JP2005259739A - 回路基板 - Google Patents

回路基板 Download PDF

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Publication number
JP2005259739A
JP2005259739A JP2004065100A JP2004065100A JP2005259739A JP 2005259739 A JP2005259739 A JP 2005259739A JP 2004065100 A JP2004065100 A JP 2004065100A JP 2004065100 A JP2004065100 A JP 2004065100A JP 2005259739 A JP2005259739 A JP 2005259739A
Authority
JP
Japan
Prior art keywords
circuit board
flux
electronic components
terminals
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004065100A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005259739A5 (https=
Inventor
Tsutomu Higashiyama
強 東山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orion Electric Co Ltd
Original Assignee
Orion Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orion Electric Co Ltd filed Critical Orion Electric Co Ltd
Priority to JP2004065100A priority Critical patent/JP2005259739A/ja
Priority to US11/073,846 priority patent/US7291912B2/en
Publication of JP2005259739A publication Critical patent/JP2005259739A/ja
Publication of JP2005259739A5 publication Critical patent/JP2005259739A5/ja
Withdrawn legal-status Critical Current

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Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2004065100A 2004-03-09 2004-03-09 回路基板 Withdrawn JP2005259739A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004065100A JP2005259739A (ja) 2004-03-09 2004-03-09 回路基板
US11/073,846 US7291912B2 (en) 2004-03-09 2005-03-08 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004065100A JP2005259739A (ja) 2004-03-09 2004-03-09 回路基板

Publications (2)

Publication Number Publication Date
JP2005259739A true JP2005259739A (ja) 2005-09-22
JP2005259739A5 JP2005259739A5 (https=) 2006-08-10

Family

ID=34918217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004065100A Withdrawn JP2005259739A (ja) 2004-03-09 2004-03-09 回路基板

Country Status (2)

Country Link
US (1) US7291912B2 (https=)
JP (1) JP2005259739A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016225490A (ja) * 2015-06-01 2016-12-28 シャープ株式会社 プリント基板およびそれを備えた冷蔵庫

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571558U (https=) * 1978-11-08 1980-05-16
JPH0536871U (ja) 1990-12-27 1993-05-18 オリンパス光学工業株式会社 回路接続用フレキシブル基板
JPH05110242A (ja) 1991-10-17 1993-04-30 Matsushita Electric Ind Co Ltd 基 板
JPH07114315B2 (ja) 1992-05-22 1995-12-06 富士機工電子株式会社 狭ピッチ電極をもつ電子部品の実装用プリント基板
TW269705B (https=) 1992-06-15 1996-02-01 Hoechst Celanese Corp
US6803514B2 (en) * 2001-03-23 2004-10-12 Canon Kabushiki Kaisha Mounting structure and mounting method of a photovoltaic element, mounting substrate for mounting a semiconductor element thereon and method for mounting a semiconductor element on said mounting substrate
JP2003338682A (ja) * 2002-01-11 2003-11-28 Nec Infrontia Corp はんだ付け方法及びはんだ接合体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016225490A (ja) * 2015-06-01 2016-12-28 シャープ株式会社 プリント基板およびそれを備えた冷蔵庫

Also Published As

Publication number Publication date
US20050200010A1 (en) 2005-09-15
US7291912B2 (en) 2007-11-06

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