JP2005281753A - 電解加工装置 - Google Patents

電解加工装置 Download PDF

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Publication number
JP2005281753A
JP2005281753A JP2004096287A JP2004096287A JP2005281753A JP 2005281753 A JP2005281753 A JP 2005281753A JP 2004096287 A JP2004096287 A JP 2004096287A JP 2004096287 A JP2004096287 A JP 2004096287A JP 2005281753 A JP2005281753 A JP 2005281753A
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JP
Japan
Prior art keywords
electrode
processing
liquid
regeneration
ion exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2004096287A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005281753A5 (https=
Inventor
Yasushi Taima
康 當間
Takayuki Saito
孝行 斎藤
Kazuto Hirokawa
一人 廣川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2004096287A priority Critical patent/JP2005281753A/ja
Priority to PCT/JP2005/006208 priority patent/WO2005093135A1/en
Priority to US10/585,739 priority patent/US20080217164A1/en
Priority to TW094109721A priority patent/TW200536643A/zh
Publication of JP2005281753A publication Critical patent/JP2005281753A/ja
Publication of JP2005281753A5 publication Critical patent/JP2005281753A5/ja
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/20—Electromechanical polishing [EMP]; Electrochemical mechanical polishing [ECMP]
    • H10P52/203—Electromechanical polishing [EMP]; Electrochemical mechanical polishing [ECMP] of conductive or resistive materials

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
JP2004096287A 2004-03-29 2004-03-29 電解加工装置 Ceased JP2005281753A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004096287A JP2005281753A (ja) 2004-03-29 2004-03-29 電解加工装置
PCT/JP2005/006208 WO2005093135A1 (en) 2004-03-29 2005-03-24 Electrolytic processing apparatus
US10/585,739 US20080217164A1 (en) 2004-03-29 2005-03-24 Electrolytic Processing Apparatus
TW094109721A TW200536643A (en) 2004-03-29 2005-03-29 Electrolytic processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004096287A JP2005281753A (ja) 2004-03-29 2004-03-29 電解加工装置

Publications (2)

Publication Number Publication Date
JP2005281753A true JP2005281753A (ja) 2005-10-13
JP2005281753A5 JP2005281753A5 (https=) 2007-04-12

Family

ID=35056231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004096287A Ceased JP2005281753A (ja) 2004-03-29 2004-03-29 電解加工装置

Country Status (4)

Country Link
US (1) US20080217164A1 (https=)
JP (1) JP2005281753A (https=)
TW (1) TW200536643A (https=)
WO (1) WO2005093135A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018150599A (ja) * 2017-03-14 2018-09-27 トヨタ自動車株式会社 金属皮膜の成膜方法
JP2018154854A (ja) * 2017-03-15 2018-10-04 トヨタ自動車株式会社 金属皮膜の成膜方法
JP2018154855A (ja) * 2017-03-15 2018-10-04 トヨタ自動車株式会社 金属皮膜の成膜装置
JP2018178140A (ja) * 2017-04-03 2018-11-15 トヨタ自動車株式会社 金属皮膜の成膜装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019200832A1 (de) * 2019-01-24 2020-07-30 MTU Aero Engines AG VERFAHREN ZUM ENTFERNEN VON Cr(VI)-IONEN AUS EINER WÄSSRIGEN ELEKTROLYTLÖSUNG

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297804A (ja) * 2002-01-31 2003-10-17 Ebara Corp 基板処理装置および方法
JP2004002955A (ja) * 2002-03-22 2004-01-08 Ebara Corp 電解加工装置及び方法
JP2004015028A (ja) * 2002-06-11 2004-01-15 Ebara Corp 基板処理方法及び半導体装置
JP2004017177A (ja) * 2002-06-12 2004-01-22 Ebara Corp イオン交換体の固定方法、固定構造並びに電解加工装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6722950B1 (en) * 2000-11-07 2004-04-20 Planar Labs Corporation Method and apparatus for electrodialytic chemical mechanical polishing and deposition
US7427345B2 (en) * 2001-11-29 2008-09-23 Ebara Corporation Method and device for regenerating ion exchanger, and electrolytic processing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297804A (ja) * 2002-01-31 2003-10-17 Ebara Corp 基板処理装置および方法
JP2004002955A (ja) * 2002-03-22 2004-01-08 Ebara Corp 電解加工装置及び方法
JP2004015028A (ja) * 2002-06-11 2004-01-15 Ebara Corp 基板処理方法及び半導体装置
JP2004017177A (ja) * 2002-06-12 2004-01-22 Ebara Corp イオン交換体の固定方法、固定構造並びに電解加工装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018150599A (ja) * 2017-03-14 2018-09-27 トヨタ自動車株式会社 金属皮膜の成膜方法
JP2018154854A (ja) * 2017-03-15 2018-10-04 トヨタ自動車株式会社 金属皮膜の成膜方法
JP2018154855A (ja) * 2017-03-15 2018-10-04 トヨタ自動車株式会社 金属皮膜の成膜装置
JP2018178140A (ja) * 2017-04-03 2018-11-15 トヨタ自動車株式会社 金属皮膜の成膜装置

Also Published As

Publication number Publication date
US20080217164A1 (en) 2008-09-11
WO2005093135A1 (en) 2005-10-06
TW200536643A (en) 2005-11-16

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