CN1322582C - 使用蒸发微冷却的电子学器件和相关方法 - Google Patents

使用蒸发微冷却的电子学器件和相关方法 Download PDF

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Publication number
CN1322582C
CN1322582C CNB018221297A CN01822129A CN1322582C CN 1322582 C CN1322582 C CN 1322582C CN B018221297 A CNB018221297 A CN B018221297A CN 01822129 A CN01822129 A CN 01822129A CN 1322582 C CN1322582 C CN 1322582C
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China
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integrated circuit
pair
electronic device
package
microfluidic
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Expired - Fee Related
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CNB018221297A
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English (en)
Chinese (zh)
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CN1502130A (zh
Inventor
查尔斯·M·牛顿
兰迪·T·派克
理查德·A·格斯曼
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Harrier Inc
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Harrier Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Micromachines (AREA)
CNB018221297A 2000-12-19 2001-12-11 使用蒸发微冷却的电子学器件和相关方法 Expired - Fee Related CN1322582C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/741,772 US6459581B1 (en) 2000-12-19 2000-12-19 Electronic device using evaporative micro-cooling and associated methods
US09/741,772 2000-12-19

Publications (2)

Publication Number Publication Date
CN1502130A CN1502130A (zh) 2004-06-02
CN1322582C true CN1322582C (zh) 2007-06-20

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Family Applications (1)

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CNB018221297A Expired - Fee Related CN1322582C (zh) 2000-12-19 2001-12-11 使用蒸发微冷却的电子学器件和相关方法

Country Status (7)

Country Link
US (1) US6459581B1 (enExample)
EP (1) EP1362370A2 (enExample)
JP (1) JP2005501392A (enExample)
KR (1) KR100553170B1 (enExample)
CN (1) CN1322582C (enExample)
AU (1) AU2002226065A1 (enExample)
WO (1) WO2002050901A2 (enExample)

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Also Published As

Publication number Publication date
EP1362370A2 (en) 2003-11-19
US20020075651A1 (en) 2002-06-20
KR100553170B1 (ko) 2006-02-21
WO2002050901A2 (en) 2002-06-27
CN1502130A (zh) 2004-06-02
JP2005501392A (ja) 2005-01-13
WO2002050901A3 (en) 2003-09-12
US6459581B1 (en) 2002-10-01
KR20040014438A (ko) 2004-02-14
AU2002226065A1 (en) 2002-07-01

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