AU2002226065A1 - Electronic device using evaporative micro-cooling and associated methods - Google Patents

Electronic device using evaporative micro-cooling and associated methods

Info

Publication number
AU2002226065A1
AU2002226065A1 AU2002226065A AU2606502A AU2002226065A1 AU 2002226065 A1 AU2002226065 A1 AU 2002226065A1 AU 2002226065 A AU2002226065 A AU 2002226065A AU 2606502 A AU2606502 A AU 2606502A AU 2002226065 A1 AU2002226065 A1 AU 2002226065A1
Authority
AU
Australia
Prior art keywords
cooling
electronic device
associated methods
evaporative
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002226065A
Other languages
English (en)
Inventor
Richard A. Gassman
Charles M. Newton
Randy T. Pike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of AU2002226065A1 publication Critical patent/AU2002226065A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Micromachines (AREA)
AU2002226065A 2000-12-19 2001-12-11 Electronic device using evaporative micro-cooling and associated methods Abandoned AU2002226065A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/741,772 US6459581B1 (en) 2000-12-19 2000-12-19 Electronic device using evaporative micro-cooling and associated methods
US09/741,772 2000-12-19
PCT/US2001/047637 WO2002050901A2 (en) 2000-12-19 2001-12-11 Electronic device using evaporative micro-cooling and associated methods

Publications (1)

Publication Number Publication Date
AU2002226065A1 true AU2002226065A1 (en) 2002-07-01

Family

ID=24982125

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002226065A Abandoned AU2002226065A1 (en) 2000-12-19 2001-12-11 Electronic device using evaporative micro-cooling and associated methods

Country Status (7)

Country Link
US (1) US6459581B1 (enExample)
EP (1) EP1362370A2 (enExample)
JP (1) JP2005501392A (enExample)
KR (1) KR100553170B1 (enExample)
CN (1) CN1322582C (enExample)
AU (1) AU2002226065A1 (enExample)
WO (1) WO2002050901A2 (enExample)

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Also Published As

Publication number Publication date
EP1362370A2 (en) 2003-11-19
US20020075651A1 (en) 2002-06-20
KR100553170B1 (ko) 2006-02-21
WO2002050901A2 (en) 2002-06-27
CN1502130A (zh) 2004-06-02
JP2005501392A (ja) 2005-01-13
WO2002050901A3 (en) 2003-09-12
US6459581B1 (en) 2002-10-01
KR20040014438A (ko) 2004-02-14
CN1322582C (zh) 2007-06-20

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