JP2005517192A5 - - Google Patents

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Publication number
JP2005517192A5
JP2005517192A5 JP2003566894A JP2003566894A JP2005517192A5 JP 2005517192 A5 JP2005517192 A5 JP 2005517192A5 JP 2003566894 A JP2003566894 A JP 2003566894A JP 2003566894 A JP2003566894 A JP 2003566894A JP 2005517192 A5 JP2005517192 A5 JP 2005517192A5
Authority
JP
Japan
Prior art keywords
stage
electrical contact
electronic device
trench
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003566894A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005517192A (ja
Filing date
Publication date
Priority claimed from KR1020020006367A external-priority patent/KR100358513B1/ko
Priority claimed from KR10-2002-0068402A external-priority patent/KR100475468B1/ko
Application filed filed Critical
Priority claimed from PCT/KR2002/002073 external-priority patent/WO2003067650A1/en
Publication of JP2005517192A publication Critical patent/JP2005517192A/ja
Publication of JP2005517192A5 publication Critical patent/JP2005517192A5/ja
Pending legal-status Critical Current

Links

JP2003566894A 2002-02-05 2002-11-08 電子素子検査用の電気的接触体の製造方法及びこれによる電気的接触体 Pending JP2005517192A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020020006367A KR100358513B1 (en) 2002-02-05 2002-02-05 Method of fabricating electrical contactor for testing electronic device and electrical contactor fabricated thereby
KR10-2002-0068402A KR100475468B1 (ko) 2002-11-06 2002-11-06 전자소자 검사용 전기적 접촉체
PCT/KR2002/002073 WO2003067650A1 (en) 2002-02-05 2002-11-08 Method for manufacturing electric contact element for testing electro device and electric contact element thereby

Publications (2)

Publication Number Publication Date
JP2005517192A JP2005517192A (ja) 2005-06-09
JP2005517192A5 true JP2005517192A5 (enExample) 2006-10-19

Family

ID=36931458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003566894A Pending JP2005517192A (ja) 2002-02-05 2002-11-08 電子素子検査用の電気的接触体の製造方法及びこれによる電気的接触体

Country Status (6)

Country Link
US (2) US20040018752A1 (enExample)
JP (1) JP2005517192A (enExample)
CN (1) CN100423221C (enExample)
AU (1) AU2002353582A1 (enExample)
DE (1) DE10297653T5 (enExample)
WO (1) WO2003067650A1 (enExample)

Families Citing this family (30)

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KR100585561B1 (ko) * 2004-10-26 2006-06-07 주식회사 파이컴 수직형 전기적 접촉체 및 그 제조방법
KR100626570B1 (ko) * 2004-12-24 2006-09-25 주식회사 파이컴 감지용 프로브를 포함하는 프로브 카드 제작 방법 및 그프로브 카드, 프로브카드 검사 시스템
US7772859B2 (en) * 2005-08-01 2010-08-10 Touchdown Technologies, Inc. Probe for testing semiconductor devices with features that increase stress tolerance
US7362119B2 (en) * 2005-08-01 2008-04-22 Touchdown Technologies, Inc Torsion spring probe contactor design
US7589542B2 (en) * 2007-04-12 2009-09-15 Touchdown Technologies Inc. Hybrid probe for testing semiconductor devices
KR100653636B1 (ko) * 2005-08-03 2006-12-05 주식회사 파이컴 수직형 프로브, 그 제조 방법 및 프로브의 본딩 방법
KR100664443B1 (ko) * 2005-08-10 2007-01-03 주식회사 파이컴 캔틸레버형 프로브 및 그 제조 방법
TW200739083A (en) 2005-09-30 2007-10-16 Sv Probe Pte Ltd Cantilever probe structure for a probe card assembly
ITMI20052290A1 (it) * 2005-11-30 2007-06-01 Pasqua Roberto Della Servizio di messaggistica istantanea con interfaccia utente minimizzata
KR100749735B1 (ko) 2006-06-07 2007-08-16 주식회사 파이컴 캔틸레버형 프로브 제조 방법 및 이를 이용한 프로브 카드제조 방법
US20080011476A1 (en) * 2006-07-11 2008-01-17 Halliburton Energy Services, Inc. Methods for coating particulates with tackifying compounds
US7782072B2 (en) * 2006-09-27 2010-08-24 Formfactor, Inc. Single support structure probe group with staggered mounting pattern
JP2008151573A (ja) * 2006-12-15 2008-07-03 Micronics Japan Co Ltd 電気的接続装置およびその製造方法
JP4916893B2 (ja) * 2007-01-05 2012-04-18 株式会社日本マイクロニクス プローブの製造方法
JP2010533861A (ja) * 2007-07-16 2010-10-28 タッチダウン・テクノロジーズ・インコーポレーテッド 微小電気機械システムを修復するための装置及び方法
JP2009025107A (ja) * 2007-07-19 2009-02-05 Advanced Systems Japan Inc 凸形スパイラルコンタクタの製造方法
US7589547B2 (en) * 2007-09-13 2009-09-15 Touchdown Technologies, Inc. Forked probe for testing semiconductor devices
US20090072851A1 (en) * 2007-09-13 2009-03-19 Touchdown Technologies, Inc. Multi-Pivot Probe Card For Testing Semiconductor Devices
US20090144970A1 (en) * 2007-12-06 2009-06-11 Winmems Technologies Holdings Co., Ltd. Fabricating an array of mems parts on a substrate
US7811849B2 (en) * 2008-01-30 2010-10-12 Winmems Technologies Co., Ltd. Placing a MEMS part on an application platform using a guide mask
US20100013060A1 (en) * 2008-06-22 2010-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a conductive trench in a silicon wafer and silicon wafer comprising such trench
US8089294B2 (en) * 2008-08-05 2012-01-03 WinMENS Technologies Co., Ltd. MEMS probe fabrication on a reusable substrate for probe card application
US7737714B2 (en) * 2008-11-05 2010-06-15 Winmems Technologies Holdings Co., Ltd. Probe assembly arrangement
US7928751B2 (en) * 2009-02-18 2011-04-19 Winmems Technologies Holdings Co., Ltd. MEMS interconnection pins fabrication on a reusable substrate for probe card application
TWI417646B (zh) * 2010-03-29 2013-12-01 Pixart Imaging Inc 改善鎢沉積拓樸形貌之微機電系統光罩與方法
CN102219177A (zh) * 2010-04-14 2011-10-19 原相科技股份有限公司 改善钨沉积拓朴形貌的微机电系统光罩与方法
WO2013134564A1 (en) * 2012-03-07 2013-09-12 Advantest Corporation Transferring electronic probe assemblies to space transformers
CN110277437A (zh) * 2018-03-16 2019-09-24 张峻玮 一种外包覆式高效能低漏电流的肖基二极管结构及其制造方法

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US4916002A (en) * 1989-01-13 1990-04-10 The Board Of Trustees Of The Leland Jr. University Microcasting of microminiature tips
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US5177438A (en) * 1991-08-02 1993-01-05 Motorola, Inc. Low resistance probe for semiconductor
US6184053B1 (en) * 1993-11-16 2001-02-06 Formfactor, Inc. Method of making microelectronic spring contact elements
US6482013B2 (en) * 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
JP3502874B2 (ja) * 1994-06-03 2004-03-02 株式会社ルネサステクノロジ 接続装置およびその製造方法
JPH07333232A (ja) * 1994-06-13 1995-12-22 Canon Inc 探針を有するカンチレバーの形成方法
US5513430A (en) * 1994-08-19 1996-05-07 Motorola, Inc. Method for manufacturing a probe
AU6377796A (en) * 1995-05-26 1996-12-11 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substra tes
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CN1208624C (zh) * 1996-05-17 2005-06-29 福姆法克特公司 用于制造互连元件的方法
JP3123483B2 (ja) * 1997-10-28 2001-01-09 日本電気株式会社 プローブカード及びプローブカード形成方法
US6307932B1 (en) * 1998-03-31 2001-10-23 Avaya Technology Corp End-user control of audio delivery endpoint in a multimedia environment
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KR100317912B1 (ko) * 2000-02-03 2001-12-22 곽정환 근접장 광 센서용 서브-파장 구멍의 형성방법
US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
US6970005B2 (en) * 2000-08-24 2005-11-29 Texas Instruments Incorporated Multiple-chip probe and universal tester contact assemblage
JP2002071719A (ja) 2000-09-01 2002-03-12 Kobe Steel Ltd プローブカード及びその製造方法
US6811406B2 (en) * 2001-04-12 2004-11-02 Formfactor, Inc. Microelectronic spring with additional protruding member

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