JP2009168987A5 - - Google Patents

Download PDF

Info

Publication number
JP2009168987A5
JP2009168987A5 JP2008005460A JP2008005460A JP2009168987A5 JP 2009168987 A5 JP2009168987 A5 JP 2009168987A5 JP 2008005460 A JP2008005460 A JP 2008005460A JP 2008005460 A JP2008005460 A JP 2008005460A JP 2009168987 A5 JP2009168987 A5 JP 2009168987A5
Authority
JP
Japan
Prior art keywords
circuit board
board module
mounting surface
frame
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008005460A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009168987A (ja
JP4425961B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008005460A priority Critical patent/JP4425961B2/ja
Priority claimed from JP2008005460A external-priority patent/JP4425961B2/ja
Priority to PCT/JP2008/003010 priority patent/WO2009090694A1/ja
Priority to US12/863,172 priority patent/US20100309639A1/en
Publication of JP2009168987A publication Critical patent/JP2009168987A/ja
Publication of JP2009168987A5 publication Critical patent/JP2009168987A5/ja
Application granted granted Critical
Publication of JP4425961B2 publication Critical patent/JP4425961B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008005460A 2008-01-15 2008-01-15 回路基板モジュール及び電子機器 Expired - Fee Related JP4425961B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008005460A JP4425961B2 (ja) 2008-01-15 2008-01-15 回路基板モジュール及び電子機器
PCT/JP2008/003010 WO2009090694A1 (ja) 2008-01-15 2008-10-23 回路基板モジュール及び電子機器
US12/863,172 US20100309639A1 (en) 2008-01-15 2008-10-23 Circuit board module and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008005460A JP4425961B2 (ja) 2008-01-15 2008-01-15 回路基板モジュール及び電子機器

Publications (3)

Publication Number Publication Date
JP2009168987A JP2009168987A (ja) 2009-07-30
JP2009168987A5 true JP2009168987A5 (enExample) 2009-09-10
JP4425961B2 JP4425961B2 (ja) 2010-03-03

Family

ID=40885105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008005460A Expired - Fee Related JP4425961B2 (ja) 2008-01-15 2008-01-15 回路基板モジュール及び電子機器

Country Status (3)

Country Link
US (1) US20100309639A1 (enExample)
JP (1) JP4425961B2 (enExample)
WO (1) WO2009090694A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8134840B2 (en) * 2006-07-25 2012-03-13 Panasonic Corporation Circuit board and mobile electronic apparatus
CN101729087A (zh) * 2008-10-21 2010-06-09 深圳富泰宏精密工业有限公司 无线通信装置
CN107071107B (zh) * 2017-04-26 2019-12-31 Oppo广东移动通信有限公司 显示组件和移动终端
US10653030B1 (en) * 2018-11-30 2020-05-12 Illinois Tool Works Inc. Water ingress prevention in electronic components

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01186699A (ja) * 1988-01-14 1989-07-26 Toyota Motor Corp 複合電子部品モジュール
JPH0726844Y2 (ja) * 1988-03-16 1995-06-14 三洋電機株式会社 混成集積回路
JPH0680767B2 (ja) * 1989-05-12 1994-10-12 三洋電機株式会社 混成集積回路装置
US5285107A (en) * 1989-04-20 1994-02-08 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JPH0492686A (ja) * 1990-08-09 1992-03-25 San & San:Kk パチンコ玉発射装置におけるハンマーヘッド
JPH09321446A (ja) * 1996-05-28 1997-12-12 Nippon Seiki Co Ltd 電子回路ユニット
JPH11307968A (ja) * 1998-04-20 1999-11-05 Matsushita Electric Ind Co Ltd 電子制御装置の放熱構造
JP2000208905A (ja) * 1999-01-14 2000-07-28 Nec Corp プリント基板
US6588132B2 (en) * 2000-05-25 2003-07-08 Rohm Co., Ltd. Light emitting display device
US6482346B1 (en) * 2000-11-21 2002-11-19 Ross Alcazar Method for manufacturing an in-mold display
US6806938B2 (en) * 2001-08-30 2004-10-19 Kyocera Corporation Liquid crystal display device with particular on substrate wiring, portable terminal and display equipment provided with the liquid crystal display device
JP4581726B2 (ja) * 2004-12-28 2010-11-17 ソニー株式会社 表示装置および携帯機器
TWI354155B (en) * 2005-07-22 2011-12-11 Sony Corp Display
JP5091500B2 (ja) * 2007-02-20 2012-12-05 株式会社ジャパンディスプレイイースト 液晶表示装置

Similar Documents

Publication Publication Date Title
JP2010219210A5 (ja) 半導体装置
ATE550671T1 (de) Anordnungen für einen integrierten sensor
JP2016164684A5 (ja) 電子機器
PL1749392T3 (pl) Wielofunkcyjne dwupanelowe urządzenie elektroniczne z przemieszczeniem względnym 360°
EP2226696A4 (en) DRIVE MODULE AND ELECTRONIC DEVICE THEREFOR
TW200733724A (en) Image pickup apparatus, camera module, electronic device, and fabrication method for image pickup apparatus
TW200627945A (en) Electronic device able to adjust the size of the display area
WO2007124050A3 (en) Probe structures with electronic components
WO2011122842A3 (en) Polyimide film
EP2046107A4 (en) PRINTED CIRCUIT BOARD DEVICE, ELECTRONIC DEVICE WITH PRINTED CIRCUIT BOARD DEVICE, AND MASS CONNECTION METHOD
JP2013019825A5 (enExample)
ATE502399T1 (de) Schaltungsvorrichtung mit gebondetem smd-bauteil
TW200638081A (en) Dual panel display
JP2011180325A5 (enExample)
JP2009168987A5 (enExample)
WO2010121666A3 (en) Electronic structure
EP1978792A4 (en) SUBSTRATE STRUCTURE AND ELECTRONIC ARRANGEMENT
JP2009086276A5 (enExample)
EP1722018A4 (en) DOUBLE TEXTILE GLASS TEXTILE, AND PREIMPREGNE AND SUBSTRATE FOR PRINTED WIRING BOARD USING TEXTILE GLASS FABRIC
TW200628878A (en) Display apparatus
EP2530554A3 (en) Portable electronic device
EP2371535A4 (en) FLEXIBLE COATING AND A FLEXIBLE SUBSTRATE FOR ELECTRONIC CIRCUITS SHAPED WITH THEIR HELP
WO2009041317A1 (ja) 表示装置
JP2008245718A5 (enExample)
WO2008117650A1 (ja) 主回路モジュール