JP4049112B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP4049112B2
JP4049112B2 JP2004064973A JP2004064973A JP4049112B2 JP 4049112 B2 JP4049112 B2 JP 4049112B2 JP 2004064973 A JP2004064973 A JP 2004064973A JP 2004064973 A JP2004064973 A JP 2004064973A JP 4049112 B2 JP4049112 B2 JP 4049112B2
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JP
Japan
Prior art keywords
sensor
circuit
power
signal processing
processing circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004064973A
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English (en)
Japanese (ja)
Other versions
JP2005260291A5 (enExample
JP2005260291A (ja
Inventor
春造 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2004064973A priority Critical patent/JP4049112B2/ja
Priority to CNB2004100749810A priority patent/CN100533997C/zh
Priority to CN2008100876640A priority patent/CN101257768B/zh
Priority to US10/933,270 priority patent/US7304857B2/en
Publication of JP2005260291A publication Critical patent/JP2005260291A/ja
Publication of JP2005260291A5 publication Critical patent/JP2005260291A5/ja
Priority to US11/976,041 priority patent/US7663893B2/en
Application granted granted Critical
Publication of JP4049112B2 publication Critical patent/JP4049112B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transceivers (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Air Conditioning Control Device (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2004064973A 2004-03-09 2004-03-09 電子装置 Expired - Fee Related JP4049112B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004064973A JP4049112B2 (ja) 2004-03-09 2004-03-09 電子装置
CNB2004100749810A CN100533997C (zh) 2004-03-09 2004-09-01 电子装置
CN2008100876640A CN101257768B (zh) 2004-03-09 2004-09-01 电子电路及其控制方法
US10/933,270 US7304857B2 (en) 2004-03-09 2004-09-03 Sensor node and circuit board arrangement
US11/976,041 US7663893B2 (en) 2004-03-09 2007-10-19 Sensor node and circuit board arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004064973A JP4049112B2 (ja) 2004-03-09 2004-03-09 電子装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006139687A Division JP4301254B2 (ja) 2006-05-19 2006-05-19 電子装置およびセンサネットシステム

Publications (3)

Publication Number Publication Date
JP2005260291A JP2005260291A (ja) 2005-09-22
JP2005260291A5 JP2005260291A5 (enExample) 2006-07-06
JP4049112B2 true JP4049112B2 (ja) 2008-02-20

Family

ID=34918211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004064973A Expired - Fee Related JP4049112B2 (ja) 2004-03-09 2004-03-09 電子装置

Country Status (3)

Country Link
US (2) US7304857B2 (enExample)
JP (1) JP4049112B2 (enExample)
CN (2) CN100533997C (enExample)

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DE102004008738A1 (de) * 2004-02-23 2005-09-08 BSH Bosch und Siemens Hausgeräte GmbH Elektronische Baugruppe und Verfahren zur Herstellung dieser
JP4552670B2 (ja) * 2005-01-31 2010-09-29 株式会社日立製作所 センサノード、基地局、及びセンサネットワークシステム
JP4848732B2 (ja) * 2005-10-17 2011-12-28 株式会社日立製作所 端末装置
US8290747B2 (en) * 2005-10-21 2012-10-16 Microstrain, Inc. Structural damage detection and analysis system
JP4800981B2 (ja) * 2006-02-08 2011-10-26 セイコーインスツル株式会社 無線通信装置
JP5285842B2 (ja) * 2006-04-13 2013-09-11 パナソニック株式会社 集積回路実装基板および電力線通信装置
US8118483B2 (en) 2006-06-21 2012-02-21 Intel Corporation Thermal sensor having toggle control
JP4814018B2 (ja) 2006-08-29 2011-11-09 株式会社日立製作所 センサノード
US20080225445A1 (en) * 2007-03-14 2008-09-18 Zippy Technology Corp. Arc-discharge protection device with temperature detection mode
US8115629B2 (en) * 2009-09-24 2012-02-14 Microdata Corporation Collective objects management system using R.F. object identification with multiple crystals
KR101049477B1 (ko) 2009-09-30 2011-07-15 제주대학교 산학협력단 센서 인터페이스 보드 어셈블리
JP5470556B2 (ja) * 2010-07-16 2014-04-16 伊原電子工業株式会社 生体信号検出装置、その制御方法及びプログラム
JP5269864B2 (ja) * 2010-12-07 2013-08-21 株式会社東芝 半導体装置
US9713093B2 (en) 2011-02-10 2017-07-18 Mediatek Inc. Wireless communication device
US8971378B2 (en) 2011-02-10 2015-03-03 Mediatek Inc. Wireless communication device
US9258030B2 (en) 2011-02-10 2016-02-09 Mediatek Inc. Wireless communication device
US9369172B2 (en) 2011-02-10 2016-06-14 Mediatek Inc. Wireless communication device
JP5818310B2 (ja) * 2011-06-27 2015-11-18 セイコーインスツル株式会社 センサ端末、センサシステム及びその方法
US20130039230A1 (en) * 2011-08-09 2013-02-14 Jaesik Lee Method and Device for Wireless Broadcast Power-up Sequence in Wireless Sensor Network
CN104583897B (zh) * 2012-07-24 2017-12-26 瑞萨电子株式会社 半导体器件和电子设备
JP6340285B2 (ja) 2014-08-22 2018-06-06 ルネサスエレクトロニクス株式会社 半導体装置、電子装置およびセンシング方法
JP6571358B2 (ja) * 2015-03-24 2019-09-04 三菱重工サーマルシステムズ株式会社 電力変換用回路基板及び電動圧縮機
KR20160120496A (ko) * 2015-04-08 2016-10-18 삼성전기주식회사 실장 기판 모듈
CN110402546B (zh) * 2017-03-15 2021-06-04 株式会社村田制作所 高频模块以及通信装置
US11375607B2 (en) * 2019-03-28 2022-06-28 Apple Inc. Mirrored voltage regulator for high-current applications and method the same
CN115552177A (zh) * 2020-05-18 2022-12-30 三菱电机株式会社 传感器电源控制系统以及空气净化机
EP4228161A4 (en) 2021-01-25 2024-06-19 Samsung Electronics Co., Ltd. Electronic device and method for controlling transmission power of communication module

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JP2001127652A (ja) 1999-10-22 2001-05-11 Matsushita Electric Ind Co Ltd 高周波無線装置
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Also Published As

Publication number Publication date
US7663893B2 (en) 2010-02-16
CN101257768B (zh) 2012-02-22
US7304857B2 (en) 2007-12-04
CN101257768A (zh) 2008-09-03
CN100533997C (zh) 2009-08-26
US20080130253A1 (en) 2008-06-05
JP2005260291A (ja) 2005-09-22
US20050200002A1 (en) 2005-09-15
CN1667975A (zh) 2005-09-14

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