CN100423221C - 测试电子装置用电接触元件的制造方法及所制得的电接触元件 - Google Patents

测试电子装置用电接触元件的制造方法及所制得的电接触元件 Download PDF

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Publication number
CN100423221C
CN100423221C CNB028277597A CN02827759A CN100423221C CN 100423221 C CN100423221 C CN 100423221C CN B028277597 A CNB028277597 A CN B028277597A CN 02827759 A CN02827759 A CN 02827759A CN 100423221 C CN100423221 C CN 100423221C
Authority
CN
China
Prior art keywords
electrical contact
contact element
trench
tip portion
beam portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028277597A
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English (en)
Chinese (zh)
Other versions
CN1618124A (zh
Inventor
李亿基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soulbrain ENG Co Ltd
Original Assignee
Phicom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020020006367A external-priority patent/KR100358513B1/ko
Priority claimed from KR10-2002-0068402A external-priority patent/KR100475468B1/ko
Application filed by Phicom Corp filed Critical Phicom Corp
Publication of CN1618124A publication Critical patent/CN1618124A/zh
Application granted granted Critical
Publication of CN100423221C publication Critical patent/CN100423221C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CNB028277597A 2002-02-05 2002-11-08 测试电子装置用电接触元件的制造方法及所制得的电接触元件 Expired - Fee Related CN100423221C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1020020006367A KR100358513B1 (en) 2002-02-05 2002-02-05 Method of fabricating electrical contactor for testing electronic device and electrical contactor fabricated thereby
KR20026367 2002-02-05
KR2002-6367 2002-02-05
KR1020020068402 2002-11-06
KR10-2002-0068402 2002-11-06
KR10-2002-0068402A KR100475468B1 (ko) 2002-11-06 2002-11-06 전자소자 검사용 전기적 접촉체

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2008101355299A Division CN101354405B (zh) 2002-02-05 2002-11-08 测试电子装置用电接触元件的制造方法及电接触元件

Publications (2)

Publication Number Publication Date
CN1618124A CN1618124A (zh) 2005-05-18
CN100423221C true CN100423221C (zh) 2008-10-01

Family

ID=36931458

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028277597A Expired - Fee Related CN100423221C (zh) 2002-02-05 2002-11-08 测试电子装置用电接触元件的制造方法及所制得的电接触元件

Country Status (6)

Country Link
US (2) US20040018752A1 (enExample)
JP (1) JP2005517192A (enExample)
CN (1) CN100423221C (enExample)
AU (1) AU2002353582A1 (enExample)
DE (1) DE10297653T5 (enExample)
WO (1) WO2003067650A1 (enExample)

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KR100585561B1 (ko) * 2004-10-26 2006-06-07 주식회사 파이컴 수직형 전기적 접촉체 및 그 제조방법
KR100626570B1 (ko) * 2004-12-24 2006-09-25 주식회사 파이컴 감지용 프로브를 포함하는 프로브 카드 제작 방법 및 그프로브 카드, 프로브카드 검사 시스템
US7772859B2 (en) * 2005-08-01 2010-08-10 Touchdown Technologies, Inc. Probe for testing semiconductor devices with features that increase stress tolerance
US7362119B2 (en) * 2005-08-01 2008-04-22 Touchdown Technologies, Inc Torsion spring probe contactor design
US7589542B2 (en) * 2007-04-12 2009-09-15 Touchdown Technologies Inc. Hybrid probe for testing semiconductor devices
KR100653636B1 (ko) * 2005-08-03 2006-12-05 주식회사 파이컴 수직형 프로브, 그 제조 방법 및 프로브의 본딩 방법
KR100664443B1 (ko) * 2005-08-10 2007-01-03 주식회사 파이컴 캔틸레버형 프로브 및 그 제조 방법
TW200739083A (en) 2005-09-30 2007-10-16 Sv Probe Pte Ltd Cantilever probe structure for a probe card assembly
ITMI20052290A1 (it) * 2005-11-30 2007-06-01 Pasqua Roberto Della Servizio di messaggistica istantanea con interfaccia utente minimizzata
KR100749735B1 (ko) 2006-06-07 2007-08-16 주식회사 파이컴 캔틸레버형 프로브 제조 방법 및 이를 이용한 프로브 카드제조 방법
US20080011476A1 (en) * 2006-07-11 2008-01-17 Halliburton Energy Services, Inc. Methods for coating particulates with tackifying compounds
US7782072B2 (en) * 2006-09-27 2010-08-24 Formfactor, Inc. Single support structure probe group with staggered mounting pattern
JP2008151573A (ja) * 2006-12-15 2008-07-03 Micronics Japan Co Ltd 電気的接続装置およびその製造方法
JP4916893B2 (ja) * 2007-01-05 2012-04-18 株式会社日本マイクロニクス プローブの製造方法
JP2010533861A (ja) * 2007-07-16 2010-10-28 タッチダウン・テクノロジーズ・インコーポレーテッド 微小電気機械システムを修復するための装置及び方法
JP2009025107A (ja) * 2007-07-19 2009-02-05 Advanced Systems Japan Inc 凸形スパイラルコンタクタの製造方法
US7589547B2 (en) * 2007-09-13 2009-09-15 Touchdown Technologies, Inc. Forked probe for testing semiconductor devices
US20090072851A1 (en) * 2007-09-13 2009-03-19 Touchdown Technologies, Inc. Multi-Pivot Probe Card For Testing Semiconductor Devices
US20090144970A1 (en) * 2007-12-06 2009-06-11 Winmems Technologies Holdings Co., Ltd. Fabricating an array of mems parts on a substrate
US7811849B2 (en) * 2008-01-30 2010-10-12 Winmems Technologies Co., Ltd. Placing a MEMS part on an application platform using a guide mask
US20100013060A1 (en) * 2008-06-22 2010-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a conductive trench in a silicon wafer and silicon wafer comprising such trench
US8089294B2 (en) * 2008-08-05 2012-01-03 WinMENS Technologies Co., Ltd. MEMS probe fabrication on a reusable substrate for probe card application
US7737714B2 (en) * 2008-11-05 2010-06-15 Winmems Technologies Holdings Co., Ltd. Probe assembly arrangement
US7928751B2 (en) * 2009-02-18 2011-04-19 Winmems Technologies Holdings Co., Ltd. MEMS interconnection pins fabrication on a reusable substrate for probe card application
TWI417646B (zh) * 2010-03-29 2013-12-01 Pixart Imaging Inc 改善鎢沉積拓樸形貌之微機電系統光罩與方法
CN102219177A (zh) * 2010-04-14 2011-10-19 原相科技股份有限公司 改善钨沉积拓朴形貌的微机电系统光罩与方法
WO2013134564A1 (en) * 2012-03-07 2013-09-12 Advantest Corporation Transferring electronic probe assemblies to space transformers
CN110277437A (zh) * 2018-03-16 2019-09-24 张峻玮 一种外包覆式高效能低漏电流的肖基二极管结构及其制造方法

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JPH07333232A (ja) * 1994-06-13 1995-12-22 Canon Inc 探針を有するカンチレバーの形成方法
JPH0850146A (ja) * 1994-06-03 1996-02-20 Hitachi Ltd 接続装置およびその製造方法
CN1194692A (zh) * 1996-05-17 1998-09-30 福姆法克特公司 用于微电子互连元件的接触端头结构及其制造方法
CN1208368A (zh) * 1995-05-26 1999-02-17 福姆法克特公司 利用牺牲基片制作互连件和接点
US6184053B1 (en) * 1993-11-16 2001-02-06 Formfactor, Inc. Method of making microelectronic spring contact elements
KR20010077628A (ko) * 2000-02-03 2001-08-20 최성수 근접장 광 센서용 서브-파장 구멍의 형성방법
US6307392B1 (en) * 1997-10-28 2001-10-23 Nec Corporation Probe card and method of forming a probe card

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US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
US6970005B2 (en) * 2000-08-24 2005-11-29 Texas Instruments Incorporated Multiple-chip probe and universal tester contact assemblage
JP2002071719A (ja) 2000-09-01 2002-03-12 Kobe Steel Ltd プローブカード及びその製造方法
US6811406B2 (en) * 2001-04-12 2004-11-02 Formfactor, Inc. Microelectronic spring with additional protruding member

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Publication number Priority date Publication date Assignee Title
US6184053B1 (en) * 1993-11-16 2001-02-06 Formfactor, Inc. Method of making microelectronic spring contact elements
JPH0850146A (ja) * 1994-06-03 1996-02-20 Hitachi Ltd 接続装置およびその製造方法
JPH07333232A (ja) * 1994-06-13 1995-12-22 Canon Inc 探針を有するカンチレバーの形成方法
CN1208368A (zh) * 1995-05-26 1999-02-17 福姆法克特公司 利用牺牲基片制作互连件和接点
CN1194692A (zh) * 1996-05-17 1998-09-30 福姆法克特公司 用于微电子互连元件的接触端头结构及其制造方法
US6307392B1 (en) * 1997-10-28 2001-10-23 Nec Corporation Probe card and method of forming a probe card
KR20010077628A (ko) * 2000-02-03 2001-08-20 최성수 근접장 광 센서용 서브-파장 구멍의 형성방법

Also Published As

Publication number Publication date
CN1618124A (zh) 2005-05-18
JP2005517192A (ja) 2005-06-09
US7579855B2 (en) 2009-08-25
DE10297653T5 (de) 2005-04-14
US20040018752A1 (en) 2004-01-29
AU2002353582A1 (en) 2003-09-02
WO2003067650A1 (en) 2003-08-14
US20060192581A1 (en) 2006-08-31

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Granted publication date: 20081001

Termination date: 20121108