JP2005353885A - 電子デバイスの製造方法 - Google Patents

電子デバイスの製造方法 Download PDF

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Publication number
JP2005353885A
JP2005353885A JP2004173799A JP2004173799A JP2005353885A JP 2005353885 A JP2005353885 A JP 2005353885A JP 2004173799 A JP2004173799 A JP 2004173799A JP 2004173799 A JP2004173799 A JP 2004173799A JP 2005353885 A JP2005353885 A JP 2005353885A
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JP
Japan
Prior art keywords
lid
base
bases
plate
metal brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004173799A
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English (en)
Japanese (ja)
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JP2005353885A5 (https=
Inventor
Tatsuo Ikeda
龍夫 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2004173799A priority Critical patent/JP2005353885A/ja
Publication of JP2005353885A publication Critical patent/JP2005353885A/ja
Publication of JP2005353885A5 publication Critical patent/JP2005353885A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2004173799A 2004-06-11 2004-06-11 電子デバイスの製造方法 Withdrawn JP2005353885A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004173799A JP2005353885A (ja) 2004-06-11 2004-06-11 電子デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004173799A JP2005353885A (ja) 2004-06-11 2004-06-11 電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2005353885A true JP2005353885A (ja) 2005-12-22
JP2005353885A5 JP2005353885A5 (https=) 2007-08-09

Family

ID=35588084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004173799A Withdrawn JP2005353885A (ja) 2004-06-11 2004-06-11 電子デバイスの製造方法

Country Status (1)

Country Link
JP (1) JP2005353885A (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009118034A (ja) * 2007-11-05 2009-05-28 Epson Toyocom Corp 直接接合用ウェハ
JP2012015779A (ja) * 2010-06-30 2012-01-19 Kyocera Kinseki Corp 圧電振動子の製造方法及び圧電振動子
JP2012238987A (ja) * 2011-05-11 2012-12-06 Seiko Epson Corp 振動子の製造方法。
JP2013153455A (ja) * 2013-02-20 2013-08-08 Seiko Epson Corp 接合用ウェハ
US8551623B2 (en) 2007-02-26 2013-10-08 Neomax Materials Co., Ltd. Airtightly sealing cap, electronic component storing package and method for manufacturing electronic component storing package
JP2013258435A (ja) * 2013-10-02 2013-12-26 Nec Toshiba Space Systems Ltd 気密封止筐体製造方法
JP2014086522A (ja) * 2012-10-23 2014-05-12 Seiko Epson Corp 電子デバイスの製造方法、電子部品用容器の接合装置、電子機器、及び移動体機器
US9516773B2 (en) 2013-11-11 2016-12-06 Seiko Epson Corporation Lid body, package, electronic apparatus, moving object, and method for manufacturing package
KR102938148B1 (ko) * 2020-10-30 2026-03-12 이노럭스 코포레이션 전자 장치

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8551623B2 (en) 2007-02-26 2013-10-08 Neomax Materials Co., Ltd. Airtightly sealing cap, electronic component storing package and method for manufacturing electronic component storing package
JP2009118034A (ja) * 2007-11-05 2009-05-28 Epson Toyocom Corp 直接接合用ウェハ
JP2012015779A (ja) * 2010-06-30 2012-01-19 Kyocera Kinseki Corp 圧電振動子の製造方法及び圧電振動子
JP2012238987A (ja) * 2011-05-11 2012-12-06 Seiko Epson Corp 振動子の製造方法。
JP2014086522A (ja) * 2012-10-23 2014-05-12 Seiko Epson Corp 電子デバイスの製造方法、電子部品用容器の接合装置、電子機器、及び移動体機器
JP2013153455A (ja) * 2013-02-20 2013-08-08 Seiko Epson Corp 接合用ウェハ
JP2013258435A (ja) * 2013-10-02 2013-12-26 Nec Toshiba Space Systems Ltd 気密封止筐体製造方法
US9516773B2 (en) 2013-11-11 2016-12-06 Seiko Epson Corporation Lid body, package, electronic apparatus, moving object, and method for manufacturing package
KR102938148B1 (ko) * 2020-10-30 2026-03-12 이노럭스 코포레이션 전자 장치

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