JP2005303150A5 - - Google Patents

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Publication number
JP2005303150A5
JP2005303150A5 JP2004119624A JP2004119624A JP2005303150A5 JP 2005303150 A5 JP2005303150 A5 JP 2005303150A5 JP 2004119624 A JP2004119624 A JP 2004119624A JP 2004119624 A JP2004119624 A JP 2004119624A JP 2005303150 A5 JP2005303150 A5 JP 2005303150A5
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JP
Japan
Prior art keywords
refractory metal
gas
film
nitride film
semiconductor layer
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JP2004119624A
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English (en)
Japanese (ja)
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JP4583797B2 (ja
JP2005303150A (ja
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Priority to JP2004119624A priority Critical patent/JP4583797B2/ja
Priority claimed from JP2004119624A external-priority patent/JP4583797B2/ja
Publication of JP2005303150A publication Critical patent/JP2005303150A/ja
Publication of JP2005303150A5 publication Critical patent/JP2005303150A5/ja
Application granted granted Critical
Publication of JP4583797B2 publication Critical patent/JP4583797B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004119624A 2004-04-14 2004-04-14 半導体装置の作製方法 Expired - Fee Related JP4583797B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004119624A JP4583797B2 (ja) 2004-04-14 2004-04-14 半導体装置の作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004119624A JP4583797B2 (ja) 2004-04-14 2004-04-14 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2005303150A JP2005303150A (ja) 2005-10-27
JP2005303150A5 true JP2005303150A5 (enrdf_load_stackoverflow) 2007-05-17
JP4583797B2 JP4583797B2 (ja) 2010-11-17

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ID=35334264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004119624A Expired - Fee Related JP4583797B2 (ja) 2004-04-14 2004-04-14 半導体装置の作製方法

Country Status (1)

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JP (1) JP4583797B2 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0524783D0 (en) * 2005-12-05 2006-01-11 Cambridge Display Tech Ltd Cavity glass for light-emissive devices and a method of manufacturing the same
JP5259247B2 (ja) * 2007-08-22 2013-08-07 富士フイルム株式会社 表示素子の封止方法およびガスバリアフィルムで封止された表示素子の製造方法
JP4953166B2 (ja) * 2007-11-29 2012-06-13 カシオ計算機株式会社 表示パネルの製造方法
JP5293322B2 (ja) * 2009-03-24 2013-09-18 凸版印刷株式会社 有機elパネル及びその製造方法
KR102010752B1 (ko) 2009-12-04 2019-08-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
JP6617024B2 (ja) * 2015-12-24 2019-12-04 パイオニア株式会社 発光装置
CN110326114B (zh) * 2017-02-28 2022-04-22 夏普株式会社 Tft基板、具备tft基板的扫描天线以及tft基板的制造方法
CN107359126B (zh) 2017-07-11 2020-03-10 京东方科技集团股份有限公司 薄膜晶体管及其制备方法、阵列基板和显示面板
CN110729409B (zh) * 2019-10-25 2020-12-29 吉林大学 一种有机光电器件封装薄膜及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3141656B2 (ja) * 1993-11-01 2001-03-05 富士ゼロックス株式会社 薄膜半導体装置の製造方法
JP2001223365A (ja) * 2000-02-10 2001-08-17 Fujitsu Ltd 薄膜トランジスタ及びその製造方法
JP4056765B2 (ja) * 2001-02-28 2008-03-05 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4027740B2 (ja) * 2001-07-16 2007-12-26 株式会社半導体エネルギー研究所 半導体装置の作製方法

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