CN101257768B - 电子电路及其控制方法 - Google Patents

电子电路及其控制方法 Download PDF

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Publication number
CN101257768B
CN101257768B CN2008100876640A CN200810087664A CN101257768B CN 101257768 B CN101257768 B CN 101257768B CN 2008100876640 A CN2008100876640 A CN 2008100876640A CN 200810087664 A CN200810087664 A CN 200810087664A CN 101257768 B CN101257768 B CN 101257768B
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CN
China
Prior art keywords
sensor
circuit
power
frequency
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008100876640A
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English (en)
Chinese (zh)
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CN101257768A (zh
Inventor
山下春造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
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Hitachi Ltd
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Filing date
Publication date
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Publication of CN101257768A publication Critical patent/CN101257768A/zh
Application granted granted Critical
Publication of CN101257768B publication Critical patent/CN101257768B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transceivers (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Air Conditioning Control Device (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN2008100876640A 2004-03-09 2004-09-01 电子电路及其控制方法 Expired - Fee Related CN101257768B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004064973 2004-03-09
JP2004064973A JP4049112B2 (ja) 2004-03-09 2004-03-09 電子装置
JP2004-064973 2004-03-09

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100749810A Division CN100533997C (zh) 2004-03-09 2004-09-01 电子装置

Publications (2)

Publication Number Publication Date
CN101257768A CN101257768A (zh) 2008-09-03
CN101257768B true CN101257768B (zh) 2012-02-22

Family

ID=34918211

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2008100876640A Expired - Fee Related CN101257768B (zh) 2004-03-09 2004-09-01 电子电路及其控制方法
CNB2004100749810A Expired - Fee Related CN100533997C (zh) 2004-03-09 2004-09-01 电子装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB2004100749810A Expired - Fee Related CN100533997C (zh) 2004-03-09 2004-09-01 电子装置

Country Status (3)

Country Link
US (2) US7304857B2 (enExample)
JP (1) JP4049112B2 (enExample)
CN (2) CN101257768B (enExample)

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JP4848732B2 (ja) * 2005-10-17 2011-12-28 株式会社日立製作所 端末装置
US8290747B2 (en) * 2005-10-21 2012-10-16 Microstrain, Inc. Structural damage detection and analysis system
JP4800981B2 (ja) * 2006-02-08 2011-10-26 セイコーインスツル株式会社 無線通信装置
JP5285842B2 (ja) * 2006-04-13 2013-09-11 パナソニック株式会社 集積回路実装基板および電力線通信装置
US8118483B2 (en) * 2006-06-21 2012-02-21 Intel Corporation Thermal sensor having toggle control
JP4814018B2 (ja) 2006-08-29 2011-11-09 株式会社日立製作所 センサノード
US20080225445A1 (en) * 2007-03-14 2008-09-18 Zippy Technology Corp. Arc-discharge protection device with temperature detection mode
US8115629B2 (en) * 2009-09-24 2012-02-14 Microdata Corporation Collective objects management system using R.F. object identification with multiple crystals
KR101049477B1 (ko) 2009-09-30 2011-07-15 제주대학교 산학협력단 센서 인터페이스 보드 어셈블리
JP5470556B2 (ja) * 2010-07-16 2014-04-16 伊原電子工業株式会社 生体信号検出装置、その制御方法及びプログラム
JP5269864B2 (ja) * 2010-12-07 2013-08-21 株式会社東芝 半導体装置
US9258030B2 (en) 2011-02-10 2016-02-09 Mediatek Inc. Wireless communication device
US9369172B2 (en) 2011-02-10 2016-06-14 Mediatek Inc. Wireless communication device
US9713093B2 (en) 2011-02-10 2017-07-18 Mediatek Inc. Wireless communication device
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JP5818310B2 (ja) * 2011-06-27 2015-11-18 セイコーインスツル株式会社 センサ端末、センサシステム及びその方法
US20130039230A1 (en) * 2011-08-09 2013-02-14 Jaesik Lee Method and Device for Wireless Broadcast Power-up Sequence in Wireless Sensor Network
WO2014016867A1 (ja) * 2012-07-24 2014-01-30 ルネサスモバイル株式会社 半導体装置および電子装置
JP6340285B2 (ja) 2014-08-22 2018-06-06 ルネサスエレクトロニクス株式会社 半導体装置、電子装置およびセンシング方法
JP6571358B2 (ja) * 2015-03-24 2019-09-04 三菱重工サーマルシステムズ株式会社 電力変換用回路基板及び電動圧縮機
KR20160120496A (ko) * 2015-04-08 2016-10-18 삼성전기주식회사 실장 기판 모듈
WO2018168500A1 (ja) * 2017-03-15 2018-09-20 株式会社村田製作所 高周波モジュール及び通信装置
US11375607B2 (en) * 2019-03-28 2022-06-28 Apple Inc. Mirrored voltage regulator for high-current applications and method the same
CN115552177A (zh) * 2020-05-18 2022-12-30 三菱电机株式会社 传感器电源控制系统以及空气净化机
CN116746070A (zh) 2021-01-25 2023-09-12 三星电子株式会社 用于控制通信模块的发射功率的电子装置和方法

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Also Published As

Publication number Publication date
CN1667975A (zh) 2005-09-14
US20080130253A1 (en) 2008-06-05
US20050200002A1 (en) 2005-09-15
JP2005260291A (ja) 2005-09-22
JP4049112B2 (ja) 2008-02-20
US7663893B2 (en) 2010-02-16
US7304857B2 (en) 2007-12-04
CN100533997C (zh) 2009-08-26
CN101257768A (zh) 2008-09-03

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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120222

Termination date: 20130901