TW200536643A - Electrolytic processing apparatus - Google Patents

Electrolytic processing apparatus Download PDF

Info

Publication number
TW200536643A
TW200536643A TW094109721A TW94109721A TW200536643A TW 200536643 A TW200536643 A TW 200536643A TW 094109721 A TW094109721 A TW 094109721A TW 94109721 A TW94109721 A TW 94109721A TW 200536643 A TW200536643 A TW 200536643A
Authority
TW
Taiwan
Prior art keywords
electrode
processing
liquid
regeneration
electrolytic
Prior art date
Application number
TW094109721A
Other languages
English (en)
Chinese (zh)
Inventor
Yasushi Toma
Takayuki Saito
Kazuto Hirokawa
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200536643A publication Critical patent/TW200536643A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/20—Electromechanical polishing [EMP]; Electrochemical mechanical polishing [ECMP]
    • H10P52/203—Electromechanical polishing [EMP]; Electrochemical mechanical polishing [ECMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
TW094109721A 2004-03-29 2005-03-29 Electrolytic processing apparatus TW200536643A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004096287A JP2005281753A (ja) 2004-03-29 2004-03-29 電解加工装置

Publications (1)

Publication Number Publication Date
TW200536643A true TW200536643A (en) 2005-11-16

Family

ID=35056231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094109721A TW200536643A (en) 2004-03-29 2005-03-29 Electrolytic processing apparatus

Country Status (4)

Country Link
US (1) US20080217164A1 (https=)
JP (1) JP2005281753A (https=)
TW (1) TW200536643A (https=)
WO (1) WO2005093135A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6699604B2 (ja) * 2017-03-14 2020-05-27 トヨタ自動車株式会社 金属皮膜の成膜方法
JP6699605B2 (ja) * 2017-03-15 2020-05-27 トヨタ自動車株式会社 金属皮膜の成膜方法
JP6699606B2 (ja) * 2017-03-15 2020-05-27 トヨタ自動車株式会社 金属皮膜の成膜装置
JP6740951B2 (ja) * 2017-04-03 2020-08-19 トヨタ自動車株式会社 金属皮膜の成膜装置
DE102019200832A1 (de) * 2019-01-24 2020-07-30 MTU Aero Engines AG VERFAHREN ZUM ENTFERNEN VON Cr(VI)-IONEN AUS EINER WÄSSRIGEN ELEKTROLYTLÖSUNG

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6722950B1 (en) * 2000-11-07 2004-04-20 Planar Labs Corporation Method and apparatus for electrodialytic chemical mechanical polishing and deposition
JP4056359B2 (ja) * 2002-03-22 2008-03-05 株式会社荏原製作所 電解加工装置及び方法
US7427345B2 (en) * 2001-11-29 2008-09-23 Ebara Corporation Method and device for regenerating ion exchanger, and electrolytic processing apparatus
JP4076430B2 (ja) * 2002-01-31 2008-04-16 株式会社荏原製作所 基板処理装置
JP3967207B2 (ja) * 2002-06-12 2007-08-29 株式会社荏原製作所 電解加工装置
JP2004015028A (ja) * 2002-06-11 2004-01-15 Ebara Corp 基板処理方法及び半導体装置

Also Published As

Publication number Publication date
US20080217164A1 (en) 2008-09-11
WO2005093135A1 (en) 2005-10-06
JP2005281753A (ja) 2005-10-13

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