JP2005306617A5 - - Google Patents
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- Publication number
- JP2005306617A5 JP2005306617A5 JP2004121442A JP2004121442A JP2005306617A5 JP 2005306617 A5 JP2005306617 A5 JP 2005306617A5 JP 2004121442 A JP2004121442 A JP 2004121442A JP 2004121442 A JP2004121442 A JP 2004121442A JP 2005306617 A5 JP2005306617 A5 JP 2005306617A5
- Authority
- JP
- Japan
- Prior art keywords
- zeta potential
- dispersion
- value
- fine particles
- diamond fine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000006185 dispersion Substances 0.000 claims description 16
- 229910003460 diamond Inorganic materials 0.000 claims description 15
- 239000010432 diamond Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 239000010419 fine particle Substances 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004121442A JP2005306617A (ja) | 2004-04-16 | 2004-04-16 | ダイヤモンド薄膜およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004121442A JP2005306617A (ja) | 2004-04-16 | 2004-04-16 | ダイヤモンド薄膜およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005306617A JP2005306617A (ja) | 2005-11-04 |
| JP2005306617A5 true JP2005306617A5 (https=) | 2007-06-07 |
Family
ID=35435798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004121442A Withdrawn JP2005306617A (ja) | 2004-04-16 | 2004-04-16 | ダイヤモンド薄膜およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005306617A (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009091234A (ja) * | 2007-09-18 | 2009-04-30 | Tokyo Univ Of Science | 導電性ダイヤモンド膜が形成された基板及び導電性ダイヤモンド膜が形成された基板の製造方法 |
| JP5334085B2 (ja) * | 2007-11-19 | 2013-11-06 | 独立行政法人産業技術総合研究所 | 基板への種付け処理方法、ダイヤモンド微細構造体及びその製造方法 |
| JP4984263B2 (ja) * | 2008-09-17 | 2012-07-25 | 住友電工ハードメタル株式会社 | ダイヤモンド膜及びその製造方法 |
| US10584412B2 (en) * | 2016-03-08 | 2020-03-10 | Ii-Vi Delaware, Inc. | Substrate comprising a layer of silicon and a layer of diamond having an optically finished (or a dense) silicon-diamond interface |
| CN109097754A (zh) * | 2017-06-20 | 2018-12-28 | 深圳先进技术研究院 | 一种表面具有高致密纳米金刚石薄膜的工件及一种高致密纳米金刚石薄膜的制备方法 |
| JP6825509B2 (ja) | 2017-07-21 | 2021-02-03 | 株式会社Sumco | ダイヤモンド積層シリコンウェーハの製造方法およびダイヤモンド積層シリコンウェーハ |
| KR102133963B1 (ko) * | 2018-11-30 | 2020-07-15 | 한국과학기술연구원 | 다음극 직류전원 플라즈마 화학 증착 장치를 이용한 다이아몬드 단결정 성장 방법 |
| CN111334779B (zh) * | 2018-12-18 | 2023-08-15 | 深圳先进技术研究院 | 掺硼金刚石薄膜及其制备方法、油水分离元件、水处理电极及其制备方法与水处理装置 |
| JP7172556B2 (ja) * | 2018-12-19 | 2022-11-16 | 株式会社Sumco | 多結晶ダイヤモンド自立基板の製造方法 |
| AU2022398739A1 (en) * | 2021-11-24 | 2024-05-30 | Daicel Corporation | Structure comprising diamond coating film, and method for manufacturing same |
| JPWO2023238391A1 (https=) * | 2022-06-10 | 2023-12-14 | ||
| CN116590695B (zh) * | 2022-12-05 | 2025-07-18 | 浙江工业大学 | 高电导率高迁移率n型金刚石薄膜及其制备方法 |
-
2004
- 2004-04-16 JP JP2004121442A patent/JP2005306617A/ja not_active Withdrawn
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