JP2005501392A - 蒸発マイクロ冷却を用いる電子装置および関連する方法 - Google Patents

蒸発マイクロ冷却を用いる電子装置および関連する方法 Download PDF

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Publication number
JP2005501392A
JP2005501392A JP2002551905A JP2002551905A JP2005501392A JP 2005501392 A JP2005501392 A JP 2005501392A JP 2002551905 A JP2002551905 A JP 2002551905A JP 2002551905 A JP2002551905 A JP 2002551905A JP 2005501392 A JP2005501392 A JP 2005501392A
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Prior art keywords
electronic device
integrated circuit
pair
package
microfluidic
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Pending
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JP2002551905A
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Japanese (ja)
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JP2005501392A5 (enExample
Inventor
エム ニュートン，チャールズ
ティー パイク，ランディー
エイ ギャスマン，リチャード
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Harris Corp
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Harris Corp
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Application filed by Harris Corp filed Critical Harris Corp
Publication of JP2005501392A publication Critical patent/JP2005501392A/ja
Publication of JP2005501392A5 publication Critical patent/JP2005501392A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Micromachines (AREA)
JP2002551905A 2000-12-19 2001-12-11 蒸発マイクロ冷却を用いる電子装置および関連する方法 Pending JP2005501392A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/741,772 US6459581B1 (en) 2000-12-19 2000-12-19 Electronic device using evaporative micro-cooling and associated methods
PCT/US2001/047637 WO2002050901A2 (en) 2000-12-19 2001-12-11 Electronic device using evaporative micro-cooling and associated methods

Publications (2)

Publication Number Publication Date
JP2005501392A true JP2005501392A (ja) 2005-01-13
JP2005501392A5 JP2005501392A5 (enExample) 2005-04-28

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Application Number Title Priority Date Filing Date
JP2002551905A Pending JP2005501392A (ja) 2000-12-19 2001-12-11 蒸発マイクロ冷却を用いる電子装置および関連する方法

Country Status (7)

Country Link
US (1) US6459581B1 (enExample)
EP (1) EP1362370A2 (enExample)
JP (1) JP2005501392A (enExample)
KR (1) KR100553170B1 (enExample)
CN (1) CN1322582C (enExample)
AU (1) AU2002226065A1 (enExample)
WO (1) WO2002050901A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010008025A (ja) * 2008-06-30 2010-01-14 Fujitsu Ltd ループヒートパイプおよび電子機器

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1176496A1 (en) * 2000-07-24 2002-01-30 Hewlett-Packard Company, A Delaware Corporation Voltage regulation in an integrated circuit
WO2002096166A1 (en) * 2001-05-18 2002-11-28 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates
US7032392B2 (en) * 2001-12-19 2006-04-25 Intel Corporation Method and apparatus for cooling an integrated circuit package using a cooling fluid
US6891385B2 (en) * 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US7064953B2 (en) * 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
US6606251B1 (en) * 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US6736192B2 (en) * 2002-03-08 2004-05-18 Ting-Fei Wang CPU cooler
US6673649B1 (en) * 2002-07-05 2004-01-06 Micron Technology, Inc. Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
US6988534B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
AU2003270882A1 (en) 2002-09-23 2004-05-04 Cooligy, Inc. Micro-fabricated electrokinetic pump with on-frit electrode
US6994151B2 (en) 2002-10-22 2006-02-07 Cooligy, Inc. Vapor escape microchannel heat exchanger
US7156159B2 (en) 2003-03-17 2007-01-02 Cooligy, Inc. Multi-level microchannel heat exchangers
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US6986382B2 (en) 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
WO2004042306A2 (en) 2002-11-01 2004-05-21 Cooligy, Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
US7000684B2 (en) 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US6988535B2 (en) * 2002-11-01 2006-01-24 Cooligy, Inc. Channeled flat plate fin heat exchange system, device and method
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7201012B2 (en) 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US7090001B2 (en) 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
US7293423B2 (en) 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US7017654B2 (en) 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
US7126822B2 (en) 2003-03-31 2006-10-24 Intel Corporation Electronic packages, assemblies, and systems with fluid cooling
US7170155B2 (en) * 2003-06-25 2007-01-30 Intel Corporation MEMS RF switch module including a vertical via
JP3778910B2 (ja) * 2003-12-15 2006-05-24 株式会社ソニー・コンピュータエンタテインメント 電子デバイス冷却装置、電子デバイス冷却方法および電子デバイス冷却制御プログラム
GB0410850D0 (en) * 2004-05-14 2004-06-16 Cambridge Consultants Cooling
US7188662B2 (en) 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
US7616444B2 (en) 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7768619B2 (en) * 2004-08-03 2010-08-03 Harris Corporation Method and apparatus for sealing flex circuits made with an LCP substrate
DE102005013762C5 (de) * 2005-03-22 2012-12-20 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
US7492595B2 (en) * 2005-03-31 2009-02-17 Tecnisco Limited Semiconductor cooling device and stack of semiconductor cooling devices
US7516776B2 (en) * 2005-05-19 2009-04-14 International Business Machines Corporation Microjet module assembly
US7255153B2 (en) * 2005-05-25 2007-08-14 International Business Machines Corporation High performance integrated MLC cooling device for high power density ICS and method for manufacturing
JP5137379B2 (ja) * 2005-11-14 2013-02-06 インターナショナル・ビジネス・マシーンズ・コーポレーション 衝突冷却器
US7272005B2 (en) * 2005-11-30 2007-09-18 International Business Machines Corporation Multi-element heat exchange assemblies and methods of fabrication for a cooling system
US20070126103A1 (en) * 2005-12-01 2007-06-07 Intel Corporation Microelectronic 3-D package defining thermal through vias and method of making same
DE102005058780A1 (de) * 2005-12-09 2007-06-14 Forschungszentrum Karlsruhe Gmbh Mikrowärmeübertrager sowie die Verwendung desselben als Fluidkühler für elektronische Bauteile
US7515415B2 (en) * 2006-02-02 2009-04-07 Sun Microsystems, Inc. Embedded microchannel cooling package for a central processor unit
TW200810676A (en) 2006-03-30 2008-02-16 Cooligy Inc Multi device cooling
US7536870B2 (en) * 2006-03-30 2009-05-26 International Business Machines Corporation High power microjet cooler
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US7709296B2 (en) 2006-10-19 2010-05-04 International Business Machines Corporation Coupling metal clad fiber optics for enhanced heat dissipation
KR100906797B1 (ko) * 2007-06-20 2009-07-09 삼성전기주식회사 냉각부를 갖는 광변조기 패키지, 광변조기의 냉각방법 및냉각방법을 수행하기 위한 프로그램이 기록된 기록매체
TW200912621A (en) 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
WO2009042232A1 (en) * 2007-09-25 2009-04-02 Flextronics Ap, Llc Thermally enhanced magnetic transformer
US8106505B2 (en) 2007-10-31 2012-01-31 International Business Machines Corporation Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
CN101958297A (zh) * 2009-07-16 2011-01-26 王玉富 阵列柔性焊柱连接蒸发冷却半导体器件封装
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) * 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
EP2736981A4 (en) * 2011-07-29 2015-03-25 SiOx ApS CORROSION PROTECTION WITH REACTIVE SILICONE OXIDE PROCESSORS
US8565970B2 (en) * 2011-08-17 2013-10-22 GM Global Technology Operations LLC Method for controlling powertrain pumps
DE102012207196A1 (de) 2012-04-30 2013-10-31 Robert Bosch Gmbh Energiequelle und Verfahren zur Versorgung eines autarken elektrischen Verbrauchersystems und eine Verwendung derselben
US9035452B2 (en) * 2012-08-07 2015-05-19 General Electric Company Electronic device cooling with autonomous fluid routing and method of assembly
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US20160093553A1 (en) * 2014-09-25 2016-03-31 Mani Prakash On demand cooling of an nvm using a peltier device
RU2620732C1 (ru) * 2016-06-27 2017-05-29 Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) Устройство формирования пристенных капельных течений жидкости в микро- и мини-каналах
CN106409790B (zh) * 2016-08-27 2018-08-28 电子科技大学 一种强效的芯片散热器
IT201600104601A1 (it) 2016-10-18 2018-04-18 Menarini Silicon Biosystems Spa Sistema microfluidico
CN107293496B (zh) * 2017-05-09 2019-09-27 中国电子科技集团公司第五十五研究所 芯片级集成微流体散热模块及制备方法
CN107949242B (zh) * 2017-11-17 2020-08-28 珠海诚然科技服务有限公司 一种环保设备用双排散热器
CN110034082B (zh) * 2018-01-12 2021-01-01 创意电子股份有限公司 具有主动式散热的电子装置
US10490482B1 (en) * 2018-12-05 2019-11-26 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices including jet cooling with an intermediate mesh and methods for using the same
WO2020210587A1 (en) 2019-04-10 2020-10-15 Jetcool Technologies, Inc. Thermal management of electronics using co-located microjet nozzles and electronic elements
EP3977832B1 (en) * 2019-04-14 2025-06-04 Jetcool Technologies, Inc. Direct contact fluid based cooling module
US20210134510A1 (en) * 2019-10-31 2021-05-06 Analog Devices International Unlimited Company Electronic device
WO2022060898A1 (en) 2020-09-15 2022-03-24 Jetcool Technologies Inc. High temperature electronic device thermal management system
US12289871B2 (en) 2020-09-15 2025-04-29 Jetcool Technologies Inc. High temperature electronic device thermal management system
US20230392836A1 (en) * 2020-12-02 2023-12-07 Danfoss A/S Motor cooling using impingement jets created by perforated cooling jacket
TW202236557A (zh) 2021-01-20 2022-09-16 美商捷控技術有限公司 用於多晶電子組件之基板防流體的順應性冷卻組件
US12048118B2 (en) 2021-08-13 2024-07-23 Jetcool Technologies Inc. Flow-through, hot-spot-targeting immersion cooling assembly
US12315776B2 (en) 2021-11-08 2025-05-27 Analog Devices, Inc. Integrated device package with an integrated heat sink
US12289861B2 (en) 2021-11-12 2025-04-29 Jetcool Technologies Inc. Liquid-in-liquid cooling system for electronic components
TW202407925A (zh) 2022-03-04 2024-02-16 美商捷控技術有限公司 用於電腦處理器及處理器組件之主動冷卻散熱蓋

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000017927A1 (fr) * 1998-09-18 2000-03-30 Mitsubishi Denki Kabushiki Kaisha Convertisseur de puissance a semi-conducteur et dispositif de mise en application correspondante
JP2000252671A (ja) * 1999-02-26 2000-09-14 Sony Corp 冷却装置及び電子機器

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3774677A (en) * 1971-02-26 1973-11-27 Ibm Cooling system providing spray type condensation
FR2157094A5 (enExample) * 1971-10-18 1973-06-01 Thomson Csf
FR2580060B1 (enExample) * 1985-04-05 1989-06-09 Nec Corp
JPH065700B2 (ja) * 1987-07-22 1994-01-19 株式会社日立製作所 電子回路デバイスの冷却装置
US5105336A (en) * 1987-07-29 1992-04-14 Lutron Electronics Co., Inc. Modular multilevel electronic cabinet
US4889890A (en) * 1987-12-30 1989-12-26 Ppg Industries, Inc. Powder coating curing system containing a beta-hydroxyalkylamide
US4912600A (en) * 1988-09-07 1990-03-27 Auburn Univ. Of The State Of Alabama Integrated circuit packaging and cooling
US5770029A (en) 1996-07-30 1998-06-23 Soane Biosciences Integrated electrophoretic microdevices
SE470347B (sv) 1990-05-10 1994-01-31 Pharmacia Lkb Biotech Mikrostruktur för vätskeflödessystem och förfarande för tillverkning av ett sådant system
JPH0423457A (ja) * 1990-05-18 1992-01-27 Fujitsu Ltd 浸漬冷却装置
US5170319A (en) 1990-06-04 1992-12-08 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels
US5161089A (en) 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
SE9100392D0 (sv) 1991-02-08 1991-02-08 Pharmacia Biosensor Ab A method of producing a sealing means in a microfluidic structure and a microfluidic structure comprising such sealing means
US5237484A (en) * 1991-07-08 1993-08-17 Tandem Computers Incorporated Apparatus for cooling a plurality of electronic modules
US5315239A (en) * 1991-12-16 1994-05-24 Hughes Aircraft Company Circuit module connections
JP2500757B2 (ja) 1993-06-21 1996-05-29 日本電気株式会社 集積回路の冷却構造
US5596228A (en) * 1994-03-10 1997-01-21 Oec Medical Systems, Inc. Apparatus for cooling charge coupled device imaging systems
US5390077A (en) * 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
US5876187A (en) 1995-03-09 1999-03-02 University Of Washington Micropumps with fixed valves
KR0156622B1 (ko) * 1995-04-27 1998-10-15 문정환 반도체 패키지,리드프레임 및 제조방법
CA2217754A1 (en) 1995-04-28 1996-10-31 Rosemount Inc. Mounting assembly for a pressure transmitter
US5705018A (en) * 1995-12-13 1998-01-06 Hartley; Frank T. Micromachined peristaltic pump
US5719444A (en) * 1996-04-26 1998-02-17 Tilton; Charles L. Packaging and cooling system for power semi-conductor
US5932940A (en) 1996-07-16 1999-08-03 Massachusetts Institute Of Technology Microturbomachinery
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
US5976336A (en) 1997-04-25 1999-11-02 Caliper Technologies Corp. Microfluidic devices incorporating improved channel geometries
US6001231A (en) 1997-07-15 1999-12-14 Caliper Technologies Corp. Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
DE19733455B4 (de) 1997-08-02 2012-03-29 Curamik Electronics Gmbh Wärmetauscheranordnung sowie Kühlsystem mit wenigstens einer derartigen Wärmetauscheranordnung
US5965410A (en) 1997-09-02 1999-10-12 Caliper Technologies Corp. Electrical current for controlling fluid parameters in microchannels
US5842787A (en) 1997-10-09 1998-12-01 Caliper Technologies Corporation Microfluidic systems incorporating varied channel dimensions
EP0954210A1 (en) * 1998-04-28 1999-11-03 Lucent Technologies Inc. Cooling electronic apparatus
US6108201A (en) * 1999-02-22 2000-08-22 Tilton; Charles L Fluid control apparatus and method for spray cooling
US6096656A (en) * 1999-06-24 2000-08-01 Sandia Corporation Formation of microchannels from low-temperature plasma-deposited silicon oxynitride
US6205799B1 (en) * 1999-09-13 2001-03-27 Hewlett-Packard Company Spray cooling system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000017927A1 (fr) * 1998-09-18 2000-03-30 Mitsubishi Denki Kabushiki Kaisha Convertisseur de puissance a semi-conducteur et dispositif de mise en application correspondante
JP2000252671A (ja) * 1999-02-26 2000-09-14 Sony Corp 冷却装置及び電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010008025A (ja) * 2008-06-30 2010-01-14 Fujitsu Ltd ループヒートパイプおよび電子機器

Also Published As

Publication number Publication date
EP1362370A2 (en) 2003-11-19
US20020075651A1 (en) 2002-06-20
KR100553170B1 (ko) 2006-02-21
WO2002050901A2 (en) 2002-06-27
CN1502130A (zh) 2004-06-02
WO2002050901A3 (en) 2003-09-12
US6459581B1 (en) 2002-10-01
KR20040014438A (ko) 2004-02-14
AU2002226065A1 (en) 2002-07-01
CN1322582C (zh) 2007-06-20

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A912 Re-examination (zenchi) completed and case transferred to appeal board

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Effective date: 20070727