JP2005517192A - 電子素子検査用の電気的接触体の製造方法及びこれによる電気的接触体 - Google Patents

電子素子検査用の電気的接触体の製造方法及びこれによる電気的接触体 Download PDF

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Publication number
JP2005517192A
JP2005517192A JP2003566894A JP2003566894A JP2005517192A JP 2005517192 A JP2005517192 A JP 2005517192A JP 2003566894 A JP2003566894 A JP 2003566894A JP 2003566894 A JP2003566894 A JP 2003566894A JP 2005517192 A JP2005517192 A JP 2005517192A
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JP
Japan
Prior art keywords
electrical contact
electronic device
trench
contact body
film pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003566894A
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English (en)
Japanese (ja)
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JP2005517192A5 (enExample
Inventor
オグ−キ・リー
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Individual
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Individual
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Publication date
Priority claimed from KR1020020006367A external-priority patent/KR100358513B1/ko
Priority claimed from KR10-2002-0068402A external-priority patent/KR100475468B1/ko
Application filed by Individual filed Critical Individual
Publication of JP2005517192A publication Critical patent/JP2005517192A/ja
Publication of JP2005517192A5 publication Critical patent/JP2005517192A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2003566894A 2002-02-05 2002-11-08 電子素子検査用の電気的接触体の製造方法及びこれによる電気的接触体 Pending JP2005517192A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020020006367A KR100358513B1 (en) 2002-02-05 2002-02-05 Method of fabricating electrical contactor for testing electronic device and electrical contactor fabricated thereby
KR10-2002-0068402A KR100475468B1 (ko) 2002-11-06 2002-11-06 전자소자 검사용 전기적 접촉체
PCT/KR2002/002073 WO2003067650A1 (en) 2002-02-05 2002-11-08 Method for manufacturing electric contact element for testing electro device and electric contact element thereby

Publications (2)

Publication Number Publication Date
JP2005517192A true JP2005517192A (ja) 2005-06-09
JP2005517192A5 JP2005517192A5 (enExample) 2006-10-19

Family

ID=36931458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003566894A Pending JP2005517192A (ja) 2002-02-05 2002-11-08 電子素子検査用の電気的接触体の製造方法及びこれによる電気的接触体

Country Status (6)

Country Link
US (2) US20040018752A1 (enExample)
JP (1) JP2005517192A (enExample)
CN (1) CN100423221C (enExample)
AU (1) AU2002353582A1 (enExample)
DE (1) DE10297653T5 (enExample)
WO (1) WO2003067650A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008151573A (ja) * 2006-12-15 2008-07-03 Micronics Japan Co Ltd 電気的接続装置およびその製造方法
JP2009503540A (ja) * 2005-08-01 2009-01-29 タッチダウン・テクノロジーズ・インコーポレーテッド トーションスプリングを備えたプローブコンタクタ
JP2009503537A (ja) * 2005-08-10 2009-01-29 パイコム コーポレーション カンチレバー型プローブ及びその製造方法
JP2009025107A (ja) * 2007-07-19 2009-02-05 Advanced Systems Japan Inc 凸形スパイラルコンタクタの製造方法
JP2009540291A (ja) * 2006-06-07 2009-11-19 パイコム コーポレイション カンチレバー型プローブ製造方法及びこれを用いるプローブカード製造方法
JP2010505130A (ja) * 2006-09-27 2010-02-18 フォームファクター， インコーポレイテッド 千鳥状の取り付けパターンを有する単一支持構造体のプローブ群
JP2010533861A (ja) * 2007-07-16 2010-10-28 タッチダウン・テクノロジーズ・インコーポレーテッド 微小電気機械システムを修復するための装置及び方法

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US7459795B2 (en) * 2004-08-19 2008-12-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
KR100586675B1 (ko) * 2004-09-22 2006-06-12 주식회사 파이컴 수직형 전기적 접촉체의 제조방법 및 이에 따른 수직형전기적 접촉체
KR100585561B1 (ko) * 2004-10-26 2006-06-07 주식회사 파이컴 수직형 전기적 접촉체 및 그 제조방법
KR100626570B1 (ko) * 2004-12-24 2006-09-25 주식회사 파이컴 감지용 프로브를 포함하는 프로브 카드 제작 방법 및 그프로브 카드, 프로브카드 검사 시스템
US7772859B2 (en) * 2005-08-01 2010-08-10 Touchdown Technologies, Inc. Probe for testing semiconductor devices with features that increase stress tolerance
US7589542B2 (en) * 2007-04-12 2009-09-15 Touchdown Technologies Inc. Hybrid probe for testing semiconductor devices
KR100653636B1 (ko) * 2005-08-03 2006-12-05 주식회사 파이컴 수직형 프로브, 그 제조 방법 및 프로브의 본딩 방법
TW200739083A (en) 2005-09-30 2007-10-16 Sv Probe Pte Ltd Cantilever probe structure for a probe card assembly
ITMI20052290A1 (it) * 2005-11-30 2007-06-01 Pasqua Roberto Della Servizio di messaggistica istantanea con interfaccia utente minimizzata
US20080011476A1 (en) * 2006-07-11 2008-01-17 Halliburton Energy Services, Inc. Methods for coating particulates with tackifying compounds
JP4916893B2 (ja) * 2007-01-05 2012-04-18 株式会社日本マイクロニクス プローブの製造方法
US7589547B2 (en) * 2007-09-13 2009-09-15 Touchdown Technologies, Inc. Forked probe for testing semiconductor devices
US20090072851A1 (en) * 2007-09-13 2009-03-19 Touchdown Technologies, Inc. Multi-Pivot Probe Card For Testing Semiconductor Devices
US20090144970A1 (en) * 2007-12-06 2009-06-11 Winmems Technologies Holdings Co., Ltd. Fabricating an array of mems parts on a substrate
US7811849B2 (en) * 2008-01-30 2010-10-12 Winmems Technologies Co., Ltd. Placing a MEMS part on an application platform using a guide mask
US20100013060A1 (en) * 2008-06-22 2010-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a conductive trench in a silicon wafer and silicon wafer comprising such trench
US8089294B2 (en) * 2008-08-05 2012-01-03 WinMENS Technologies Co., Ltd. MEMS probe fabrication on a reusable substrate for probe card application
US7737714B2 (en) * 2008-11-05 2010-06-15 Winmems Technologies Holdings Co., Ltd. Probe assembly arrangement
US7928751B2 (en) * 2009-02-18 2011-04-19 Winmems Technologies Holdings Co., Ltd. MEMS interconnection pins fabrication on a reusable substrate for probe card application
TWI417646B (zh) * 2010-03-29 2013-12-01 Pixart Imaging Inc 改善鎢沉積拓樸形貌之微機電系統光罩與方法
CN102219177A (zh) * 2010-04-14 2011-10-19 原相科技股份有限公司 改善钨沉积拓朴形貌的微机电系统光罩与方法
WO2013134564A1 (en) * 2012-03-07 2013-09-12 Advantest Corporation Transferring electronic probe assemblies to space transformers
CN110277437A (zh) * 2018-03-16 2019-09-24 张峻玮 一种外包覆式高效能低漏电流的肖基二极管结构及其制造方法

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US4998062A (en) 1988-10-25 1991-03-05 Tokyo Electron Limited Probe device having micro-strip line structure
US4916002A (en) * 1989-01-13 1990-04-10 The Board Of Trustees Of The Leland Jr. University Microcasting of microminiature tips
EP0413041B1 (en) * 1989-08-16 1992-07-15 International Business Machines Corporation Method of producing micromechanical sensors for the afm/stm profilometry and micromechanical afm/stm sensor head
US5177438A (en) * 1991-08-02 1993-01-05 Motorola, Inc. Low resistance probe for semiconductor
US6184053B1 (en) * 1993-11-16 2001-02-06 Formfactor, Inc. Method of making microelectronic spring contact elements
US6482013B2 (en) * 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
JP3502874B2 (ja) * 1994-06-03 2004-03-02 株式会社ルネサステクノロジ 接続装置およびその製造方法
JPH07333232A (ja) * 1994-06-13 1995-12-22 Canon Inc 探針を有するカンチレバーの形成方法
US5513430A (en) * 1994-08-19 1996-05-07 Motorola, Inc. Method for manufacturing a probe
AU6377796A (en) * 1995-05-26 1996-12-11 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substra tes
EP0839321B1 (en) * 1996-05-17 2006-01-11 FormFactor, Inc. Contact tip structures for microelectronic interconnection elements and methods of making same
CN1208624C (zh) * 1996-05-17 2005-06-29 福姆法克特公司 用于制造互连元件的方法
JP3123483B2 (ja) * 1997-10-28 2001-01-09 日本電気株式会社 プローブカード及びプローブカード形成方法
US6307932B1 (en) * 1998-03-31 2001-10-23 Avaya Technology Corp End-user control of audio delivery endpoint in a multimedia environment
US6414501B2 (en) * 1998-10-01 2002-07-02 Amst Co., Ltd. Micro cantilever style contact pin structure for wafer probing
KR100317912B1 (ko) * 2000-02-03 2001-12-22 곽정환 근접장 광 센서용 서브-파장 구멍의 형성방법
US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
US6970005B2 (en) * 2000-08-24 2005-11-29 Texas Instruments Incorporated Multiple-chip probe and universal tester contact assemblage
JP2002071719A (ja) 2000-09-01 2002-03-12 Kobe Steel Ltd プローブカード及びその製造方法
US6811406B2 (en) * 2001-04-12 2004-11-02 Formfactor, Inc. Microelectronic spring with additional protruding member

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009503540A (ja) * 2005-08-01 2009-01-29 タッチダウン・テクノロジーズ・インコーポレーテッド トーションスプリングを備えたプローブコンタクタ
JP2009503537A (ja) * 2005-08-10 2009-01-29 パイコム コーポレーション カンチレバー型プローブ及びその製造方法
JP2009540291A (ja) * 2006-06-07 2009-11-19 パイコム コーポレイション カンチレバー型プローブ製造方法及びこれを用いるプローブカード製造方法
US8114302B2 (en) 2006-06-07 2012-02-14 Phicom Corporation Method of fabricating cantilever type probe and method of fabricating probe card using the same
JP2010505130A (ja) * 2006-09-27 2010-02-18 フォームファクター， インコーポレイテッド 千鳥状の取り付けパターンを有する単一支持構造体のプローブ群
JP2008151573A (ja) * 2006-12-15 2008-07-03 Micronics Japan Co Ltd 電気的接続装置およびその製造方法
JP2010533861A (ja) * 2007-07-16 2010-10-28 タッチダウン・テクノロジーズ・インコーポレーテッド 微小電気機械システムを修復するための装置及び方法
JP2009025107A (ja) * 2007-07-19 2009-02-05 Advanced Systems Japan Inc 凸形スパイラルコンタクタの製造方法

Also Published As

Publication number Publication date
CN1618124A (zh) 2005-05-18
US7579855B2 (en) 2009-08-25
DE10297653T5 (de) 2005-04-14
CN100423221C (zh) 2008-10-01
US20040018752A1 (en) 2004-01-29
AU2002353582A1 (en) 2003-09-02
WO2003067650A1 (en) 2003-08-14
US20060192581A1 (en) 2006-08-31

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