JP2009164493A5 - - Google Patents

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Publication number
JP2009164493A5
JP2009164493A5 JP2008002649A JP2008002649A JP2009164493A5 JP 2009164493 A5 JP2009164493 A5 JP 2009164493A5 JP 2008002649 A JP2008002649 A JP 2008002649A JP 2008002649 A JP2008002649 A JP 2008002649A JP 2009164493 A5 JP2009164493 A5 JP 2009164493A5
Authority
JP
Japan
Prior art keywords
external connection
wiring board
wiring
viewed
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008002649A
Other languages
English (en)
Japanese (ja)
Other versions
JP4932744B2 (ja
JP2009164493A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008002649A priority Critical patent/JP4932744B2/ja
Priority claimed from JP2008002649A external-priority patent/JP4932744B2/ja
Priority to US12/332,572 priority patent/US7859121B2/en
Publication of JP2009164493A publication Critical patent/JP2009164493A/ja
Priority to US12/662,300 priority patent/US8062927B2/en
Publication of JP2009164493A5 publication Critical patent/JP2009164493A5/ja
Application granted granted Critical
Publication of JP4932744B2 publication Critical patent/JP4932744B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008002649A 2008-01-09 2008-01-09 配線基板及びその製造方法並びに電子部品装置及びその製造方法 Expired - Fee Related JP4932744B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008002649A JP4932744B2 (ja) 2008-01-09 2008-01-09 配線基板及びその製造方法並びに電子部品装置及びその製造方法
US12/332,572 US7859121B2 (en) 2008-01-09 2008-12-11 Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same
US12/662,300 US8062927B2 (en) 2008-01-09 2010-04-09 Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008002649A JP4932744B2 (ja) 2008-01-09 2008-01-09 配線基板及びその製造方法並びに電子部品装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009164493A JP2009164493A (ja) 2009-07-23
JP2009164493A5 true JP2009164493A5 (enExample) 2010-12-09
JP4932744B2 JP4932744B2 (ja) 2012-05-16

Family

ID=40843915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008002649A Expired - Fee Related JP4932744B2 (ja) 2008-01-09 2008-01-09 配線基板及びその製造方法並びに電子部品装置及びその製造方法

Country Status (2)

Country Link
US (2) US7859121B2 (enExample)
JP (1) JP4932744B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5367523B2 (ja) * 2009-09-25 2013-12-11 新光電気工業株式会社 配線基板及び配線基板の製造方法
US8632016B2 (en) * 2011-07-11 2014-01-21 George Schmitt & Company, Inc. RFID chip employing an air gap buffer
JP6520481B2 (ja) * 2015-06-30 2019-05-29 富士電機株式会社 電子部品モジュール
KR102827265B1 (ko) * 2019-03-25 2025-07-01 삼성디스플레이 주식회사 회로기판 및 이의 제조방법
JP2025015329A (ja) * 2023-07-20 2025-01-30 株式会社ジャパンディスプレイ 表示装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3058409B2 (ja) * 1998-01-05 2000-07-04 日本電気株式会社 半導体チップの実装方法および実装構造
JP3753218B2 (ja) * 1998-03-23 2006-03-08 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
JP4207033B2 (ja) 1998-03-23 2009-01-14 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
JP2000077477A (ja) * 1998-09-02 2000-03-14 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法並びにこれに用いる金属基板
US6183267B1 (en) * 1999-03-11 2001-02-06 Murray Hill Devices Ultra-miniature electrical contacts and method of manufacture
US6815329B2 (en) * 2000-02-08 2004-11-09 International Business Machines Corporation Multilayer interconnect structure containing air gaps and method for making
JP2003224229A (ja) * 2003-02-07 2003-08-08 Hitachi Ltd ボールグリッドアレイ型半導体装置
JP2005340761A (ja) * 2004-04-27 2005-12-08 Seiko Epson Corp 半導体装置の実装方法、回路基板、電気光学装置並びに電子機器
JP4095049B2 (ja) * 2004-08-30 2008-06-04 シャープ株式会社 電極気密封止を用いた高信頼性半導体装置

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