JP2005242264A - 透明導電性薄膜積層体およびそれを用いたプラズマディスプレイパネル用光学フィルター - Google Patents
透明導電性薄膜積層体およびそれを用いたプラズマディスプレイパネル用光学フィルター Download PDFInfo
- Publication number
- JP2005242264A JP2005242264A JP2004055546A JP2004055546A JP2005242264A JP 2005242264 A JP2005242264 A JP 2005242264A JP 2004055546 A JP2004055546 A JP 2004055546A JP 2004055546 A JP2004055546 A JP 2004055546A JP 2005242264 A JP2005242264 A JP 2005242264A
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- Prior art keywords
- thin film
- transparent conductive
- conductive thin
- layer
- silver
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010409 thin film Substances 0.000 title claims abstract description 182
- 230000003287 optical effect Effects 0.000 title claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 74
- 239000002184 metal Substances 0.000 claims abstract description 74
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052709 silver Inorganic materials 0.000 claims abstract description 40
- 239000004332 silver Substances 0.000 claims abstract description 40
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 15
- 239000001301 oxygen Substances 0.000 claims abstract description 15
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 14
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052738 indium Inorganic materials 0.000 claims abstract description 14
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 35
- 239000010949 copper Substances 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 20
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 17
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 15
- 229910052779 Neodymium Inorganic materials 0.000 claims description 15
- 229910052763 palladium Inorganic materials 0.000 claims description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 239000010931 gold Substances 0.000 claims description 12
- 229910052737 gold Inorganic materials 0.000 claims description 11
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 34
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract description 21
- 238000000411 transmission spectrum Methods 0.000 abstract description 14
- 229910045601 alloy Inorganic materials 0.000 abstract description 11
- 239000000956 alloy Substances 0.000 abstract description 11
- 235000019646 color tone Nutrition 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 133
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 52
- 238000002834 transmittance Methods 0.000 description 47
- 239000011780 sodium chloride Substances 0.000 description 26
- 239000007864 aqueous solution Substances 0.000 description 22
- 239000000758 substrate Substances 0.000 description 22
- 238000012360 testing method Methods 0.000 description 22
- 238000000034 method Methods 0.000 description 17
- 238000011156 evaluation Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 13
- 238000004220 aggregation Methods 0.000 description 12
- 230000002776 aggregation Effects 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 230000007547 defect Effects 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 238000007654 immersion Methods 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 8
- -1 chlorine ions Chemical class 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
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- 239000000523 sample Substances 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- 229910000583 Nd alloy Inorganic materials 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- AZWHFTKIBIQKCA-UHFFFAOYSA-N [Sn+2]=O.[O-2].[In+3] Chemical compound [Sn+2]=O.[O-2].[In+3] AZWHFTKIBIQKCA-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- RYZCLUQMCYZBJQ-UHFFFAOYSA-H lead(2+);dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Pb+2].[Pb+2].[Pb+2].[O-]C([O-])=O.[O-]C([O-])=O RYZCLUQMCYZBJQ-UHFFFAOYSA-H 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- 239000005341 toughened glass Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 241000519995 Stachys sylvatica Species 0.000 description 1
- MKURPJISKHBIOB-UHFFFAOYSA-N [O-2].[Ce+3].[O-2].[In+3] Chemical compound [O-2].[Ce+3].[O-2].[In+3] MKURPJISKHBIOB-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Images
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004055546A JP2005242264A (ja) | 2004-02-27 | 2004-02-27 | 透明導電性薄膜積層体およびそれを用いたプラズマディスプレイパネル用光学フィルター |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004055546A JP2005242264A (ja) | 2004-02-27 | 2004-02-27 | 透明導電性薄膜積層体およびそれを用いたプラズマディスプレイパネル用光学フィルター |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005242264A true JP2005242264A (ja) | 2005-09-08 |
| JP2005242264A5 JP2005242264A5 (enExample) | 2006-07-27 |
Family
ID=35024028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004055546A Withdrawn JP2005242264A (ja) | 2004-02-27 | 2004-02-27 | 透明導電性薄膜積層体およびそれを用いたプラズマディスプレイパネル用光学フィルター |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005242264A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007046181A1 (ja) * | 2005-10-19 | 2007-04-26 | Idemitsu Kosan Co., Ltd. | 半導体薄膜及びその製造方法 |
| JP2008221732A (ja) * | 2007-03-15 | 2008-09-25 | Kiyoshi Chiba | 積層体 |
| WO2011016387A1 (ja) * | 2009-08-05 | 2011-02-10 | 住友金属鉱山株式会社 | イオンプレーティング用タブレットとその製造方法、および透明導電膜 |
| JP2011132556A (ja) * | 2009-12-22 | 2011-07-07 | Sumitomo Metal Mining Co Ltd | 酸化物蒸着材と高屈折率透明膜 |
| DE112011100332T5 (de) | 2010-01-25 | 2012-11-22 | Sumitomo Metal Mining Company Limited | Oxidverdampfungsmaterial, dampfabgeschiedene dünnschicht und solarzelle |
-
2004
- 2004-02-27 JP JP2004055546A patent/JP2005242264A/ja not_active Withdrawn
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8062777B2 (en) | 2005-10-19 | 2011-11-22 | Idemitsu Kosan, Co., Ltd. | Semiconductor thin film and process for producing the same |
| JP2007113048A (ja) * | 2005-10-19 | 2007-05-10 | Idemitsu Kosan Co Ltd | 半導体薄膜及びその製造方法 |
| CN101233257B (zh) * | 2005-10-19 | 2010-09-22 | 出光兴产株式会社 | 半导体薄膜及其制造方法 |
| WO2007046181A1 (ja) * | 2005-10-19 | 2007-04-26 | Idemitsu Kosan Co., Ltd. | 半導体薄膜及びその製造方法 |
| JP2008221732A (ja) * | 2007-03-15 | 2008-09-25 | Kiyoshi Chiba | 積層体 |
| US9005487B2 (en) | 2009-08-05 | 2015-04-14 | Sumitomo Metal Mining Co., Ltd. | Tablet for ion plating, production method therefor and transparent conductive film |
| CN102482154A (zh) * | 2009-08-05 | 2012-05-30 | 住友金属矿山株式会社 | 离子镀用片料和其制造方法以及透明导电膜 |
| CN102482154B (zh) * | 2009-08-05 | 2014-09-17 | 住友金属矿山株式会社 | 离子镀用片料和其制造方法以及透明导电膜 |
| WO2011016387A1 (ja) * | 2009-08-05 | 2011-02-10 | 住友金属鉱山株式会社 | イオンプレーティング用タブレットとその製造方法、および透明導電膜 |
| JP5733208B2 (ja) * | 2009-08-05 | 2015-06-10 | 住友金属鉱山株式会社 | イオンプレーティング用タブレットとその製造方法、および透明導電膜 |
| EP2952493A3 (en) * | 2009-08-05 | 2016-01-20 | Sumitomo Metal Mining Co., Ltd. | Oxide sintered body, production method therefor, target, and transparent conductive film |
| US9721770B2 (en) | 2009-08-05 | 2017-08-01 | Sumitomo Metal Mining Co., Ltd. | Oxide sintered body, production method therefor, target, and transparent conductive film |
| JP2011132556A (ja) * | 2009-12-22 | 2011-07-07 | Sumitomo Metal Mining Co Ltd | 酸化物蒸着材と高屈折率透明膜 |
| US8343387B2 (en) | 2009-12-22 | 2013-01-01 | Sumitomo Metal Mining Co., Ltd. | Oxide evaporation material and high-refractive-index transparent film |
| DE112011100332T5 (de) | 2010-01-25 | 2012-11-22 | Sumitomo Metal Mining Company Limited | Oxidverdampfungsmaterial, dampfabgeschiedene dünnschicht und solarzelle |
| US8941002B2 (en) | 2010-01-25 | 2015-01-27 | Sumitomo Metal Mining Co., Ltd. | Oxide evaporation material, vapor-deposited thin film, and solar cell |
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