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
CN107267993B (zh) * 2017-05-25 2020-06-23 广西大学 双氧水体系抛光液以及在该双氧水体系抛光液中抛光thgem膜的方法
CN109848821A (zh) * 2018-12-28 2019-06-07 大连理工大学 一种镍合金的绿色环保化学机械抛光方法
MY201421A (en) 2019-01-11 2024-02-21 Cmc Mat Llc Dual additive composition for polishing memory hard disks exhibiting edge roll off
CN110183971A (zh) * 2019-06-28 2019-08-30 大连理工大学 一种整体叶轮的绿色环保混合化学机械抛光液与抛光方法
TWI861353B (zh) * 2020-01-31 2024-11-11 美商恩特葛瑞斯股份有限公司 用於研磨硬質材料之化學機械研磨(cmp)組合物
JP7457586B2 (ja) * 2020-06-18 2024-03-28 株式会社フジミインコーポレーテッド 研磨用組成物の濃縮液およびこれを用いた研磨方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786564A (en) 1987-02-25 1988-11-22 Komag, Inc. Method for manufacturing a magnetic disk having reduced bit shift, minimized noise, increased resolution and uniform magnetic characteristics, and the resulting disk
US5437887A (en) 1993-12-22 1995-08-01 Enthone-Omi, Inc. Method of preparing aluminum memory disks
AU6537000A (en) 1999-08-13 2001-03-13 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
JP4273475B2 (ja) * 1999-09-21 2009-06-03 株式会社フジミインコーポレーテッド 研磨用組成物
US6293848B1 (en) * 1999-11-15 2001-09-25 Cabot Microelectronics Corporation Composition and method for planarizing surfaces
US6527817B1 (en) 1999-11-15 2003-03-04 Cabot Microelectronics Corporation Composition and method for planarizing surfaces
US6471884B1 (en) * 2000-04-04 2002-10-29 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with an amino acid-containing composition
US6569215B2 (en) * 2000-04-17 2003-05-27 Showa Denko Kabushiki Kaisha Composition for polishing magnetic disk substrate
US6461227B1 (en) * 2000-10-17 2002-10-08 Cabot Microelectronics Corporation Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition
US6805812B2 (en) 2001-10-11 2004-10-19 Cabot Microelectronics Corporation Phosphono compound-containing polishing composition and method of using same
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys

Also Published As

Publication number Publication date
CN1639288A (zh) 2005-07-13
AU2003217577A1 (en) 2003-09-09
JP4202931B2 (ja) 2008-12-24
EP1476518A1 (en) 2004-11-17
JP2005518473A (ja) 2005-06-23
WO2003072671A1 (en) 2003-09-04
US20030171072A1 (en) 2003-09-11
US6755721B2 (en) 2004-06-29
US6945851B2 (en) 2005-09-20
US20050020187A1 (en) 2005-01-27
US20050279030A1 (en) 2005-12-22

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Granted publication date: 20061115

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