JP2005317908A - 素子内蔵基板および素子内蔵基板の製造方法 - Google Patents
素子内蔵基板および素子内蔵基板の製造方法 Download PDFInfo
- Publication number
- JP2005317908A JP2005317908A JP2004365968A JP2004365968A JP2005317908A JP 2005317908 A JP2005317908 A JP 2005317908A JP 2004365968 A JP2004365968 A JP 2004365968A JP 2004365968 A JP2004365968 A JP 2004365968A JP 2005317908 A JP2005317908 A JP 2005317908A
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- substrate
- crystal resonator
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- wiring pattern
- embedded
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 176
- 239000013078 crystal Substances 0.000 claims abstract description 92
- 238000000034 method Methods 0.000 claims description 37
- 239000003566 sealing material Substances 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 238000010030 laminating Methods 0.000 claims description 10
- 239000010949 copper Substances 0.000 description 43
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000011787 zinc oxide Substances 0.000 description 10
- 238000007747 plating Methods 0.000 description 9
- 239000010453 quartz Substances 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004365968A JP2005317908A (ja) | 2004-03-31 | 2004-12-17 | 素子内蔵基板および素子内蔵基板の製造方法 |
| US11/090,812 US20050218491A1 (en) | 2004-03-31 | 2005-03-25 | Circuit component module and method of manufacturing the same |
| CNA2005100626675A CN1678175A (zh) | 2004-03-31 | 2005-03-31 | 电路部件模块及其制造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004101609 | 2004-03-31 | ||
| JP2004365968A JP2005317908A (ja) | 2004-03-31 | 2004-12-17 | 素子内蔵基板および素子内蔵基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005317908A true JP2005317908A (ja) | 2005-11-10 |
| JP2005317908A5 JP2005317908A5 (enExample) | 2007-03-01 |
Family
ID=35444972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004365968A Withdrawn JP2005317908A (ja) | 2004-03-31 | 2004-12-17 | 素子内蔵基板および素子内蔵基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005317908A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100725481B1 (ko) | 2006-02-24 | 2007-06-07 | 삼성전기주식회사 | 전자 소자 내장형 인쇄회로기판 및 그 제조 방법 |
| WO2011067945A1 (ja) * | 2009-12-04 | 2011-06-09 | パナソニック株式会社 | 回路基板、回路モジュール、及び電子機器 |
| WO2014035533A1 (en) * | 2012-08-31 | 2014-03-06 | Intel Corporation | Ultra slim rf package for ultrabooks and smart phones |
| WO2014125973A1 (ja) * | 2013-02-12 | 2014-08-21 | 株式会社村田製作所 | 部品内蔵樹脂多層基板および樹脂多層基板 |
| JP2016225620A (ja) * | 2015-06-01 | 2016-12-28 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | プリント回路基板、プリント回路基板の製造方法及びこれを含む半導体パッケージ |
| JP2017191920A (ja) * | 2016-04-15 | 2017-10-19 | 株式会社オートネットワーク技術研究所 | 回路基板、回路構成体、及び回路基板の製造方法 |
-
2004
- 2004-12-17 JP JP2004365968A patent/JP2005317908A/ja not_active Withdrawn
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100725481B1 (ko) | 2006-02-24 | 2007-06-07 | 삼성전기주식회사 | 전자 소자 내장형 인쇄회로기판 및 그 제조 방법 |
| WO2011067945A1 (ja) * | 2009-12-04 | 2011-06-09 | パナソニック株式会社 | 回路基板、回路モジュール、及び電子機器 |
| JPWO2011067945A1 (ja) * | 2009-12-04 | 2013-04-18 | パナソニック株式会社 | 回路基板、回路モジュール、及び電子機器 |
| WO2014035533A1 (en) * | 2012-08-31 | 2014-03-06 | Intel Corporation | Ultra slim rf package for ultrabooks and smart phones |
| US8890628B2 (en) | 2012-08-31 | 2014-11-18 | Intel Corporation | Ultra slim RF package for ultrabooks and smart phones |
| WO2014125973A1 (ja) * | 2013-02-12 | 2014-08-21 | 株式会社村田製作所 | 部品内蔵樹脂多層基板および樹脂多層基板 |
| JP2016225620A (ja) * | 2015-06-01 | 2016-12-28 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | プリント回路基板、プリント回路基板の製造方法及びこれを含む半導体パッケージ |
| JP2017191920A (ja) * | 2016-04-15 | 2017-10-19 | 株式会社オートネットワーク技術研究所 | 回路基板、回路構成体、及び回路基板の製造方法 |
| WO2017179489A1 (ja) * | 2016-04-15 | 2017-10-19 | 株式会社オートネットワーク技術研究所 | 回路基板、回路構成体、及び回路基板の製造方法 |
| CN108886868A (zh) * | 2016-04-15 | 2018-11-23 | 株式会社自动网络技术研究所 | 电路基板、电路结构体以及电路基板的制造方法 |
| US10772194B2 (en) | 2016-04-15 | 2020-09-08 | Autonetworks Technologies, Ltd. | Circuit board, circuit assembly, and circuit board manufacturing method |
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|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070111 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070111 |
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| A761 | Written withdrawal of application |
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