KR100553170B1 - 증발성 미세-쿨링 전자장치 및 그 쿨링 방법 - Google Patents

증발성 미세-쿨링 전자장치 및 그 쿨링 방법 Download PDF

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Publication number
KR100553170B1
KR100553170B1 KR1020037008196A KR20037008196A KR100553170B1 KR 100553170 B1 KR100553170 B1 KR 100553170B1 KR 1020037008196 A KR1020037008196 A KR 1020037008196A KR 20037008196 A KR20037008196 A KR 20037008196A KR 100553170 B1 KR100553170 B1 KR 100553170B1
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South Korea
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micro
integrated circuit
pair
cooling
package
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Korean (ko)
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KR20040014438A (ko
Inventor
뉴튼찰스엠.
파이크랜디티.
가스만리차드에이.
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해리스 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Micromachines (AREA)
KR1020037008196A 2000-12-19 2001-12-11 증발성 미세-쿨링 전자장치 및 그 쿨링 방법 Expired - Lifetime KR100553170B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/741,772 US6459581B1 (en) 2000-12-19 2000-12-19 Electronic device using evaporative micro-cooling and associated methods
US09/741,772 2000-12-19
PCT/US2001/047637 WO2002050901A2 (en) 2000-12-19 2001-12-11 Electronic device using evaporative micro-cooling and associated methods

Publications (2)

Publication Number Publication Date
KR20040014438A KR20040014438A (ko) 2004-02-14
KR100553170B1 true KR100553170B1 (ko) 2006-02-21

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KR1020037008196A Expired - Lifetime KR100553170B1 (ko) 2000-12-19 2001-12-11 증발성 미세-쿨링 전자장치 및 그 쿨링 방법

Country Status (7)

Country Link
US (1) US6459581B1 (enExample)
EP (1) EP1362370A2 (enExample)
JP (1) JP2005501392A (enExample)
KR (1) KR100553170B1 (enExample)
CN (1) CN1322582C (enExample)
AU (1) AU2002226065A1 (enExample)
WO (1) WO2002050901A2 (enExample)

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Also Published As

Publication number Publication date
EP1362370A2 (en) 2003-11-19
US20020075651A1 (en) 2002-06-20
WO2002050901A2 (en) 2002-06-27
CN1502130A (zh) 2004-06-02
JP2005501392A (ja) 2005-01-13
WO2002050901A3 (en) 2003-09-12
US6459581B1 (en) 2002-10-01
KR20040014438A (ko) 2004-02-14
AU2002226065A1 (en) 2002-07-01
CN1322582C (zh) 2007-06-20

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