|
EP1176496A1
(en)
*
|
2000-07-24 |
2002-01-30 |
Hewlett-Packard Company, A Delaware Corporation |
Voltage regulation in an integrated circuit
|
|
WO2002096166A1
(en)
*
|
2001-05-18 |
2002-11-28 |
Corporation For National Research Initiatives |
Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates
|
|
US7032392B2
(en)
*
|
2001-12-19 |
2006-04-25 |
Intel Corporation |
Method and apparatus for cooling an integrated circuit package using a cooling fluid
|
|
US6891385B2
(en)
*
|
2001-12-27 |
2005-05-10 |
Formfactor, Inc. |
Probe card cooling assembly with direct cooling of active electronic components
|
|
US7064953B2
(en)
*
|
2001-12-27 |
2006-06-20 |
Formfactor, Inc. |
Electronic package with direct cooling of active electronic components
|
|
US6606251B1
(en)
*
|
2002-02-07 |
2003-08-12 |
Cooligy Inc. |
Power conditioning module
|
|
US6736192B2
(en)
*
|
2002-03-08 |
2004-05-18 |
Ting-Fei Wang |
CPU cooler
|
|
US6673649B1
(en)
*
|
2002-07-05 |
2004-01-06 |
Micron Technology, Inc. |
Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
|
|
US6988534B2
(en)
|
2002-11-01 |
2006-01-24 |
Cooligy, Inc. |
Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
|
|
AU2003270882A1
(en)
|
2002-09-23 |
2004-05-04 |
Cooligy, Inc. |
Micro-fabricated electrokinetic pump with on-frit electrode
|
|
US6994151B2
(en)
|
2002-10-22 |
2006-02-07 |
Cooligy, Inc. |
Vapor escape microchannel heat exchanger
|
|
US7156159B2
(en)
|
2003-03-17 |
2007-01-02 |
Cooligy, Inc. |
Multi-level microchannel heat exchangers
|
|
US7836597B2
(en)
|
2002-11-01 |
2010-11-23 |
Cooligy Inc. |
Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
|
|
US6986382B2
(en)
|
2002-11-01 |
2006-01-17 |
Cooligy Inc. |
Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
|
|
WO2004042306A2
(en)
|
2002-11-01 |
2004-05-21 |
Cooligy, Inc. |
Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
|
|
US7000684B2
(en)
|
2002-11-01 |
2006-02-21 |
Cooligy, Inc. |
Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
|
|
US6988535B2
(en)
*
|
2002-11-01 |
2006-01-24 |
Cooligy, Inc. |
Channeled flat plate fin heat exchange system, device and method
|
|
US8464781B2
(en)
|
2002-11-01 |
2013-06-18 |
Cooligy Inc. |
Cooling systems incorporating heat exchangers and thermoelectric layers
|
|
US7201012B2
(en)
|
2003-01-31 |
2007-04-10 |
Cooligy, Inc. |
Remedies to prevent cracking in a liquid system
|
|
US7044196B2
(en)
*
|
2003-01-31 |
2006-05-16 |
Cooligy,Inc |
Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
|
|
US7090001B2
(en)
|
2003-01-31 |
2006-08-15 |
Cooligy, Inc. |
Optimized multiple heat pipe blocks for electronics cooling
|
|
US7293423B2
(en)
|
2004-06-04 |
2007-11-13 |
Cooligy Inc. |
Method and apparatus for controlling freezing nucleation and propagation
|
|
US7017654B2
(en)
|
2003-03-17 |
2006-03-28 |
Cooligy, Inc. |
Apparatus and method of forming channels in a heat-exchanging device
|
|
US7126822B2
(en)
|
2003-03-31 |
2006-10-24 |
Intel Corporation |
Electronic packages, assemblies, and systems with fluid cooling
|
|
US7170155B2
(en)
*
|
2003-06-25 |
2007-01-30 |
Intel Corporation |
MEMS RF switch module including a vertical via
|
|
JP3778910B2
(ja)
*
|
2003-12-15 |
2006-05-24 |
株式会社ソニー・コンピュータエンタテインメント |
電子デバイス冷却装置、電子デバイス冷却方法および電子デバイス冷却制御プログラム
|
|
GB0410850D0
(en)
*
|
2004-05-14 |
2004-06-16 |
Cambridge Consultants |
Cooling
|
|
US7188662B2
(en)
|
2004-06-04 |
2007-03-13 |
Cooligy, Inc. |
Apparatus and method of efficient fluid delivery for cooling a heat producing device
|
|
US20050269691A1
(en)
*
|
2004-06-04 |
2005-12-08 |
Cooligy, Inc. |
Counter flow micro heat exchanger for optimal performance
|
|
US7616444B2
(en)
|
2004-06-04 |
2009-11-10 |
Cooligy Inc. |
Gimballed attachment for multiple heat exchangers
|
|
US7768619B2
(en)
*
|
2004-08-03 |
2010-08-03 |
Harris Corporation |
Method and apparatus for sealing flex circuits made with an LCP substrate
|
|
DE102005013762C5
(de)
*
|
2005-03-22 |
2012-12-20 |
Sew-Eurodrive Gmbh & Co. Kg |
Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
|
|
US7492595B2
(en)
*
|
2005-03-31 |
2009-02-17 |
Tecnisco Limited |
Semiconductor cooling device and stack of semiconductor cooling devices
|
|
US7516776B2
(en)
*
|
2005-05-19 |
2009-04-14 |
International Business Machines Corporation |
Microjet module assembly
|
|
US7255153B2
(en)
*
|
2005-05-25 |
2007-08-14 |
International Business Machines Corporation |
High performance integrated MLC cooling device for high power density ICS and method for manufacturing
|
|
JP5137379B2
(ja)
*
|
2005-11-14 |
2013-02-06 |
インターナショナル・ビジネス・マシーンズ・コーポレーション |
衝突冷却器
|
|
US7272005B2
(en)
*
|
2005-11-30 |
2007-09-18 |
International Business Machines Corporation |
Multi-element heat exchange assemblies and methods of fabrication for a cooling system
|
|
US20070126103A1
(en)
*
|
2005-12-01 |
2007-06-07 |
Intel Corporation |
Microelectronic 3-D package defining thermal through vias and method of making same
|
|
DE102005058780A1
(de)
*
|
2005-12-09 |
2007-06-14 |
Forschungszentrum Karlsruhe Gmbh |
Mikrowärmeübertrager sowie die Verwendung desselben als Fluidkühler für elektronische Bauteile
|
|
US7515415B2
(en)
*
|
2006-02-02 |
2009-04-07 |
Sun Microsystems, Inc. |
Embedded microchannel cooling package for a central processor unit
|
|
TW200810676A
(en)
|
2006-03-30 |
2008-02-16 |
Cooligy Inc |
Multi device cooling
|
|
US7536870B2
(en)
*
|
2006-03-30 |
2009-05-26 |
International Business Machines Corporation |
High power microjet cooler
|
|
US7715194B2
(en)
|
2006-04-11 |
2010-05-11 |
Cooligy Inc. |
Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
|
|
US7709296B2
(en)
|
2006-10-19 |
2010-05-04 |
International Business Machines Corporation |
Coupling metal clad fiber optics for enhanced heat dissipation
|
|
KR100906797B1
(ko)
*
|
2007-06-20 |
2009-07-09 |
삼성전기주식회사 |
냉각부를 갖는 광변조기 패키지, 광변조기의 냉각방법 및냉각방법을 수행하기 위한 프로그램이 기록된 기록매체
|
|
TW200912621A
(en)
|
2007-08-07 |
2009-03-16 |
Cooligy Inc |
Method and apparatus for providing a supplemental cooling to server racks
|
|
WO2009042232A1
(en)
*
|
2007-09-25 |
2009-04-02 |
Flextronics Ap, Llc |
Thermally enhanced magnetic transformer
|
|
US8106505B2
(en)
|
2007-10-31 |
2012-01-31 |
International Business Machines Corporation |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
|
|
US20090225514A1
(en)
|
2008-03-10 |
2009-09-10 |
Adrian Correa |
Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
|
|
US9297571B1
(en)
|
2008-03-10 |
2016-03-29 |
Liebert Corporation |
Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
|
|
JP5181874B2
(ja)
*
|
2008-06-30 |
2013-04-10 |
富士通株式会社 |
ループヒートパイプおよび電子機器
|
|
CN101958297A
(zh)
*
|
2009-07-16 |
2011-01-26 |
王玉富 |
阵列柔性焊柱连接蒸发冷却半导体器件封装
|
|
US8427832B2
(en)
|
2011-01-05 |
2013-04-23 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Cold plate assemblies and power electronics modules
|
|
US8391008B2
(en)
*
|
2011-02-17 |
2013-03-05 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Power electronics modules and power electronics module assemblies
|
|
EP2736981A4
(en)
*
|
2011-07-29 |
2015-03-25 |
SiOx ApS |
CORROSION PROTECTION WITH REACTIVE SILICONE OXIDE PROCESSORS
|
|
US8565970B2
(en)
*
|
2011-08-17 |
2013-10-22 |
GM Global Technology Operations LLC |
Method for controlling powertrain pumps
|
|
DE102012207196A1
(de)
|
2012-04-30 |
2013-10-31 |
Robert Bosch Gmbh |
Energiequelle und Verfahren zur Versorgung eines autarken elektrischen Verbrauchersystems und eine Verwendung derselben
|
|
US9035452B2
(en)
*
|
2012-08-07 |
2015-05-19 |
General Electric Company |
Electronic device cooling with autonomous fluid routing and method of assembly
|
|
US8643173B1
(en)
|
2013-01-04 |
2014-02-04 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
|
|
US9131631B2
(en)
|
2013-08-08 |
2015-09-08 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Jet impingement cooling apparatuses having enhanced heat transfer assemblies
|
|
US20160093553A1
(en)
*
|
2014-09-25 |
2016-03-31 |
Mani Prakash |
On demand cooling of an nvm using a peltier device
|
|
RU2620732C1
(ru)
*
|
2016-06-27 |
2017-05-29 |
Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) |
Устройство формирования пристенных капельных течений жидкости в микро- и мини-каналах
|
|
CN106409790B
(zh)
*
|
2016-08-27 |
2018-08-28 |
电子科技大学 |
一种强效的芯片散热器
|
|
IT201600104601A1
(it)
|
2016-10-18 |
2018-04-18 |
Menarini Silicon Biosystems Spa |
Sistema microfluidico
|
|
CN107293496B
(zh)
*
|
2017-05-09 |
2019-09-27 |
中国电子科技集团公司第五十五研究所 |
芯片级集成微流体散热模块及制备方法
|
|
CN107949242B
(zh)
*
|
2017-11-17 |
2020-08-28 |
珠海诚然科技服务有限公司 |
一种环保设备用双排散热器
|
|
CN110034082B
(zh)
*
|
2018-01-12 |
2021-01-01 |
创意电子股份有限公司 |
具有主动式散热的电子装置
|
|
US10490482B1
(en)
*
|
2018-12-05 |
2019-11-26 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Cooling devices including jet cooling with an intermediate mesh and methods for using the same
|
|
WO2020210587A1
(en)
|
2019-04-10 |
2020-10-15 |
Jetcool Technologies, Inc. |
Thermal management of electronics using co-located microjet nozzles and electronic elements
|
|
EP3977832B1
(en)
*
|
2019-04-14 |
2025-06-04 |
Jetcool Technologies, Inc. |
Direct contact fluid based cooling module
|
|
US20210134510A1
(en)
*
|
2019-10-31 |
2021-05-06 |
Analog Devices International Unlimited Company |
Electronic device
|
|
WO2022060898A1
(en)
|
2020-09-15 |
2022-03-24 |
Jetcool Technologies Inc. |
High temperature electronic device thermal management system
|
|
US12289871B2
(en)
|
2020-09-15 |
2025-04-29 |
Jetcool Technologies Inc. |
High temperature electronic device thermal management system
|
|
US20230392836A1
(en)
*
|
2020-12-02 |
2023-12-07 |
Danfoss A/S |
Motor cooling using impingement jets created by perforated cooling jacket
|
|
TW202236557A
(zh)
|
2021-01-20 |
2022-09-16 |
美商捷控技術有限公司 |
用於多晶電子組件之基板防流體的順應性冷卻組件
|
|
US12048118B2
(en)
|
2021-08-13 |
2024-07-23 |
Jetcool Technologies Inc. |
Flow-through, hot-spot-targeting immersion cooling assembly
|
|
US12315776B2
(en)
|
2021-11-08 |
2025-05-27 |
Analog Devices, Inc. |
Integrated device package with an integrated heat sink
|
|
US12289861B2
(en)
|
2021-11-12 |
2025-04-29 |
Jetcool Technologies Inc. |
Liquid-in-liquid cooling system for electronic components
|
|
TW202407925A
(zh)
|
2022-03-04 |
2024-02-16 |
美商捷控技術有限公司 |
用於電腦處理器及處理器組件之主動冷卻散熱蓋
|