JP2005260291A5 - - Google Patents

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Publication number
JP2005260291A5
JP2005260291A5 JP2004064973A JP2004064973A JP2005260291A5 JP 2005260291 A5 JP2005260291 A5 JP 2005260291A5 JP 2004064973 A JP2004064973 A JP 2004064973A JP 2004064973 A JP2004064973 A JP 2004064973A JP 2005260291 A5 JP2005260291 A5 JP 2005260291A5
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JP
Japan
Prior art keywords
processing circuit
signal processing
sensor
electronic device
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004064973A
Other languages
English (en)
Japanese (ja)
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JP2005260291A (ja
JP4049112B2 (ja
Filing date
Publication date
Priority claimed from JP2004064973A external-priority patent/JP4049112B2/ja
Priority to JP2004064973A priority Critical patent/JP4049112B2/ja
Application filed filed Critical
Priority to CN2008100876640A priority patent/CN101257768B/zh
Priority to CNB2004100749810A priority patent/CN100533997C/zh
Priority to US10/933,270 priority patent/US7304857B2/en
Publication of JP2005260291A publication Critical patent/JP2005260291A/ja
Publication of JP2005260291A5 publication Critical patent/JP2005260291A5/ja
Priority to US11/976,041 priority patent/US7663893B2/en
Publication of JP4049112B2 publication Critical patent/JP4049112B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004064973A 2004-03-09 2004-03-09 電子装置 Expired - Fee Related JP4049112B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004064973A JP4049112B2 (ja) 2004-03-09 2004-03-09 電子装置
CN2008100876640A CN101257768B (zh) 2004-03-09 2004-09-01 电子电路及其控制方法
CNB2004100749810A CN100533997C (zh) 2004-03-09 2004-09-01 电子装置
US10/933,270 US7304857B2 (en) 2004-03-09 2004-09-03 Sensor node and circuit board arrangement
US11/976,041 US7663893B2 (en) 2004-03-09 2007-10-19 Sensor node and circuit board arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004064973A JP4049112B2 (ja) 2004-03-09 2004-03-09 電子装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006139687A Division JP4301254B2 (ja) 2006-05-19 2006-05-19 電子装置およびセンサネットシステム

Publications (3)

Publication Number Publication Date
JP2005260291A JP2005260291A (ja) 2005-09-22
JP2005260291A5 true JP2005260291A5 (enExample) 2006-07-06
JP4049112B2 JP4049112B2 (ja) 2008-02-20

Family

ID=34918211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004064973A Expired - Fee Related JP4049112B2 (ja) 2004-03-09 2004-03-09 電子装置

Country Status (3)

Country Link
US (2) US7304857B2 (enExample)
JP (1) JP4049112B2 (enExample)
CN (2) CN101257768B (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004008738A1 (de) * 2004-02-23 2005-09-08 BSH Bosch und Siemens Hausgeräte GmbH Elektronische Baugruppe und Verfahren zur Herstellung dieser
JP4552670B2 (ja) * 2005-01-31 2010-09-29 株式会社日立製作所 センサノード、基地局、及びセンサネットワークシステム
JP4848732B2 (ja) * 2005-10-17 2011-12-28 株式会社日立製作所 端末装置
US8290747B2 (en) * 2005-10-21 2012-10-16 Microstrain, Inc. Structural damage detection and analysis system
JP4800981B2 (ja) * 2006-02-08 2011-10-26 セイコーインスツル株式会社 無線通信装置
JP5285842B2 (ja) * 2006-04-13 2013-09-11 パナソニック株式会社 集積回路実装基板および電力線通信装置
US8118483B2 (en) * 2006-06-21 2012-02-21 Intel Corporation Thermal sensor having toggle control
JP4814018B2 (ja) 2006-08-29 2011-11-09 株式会社日立製作所 センサノード
US20080225445A1 (en) * 2007-03-14 2008-09-18 Zippy Technology Corp. Arc-discharge protection device with temperature detection mode
US8115629B2 (en) * 2009-09-24 2012-02-14 Microdata Corporation Collective objects management system using R.F. object identification with multiple crystals
KR101049477B1 (ko) 2009-09-30 2011-07-15 제주대학교 산학협력단 센서 인터페이스 보드 어셈블리
JP5470556B2 (ja) * 2010-07-16 2014-04-16 伊原電子工業株式会社 生体信号検出装置、その制御方法及びプログラム
JP5269864B2 (ja) * 2010-12-07 2013-08-21 株式会社東芝 半導体装置
US9258030B2 (en) 2011-02-10 2016-02-09 Mediatek Inc. Wireless communication device
US9369172B2 (en) 2011-02-10 2016-06-14 Mediatek Inc. Wireless communication device
US9713093B2 (en) 2011-02-10 2017-07-18 Mediatek Inc. Wireless communication device
US8971378B2 (en) * 2011-02-10 2015-03-03 Mediatek Inc. Wireless communication device
JP5818310B2 (ja) * 2011-06-27 2015-11-18 セイコーインスツル株式会社 センサ端末、センサシステム及びその方法
US20130039230A1 (en) * 2011-08-09 2013-02-14 Jaesik Lee Method and Device for Wireless Broadcast Power-up Sequence in Wireless Sensor Network
WO2014016867A1 (ja) * 2012-07-24 2014-01-30 ルネサスモバイル株式会社 半導体装置および電子装置
JP6340285B2 (ja) 2014-08-22 2018-06-06 ルネサスエレクトロニクス株式会社 半導体装置、電子装置およびセンシング方法
JP6571358B2 (ja) * 2015-03-24 2019-09-04 三菱重工サーマルシステムズ株式会社 電力変換用回路基板及び電動圧縮機
KR20160120496A (ko) * 2015-04-08 2016-10-18 삼성전기주식회사 실장 기판 모듈
WO2018168500A1 (ja) * 2017-03-15 2018-09-20 株式会社村田製作所 高周波モジュール及び通信装置
US11375607B2 (en) * 2019-03-28 2022-06-28 Apple Inc. Mirrored voltage regulator for high-current applications and method the same
CN115552177A (zh) * 2020-05-18 2022-12-30 三菱电机株式会社 传感器电源控制系统以及空气净化机
CN116746070A (zh) 2021-01-25 2023-09-12 三星电子株式会社 用于控制通信模块的发射功率的电子装置和方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517535A (en) * 1982-07-28 1985-05-14 Dalmo Victor Operations, Bell Aerospace Textron, Div. Of Textron, Inc. High speed high power step attenuator method and apparatus
US4616655A (en) * 1984-01-20 1986-10-14 Cordis Corporation Implantable pulse generator having a single printed circuit board and a chip carrier
US5144548A (en) * 1988-07-15 1992-09-01 Iris Technologies, Inc. Routing switcher
US5535274A (en) * 1991-10-19 1996-07-09 Cellport Labs, Inc. Universal connection for cellular telephone interface
JPH1027987A (ja) * 1996-07-10 1998-01-27 Hitachi Ltd 低ｅｍｉ回路基板及び低ｅｍｉケーブルコネクタ
US5938956A (en) * 1996-09-10 1999-08-17 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
US5781078A (en) * 1996-12-05 1998-07-14 Glenayre Electronics, Inc. Filter enhancement using input-to-output ground isolation and shielding
KR100238408B1 (ko) * 1997-02-26 2000-01-15 김승찬 컴퓨터 도난 방지 시스템
US6010257A (en) * 1997-03-18 2000-01-04 Comtec Information Systems Inc. Miniature portable interactive printer
US6064116A (en) * 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
JPH117596A (ja) 1997-06-18 1999-01-12 Penta Ocean Constr Co Ltd データ検出装置及びその電源管理方法
AU9480798A (en) * 1997-09-12 1999-03-29 Williams Wireless, Inc. Wide area remote telemetry
US6013876A (en) * 1998-01-23 2000-01-11 General Instrument Corporation Method and device for electrically connecting circuits to opposite surfaces of a printed circuit board
JP3199039B2 (ja) * 1998-11-02 2001-08-13 日本電気株式会社 消費電力低減回路及びこれを用いた無線通信装置並びに無線通信装置における消費電力低減方法
JP2001127652A (ja) 1999-10-22 2001-05-11 Matsushita Electric Ind Co Ltd 高周波無線装置
JP2001213008A (ja) 2000-02-03 2001-08-07 Casio Comput Co Ltd 階調印字制御装置
JP2001232843A (ja) 2000-02-23 2001-08-28 Alps Electric Co Ltd サーマルプリンタおよびその記録方法
JP2001337931A (ja) 2000-05-29 2001-12-07 Matsushita Electric Ind Co Ltd 携帯端末装置
US6487082B1 (en) * 2000-07-20 2002-11-26 Silicon Graphics, Inc. Printed circuit board component packaging
JP4338885B2 (ja) 2000-08-22 2009-10-07 パナソニック株式会社 無線通信機能を持つ携帯端末装置とその応答方法
US6567703B1 (en) * 2000-11-08 2003-05-20 Medtronic, Inc. Implantable medical device incorporating miniaturized circuit module
JP3642029B2 (ja) * 2001-02-06 2005-04-27 日本電気株式会社 携帯電話機
JP4274453B2 (ja) * 2001-07-02 2009-06-10 横浜ゴム株式会社 車両のタイヤ監視システム
US6672174B2 (en) * 2001-07-23 2004-01-06 Fidelica Microsystems, Inc. Fingerprint image capture device with a passive sensor array
JP2003078279A (ja) * 2001-09-04 2003-03-14 Konica Corp プリント基板のシールド方法及びその方法を用いたプリント基板が装着された装置
US8004854B2 (en) * 2002-01-24 2011-08-23 Adc Dsl Systems, Inc. Electrical noise protection
JP2003234657A (ja) * 2002-02-08 2003-08-22 Sanyo Electric Co Ltd 無線機
JP3980933B2 (ja) * 2002-05-23 2007-09-26 ローム株式会社 イメージセンサモジュールの製造方法
US6924496B2 (en) * 2002-05-31 2005-08-02 Fujitsu Limited Fingerprint sensor and interconnect
US6903910B1 (en) * 2004-08-06 2005-06-07 Azijuth Networks, Inc. Shielded enclosure with user-installable interface modules

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