DE10297653T5 - Verfahren zum Herstellen eines elektrischen Kontaktbauteils zur Prüfung einer elektrischen Vorrichtung und ein elektrisches Kontaktbauteil - Google Patents
Verfahren zum Herstellen eines elektrischen Kontaktbauteils zur Prüfung einer elektrischen Vorrichtung und ein elektrisches Kontaktbauteil Download PDFInfo
- Publication number
- DE10297653T5 DE10297653T5 DE10297653T DE10297653T DE10297653T5 DE 10297653 T5 DE10297653 T5 DE 10297653T5 DE 10297653 T DE10297653 T DE 10297653T DE 10297653 T DE10297653 T DE 10297653T DE 10297653 T5 DE10297653 T5 DE 10297653T5
- Authority
- DE
- Germany
- Prior art keywords
- section
- electrical contact
- trench
- contact component
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 170
- 230000001681 protective effect Effects 0.000 claims abstract description 134
- 239000000758 substrate Substances 0.000 claims abstract description 132
- 239000004020 conductor Substances 0.000 claims abstract description 42
- 238000005530 etching Methods 0.000 claims description 124
- 229920002120 photoresistant polymer Polymers 0.000 claims description 57
- 238000001039 wet etching Methods 0.000 claims description 36
- 238000009499 grossing Methods 0.000 claims description 22
- 230000015572 biosynthetic process Effects 0.000 claims description 20
- 238000005229 chemical vapour deposition Methods 0.000 claims description 17
- 238000005240 physical vapour deposition Methods 0.000 claims description 17
- 238000004380 ashing Methods 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 238000013461 design Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 230000002829 reductive effect Effects 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 10
- 238000001020 plasma etching Methods 0.000 claims description 10
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000005219 brazing Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
- 238000005498 polishing Methods 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims description 4
- 238000005246 galvanizing Methods 0.000 claims 3
- 230000001747 exhibiting effect Effects 0.000 claims 2
- 239000010408 film Substances 0.000 description 138
- 239000004065 semiconductor Substances 0.000 description 78
- 239000000126 substance Substances 0.000 description 22
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 12
- 230000004224 protection Effects 0.000 description 12
- 238000009713 electroplating Methods 0.000 description 10
- 239000002245 particle Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
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- 125000000896 monocarboxylic acid group Chemical group 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
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- 239000010703 silicon Substances 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000003245 working effect Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
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- 239000000523 sample Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
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- 230000000284 resting effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020006367A KR100358513B1 (en) | 2002-02-05 | 2002-02-05 | Method of fabricating electrical contactor for testing electronic device and electrical contactor fabricated thereby |
| KR2002-6367 | 2002-02-05 | ||
| KR10-2002-0068402 | 2002-11-06 | ||
| KR10-2002-0068402A KR100475468B1 (ko) | 2002-11-06 | 2002-11-06 | 전자소자 검사용 전기적 접촉체 |
| PCT/KR2002/002073 WO2003067650A1 (en) | 2002-02-05 | 2002-11-08 | Method for manufacturing electric contact element for testing electro device and electric contact element thereby |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10297653T5 true DE10297653T5 (de) | 2005-04-14 |
Family
ID=36931458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE10297653T Ceased DE10297653T5 (de) | 2002-02-05 | 2002-11-08 | Verfahren zum Herstellen eines elektrischen Kontaktbauteils zur Prüfung einer elektrischen Vorrichtung und ein elektrisches Kontaktbauteil |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20040018752A1 (enExample) |
| JP (1) | JP2005517192A (enExample) |
| CN (1) | CN100423221C (enExample) |
| AU (1) | AU2002353582A1 (enExample) |
| DE (1) | DE10297653T5 (enExample) |
| WO (1) | WO2003067650A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8114302B2 (en) | 2006-06-07 | 2012-02-14 | Phicom Corporation | Method of fabricating cantilever type probe and method of fabricating probe card using the same |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7459795B2 (en) * | 2004-08-19 | 2008-12-02 | Formfactor, Inc. | Method to build a wirebond probe card in a many at a time fashion |
| KR100586675B1 (ko) * | 2004-09-22 | 2006-06-12 | 주식회사 파이컴 | 수직형 전기적 접촉체의 제조방법 및 이에 따른 수직형전기적 접촉체 |
| KR100585561B1 (ko) * | 2004-10-26 | 2006-06-07 | 주식회사 파이컴 | 수직형 전기적 접촉체 및 그 제조방법 |
| KR100626570B1 (ko) * | 2004-12-24 | 2006-09-25 | 주식회사 파이컴 | 감지용 프로브를 포함하는 프로브 카드 제작 방법 및 그프로브 카드, 프로브카드 검사 시스템 |
| US7772859B2 (en) * | 2005-08-01 | 2010-08-10 | Touchdown Technologies, Inc. | Probe for testing semiconductor devices with features that increase stress tolerance |
| US7362119B2 (en) * | 2005-08-01 | 2008-04-22 | Touchdown Technologies, Inc | Torsion spring probe contactor design |
| US7589542B2 (en) * | 2007-04-12 | 2009-09-15 | Touchdown Technologies Inc. | Hybrid probe for testing semiconductor devices |
| KR100653636B1 (ko) * | 2005-08-03 | 2006-12-05 | 주식회사 파이컴 | 수직형 프로브, 그 제조 방법 및 프로브의 본딩 방법 |
| KR100664443B1 (ko) * | 2005-08-10 | 2007-01-03 | 주식회사 파이컴 | 캔틸레버형 프로브 및 그 제조 방법 |
| TW200739083A (en) | 2005-09-30 | 2007-10-16 | Sv Probe Pte Ltd | Cantilever probe structure for a probe card assembly |
| ITMI20052290A1 (it) * | 2005-11-30 | 2007-06-01 | Pasqua Roberto Della | Servizio di messaggistica istantanea con interfaccia utente minimizzata |
| US20080011476A1 (en) * | 2006-07-11 | 2008-01-17 | Halliburton Energy Services, Inc. | Methods for coating particulates with tackifying compounds |
| US7782072B2 (en) * | 2006-09-27 | 2010-08-24 | Formfactor, Inc. | Single support structure probe group with staggered mounting pattern |
| JP2008151573A (ja) * | 2006-12-15 | 2008-07-03 | Micronics Japan Co Ltd | 電気的接続装置およびその製造方法 |
| JP4916893B2 (ja) * | 2007-01-05 | 2012-04-18 | 株式会社日本マイクロニクス | プローブの製造方法 |
| JP2010533861A (ja) * | 2007-07-16 | 2010-10-28 | タッチダウン・テクノロジーズ・インコーポレーテッド | 微小電気機械システムを修復するための装置及び方法 |
| JP2009025107A (ja) * | 2007-07-19 | 2009-02-05 | Advanced Systems Japan Inc | 凸形スパイラルコンタクタの製造方法 |
| US7589547B2 (en) * | 2007-09-13 | 2009-09-15 | Touchdown Technologies, Inc. | Forked probe for testing semiconductor devices |
| US20090072851A1 (en) * | 2007-09-13 | 2009-03-19 | Touchdown Technologies, Inc. | Multi-Pivot Probe Card For Testing Semiconductor Devices |
| US20090144970A1 (en) * | 2007-12-06 | 2009-06-11 | Winmems Technologies Holdings Co., Ltd. | Fabricating an array of mems parts on a substrate |
| US7811849B2 (en) * | 2008-01-30 | 2010-10-12 | Winmems Technologies Co., Ltd. | Placing a MEMS part on an application platform using a guide mask |
| US20100013060A1 (en) * | 2008-06-22 | 2010-01-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming a conductive trench in a silicon wafer and silicon wafer comprising such trench |
| US8089294B2 (en) * | 2008-08-05 | 2012-01-03 | WinMENS Technologies Co., Ltd. | MEMS probe fabrication on a reusable substrate for probe card application |
| US7737714B2 (en) * | 2008-11-05 | 2010-06-15 | Winmems Technologies Holdings Co., Ltd. | Probe assembly arrangement |
| US7928751B2 (en) * | 2009-02-18 | 2011-04-19 | Winmems Technologies Holdings Co., Ltd. | MEMS interconnection pins fabrication on a reusable substrate for probe card application |
| TWI417646B (zh) * | 2010-03-29 | 2013-12-01 | Pixart Imaging Inc | 改善鎢沉積拓樸形貌之微機電系統光罩與方法 |
| CN102219177A (zh) * | 2010-04-14 | 2011-10-19 | 原相科技股份有限公司 | 改善钨沉积拓朴形貌的微机电系统光罩与方法 |
| WO2013134564A1 (en) * | 2012-03-07 | 2013-09-12 | Advantest Corporation | Transferring electronic probe assemblies to space transformers |
| CN110277437A (zh) * | 2018-03-16 | 2019-09-24 | 张峻玮 | 一种外包覆式高效能低漏电流的肖基二极管结构及其制造方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4998062A (en) | 1988-10-25 | 1991-03-05 | Tokyo Electron Limited | Probe device having micro-strip line structure |
| US4916002A (en) * | 1989-01-13 | 1990-04-10 | The Board Of Trustees Of The Leland Jr. University | Microcasting of microminiature tips |
| EP0413041B1 (en) * | 1989-08-16 | 1992-07-15 | International Business Machines Corporation | Method of producing micromechanical sensors for the afm/stm profilometry and micromechanical afm/stm sensor head |
| US5177438A (en) * | 1991-08-02 | 1993-01-05 | Motorola, Inc. | Low resistance probe for semiconductor |
| US6184053B1 (en) * | 1993-11-16 | 2001-02-06 | Formfactor, Inc. | Method of making microelectronic spring contact elements |
| US6482013B2 (en) * | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
| JP3502874B2 (ja) * | 1994-06-03 | 2004-03-02 | 株式会社ルネサステクノロジ | 接続装置およびその製造方法 |
| JPH07333232A (ja) * | 1994-06-13 | 1995-12-22 | Canon Inc | 探針を有するカンチレバーの形成方法 |
| US5513430A (en) * | 1994-08-19 | 1996-05-07 | Motorola, Inc. | Method for manufacturing a probe |
| AU6377796A (en) * | 1995-05-26 | 1996-12-11 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substra tes |
| EP0839321B1 (en) * | 1996-05-17 | 2006-01-11 | FormFactor, Inc. | Contact tip structures for microelectronic interconnection elements and methods of making same |
| CN1208624C (zh) * | 1996-05-17 | 2005-06-29 | 福姆法克特公司 | 用于制造互连元件的方法 |
| JP3123483B2 (ja) * | 1997-10-28 | 2001-01-09 | 日本電気株式会社 | プローブカード及びプローブカード形成方法 |
| US6307932B1 (en) * | 1998-03-31 | 2001-10-23 | Avaya Technology Corp | End-user control of audio delivery endpoint in a multimedia environment |
| US6414501B2 (en) * | 1998-10-01 | 2002-07-02 | Amst Co., Ltd. | Micro cantilever style contact pin structure for wafer probing |
| KR100317912B1 (ko) * | 2000-02-03 | 2001-12-22 | 곽정환 | 근접장 광 센서용 서브-파장 구멍의 형성방법 |
| US6426638B1 (en) * | 2000-05-02 | 2002-07-30 | Decision Track Llc | Compliant probe apparatus |
| US6970005B2 (en) * | 2000-08-24 | 2005-11-29 | Texas Instruments Incorporated | Multiple-chip probe and universal tester contact assemblage |
| JP2002071719A (ja) | 2000-09-01 | 2002-03-12 | Kobe Steel Ltd | プローブカード及びその製造方法 |
| US6811406B2 (en) * | 2001-04-12 | 2004-11-02 | Formfactor, Inc. | Microelectronic spring with additional protruding member |
-
2002
- 2002-11-08 DE DE10297653T patent/DE10297653T5/de not_active Ceased
- 2002-11-08 JP JP2003566894A patent/JP2005517192A/ja active Pending
- 2002-11-08 AU AU2002353582A patent/AU2002353582A1/en not_active Abandoned
- 2002-11-08 CN CNB028277597A patent/CN100423221C/zh not_active Expired - Fee Related
- 2002-11-08 WO PCT/KR2002/002073 patent/WO2003067650A1/en not_active Ceased
-
2003
- 2003-01-23 US US10/350,737 patent/US20040018752A1/en not_active Abandoned
-
2006
- 2006-02-13 US US11/352,658 patent/US7579855B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8114302B2 (en) | 2006-06-07 | 2012-02-14 | Phicom Corporation | Method of fabricating cantilever type probe and method of fabricating probe card using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1618124A (zh) | 2005-05-18 |
| JP2005517192A (ja) | 2005-06-09 |
| US7579855B2 (en) | 2009-08-25 |
| CN100423221C (zh) | 2008-10-01 |
| US20040018752A1 (en) | 2004-01-29 |
| AU2002353582A1 (en) | 2003-09-02 |
| WO2003067650A1 (en) | 2003-08-14 |
| US20060192581A1 (en) | 2006-08-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law |
Ref document number: 10297653 Country of ref document: DE Date of ref document: 20050414 Kind code of ref document: P |
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| 8125 | Change of the main classification |
Ipc: B81C 100 |
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| 8131 | Rejection |