JP2005236136A - ワイヤボンディング装置 - Google Patents
ワイヤボンディング装置 Download PDFInfo
- Publication number
- JP2005236136A JP2005236136A JP2004045130A JP2004045130A JP2005236136A JP 2005236136 A JP2005236136 A JP 2005236136A JP 2004045130 A JP2004045130 A JP 2004045130A JP 2004045130 A JP2004045130 A JP 2004045130A JP 2005236136 A JP2005236136 A JP 2005236136A
- Authority
- JP
- Japan
- Prior art keywords
- bonding arm
- preload
- piezoelectric element
- mounting base
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000036316 preload Effects 0.000 claims abstract description 51
- 238000006243 chemical reaction Methods 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
【解決手段】キャピラリ3をボンディングアーム1の軸線方向に振動させるように、ボンディングアーム1のキャピラリ取付部近傍に圧電素子4を組み込んでいる。圧電素子4に予圧をかける予圧付与手段は、圧電素子4の後方に配設された2個のくさび状取付台座5、6と、ボンディングアーム1の外周よりくさび状取付台座6に螺合した予圧用ボルト7とよりなり、予圧用ボルト7の回転によるくさび状取付台座5のボンディングアーム1の軸線方向の移動によって圧電素子4に予圧をかける。
【選択図】 図1
Description
2 ワイヤ
3 キャピラリ
4 圧電素子
5、6 くさび状取付台座
7 予圧用ボルト
10 偏心ピン
10a 軸部
10b 操作部
11 取付台座
Claims (3)
- キャピラリをボンディングアームの軸線方向に振動させるように、ボンディングアームのキャピラリ取付部近傍に圧電素子を組み込み、この圧電素子に予圧をかける予圧付与手段を備えたワイヤボンディング装置において、前記予圧付与手段は、前記ボンディングアームの外周より操作する外部操作部と、この外部操作部の移動を前記ボンディングアームの軸線方向の移動に変換して前記圧電素子に予圧をかける変換部とからなることを特徴とするワイヤボンディング装置。
- 前記予圧付与手段は、前記圧電素子の後方に配設された2個の前方及び後方のくさび状取付台座と、前記ボンディングアームの外周より前記後方のくさび状取付台座に螺合した予圧用ボルトとよりなり、前記予圧用ボルトの回転による前記後方のくさび状取付台座の前記予圧用ボルト方向の移動によって前記前方のくさび状取付台座のボンディングアームの軸線方向の移動によって前記圧電素子に予圧をかけることを特徴とする請求項1記載のワイヤボンディング装置。
- 前記予圧付与手段は、前記圧電素子の後方に配設された取付台座と、この取付台座を前記ボンディングアームの軸線方向に移動させる偏心ピンとよりなり、前記偏心ピンは、ボンディングアームに回転自在に支承された軸部と、この軸部より偏心し外部より操作可能に前記ボンディングアームの外周に突出した操作部とよりなり、前記操作部の操作によって前記取付台座が前記ボンディングアームの軸線方向に移動して前記圧電素子に予圧をかけることを特徴とする請求項1記載のワイヤボンディング装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004045130A JP4535235B2 (ja) | 2004-02-20 | 2004-02-20 | ワイヤボンディング装置 |
TW093139083A TW200529341A (en) | 2004-02-20 | 2004-12-16 | Wire bonding apparatus |
KR1020050004066A KR100649893B1 (ko) | 2004-02-20 | 2005-01-17 | 와이어 본딩장치 |
US11/061,271 US7565994B2 (en) | 2004-02-20 | 2005-02-17 | Wire bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004045130A JP4535235B2 (ja) | 2004-02-20 | 2004-02-20 | ワイヤボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005236136A true JP2005236136A (ja) | 2005-09-02 |
JP4535235B2 JP4535235B2 (ja) | 2010-09-01 |
Family
ID=34858095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004045130A Expired - Fee Related JP4535235B2 (ja) | 2004-02-20 | 2004-02-20 | ワイヤボンディング装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7565994B2 (ja) |
JP (1) | JP4535235B2 (ja) |
KR (1) | KR100649893B1 (ja) |
TW (1) | TW200529341A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022172352A1 (ja) * | 2021-02-10 | 2022-08-18 | 株式会社新川 | 超音波ホーン |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5583179B2 (ja) * | 2012-08-03 | 2014-09-03 | 株式会社カイジョー | ボンディング装置 |
JP6316340B2 (ja) * | 2016-06-02 | 2018-04-25 | 株式会社カイジョー | ボンディング装置、ボンディング方法及びボンディング制御プログラム |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5718130A (en) | 1980-07-08 | 1982-01-29 | Citizen Watch Co Ltd | Frequency dividing circuit |
JPS63297048A (ja) | 1987-05-29 | 1988-12-05 | Seiko Epson Corp | インクジェット記録ヘッド |
JP2556161B2 (ja) | 1990-02-21 | 1996-11-20 | 三菱電機株式会社 | 平面型表示装置 |
JPH0448663A (ja) | 1990-06-14 | 1992-02-18 | Brother Ind Ltd | 積層縦効果圧電素子 |
JP3245445B2 (ja) | 1992-03-26 | 2002-01-15 | 株式会社新川 | ワイヤボンデイング装置 |
JP3525313B2 (ja) | 1995-06-30 | 2004-05-10 | 太平洋セメント株式会社 | レバー変位拡大機構付位置決め装置 |
-
2004
- 2004-02-20 JP JP2004045130A patent/JP4535235B2/ja not_active Expired - Fee Related
- 2004-12-16 TW TW093139083A patent/TW200529341A/zh not_active IP Right Cessation
-
2005
- 2005-01-17 KR KR1020050004066A patent/KR100649893B1/ko not_active IP Right Cessation
- 2005-02-17 US US11/061,271 patent/US7565994B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022172352A1 (ja) * | 2021-02-10 | 2022-08-18 | 株式会社新川 | 超音波ホーン |
JP7429465B2 (ja) | 2021-02-10 | 2024-02-08 | 株式会社新川 | 超音波ホーン |
Also Published As
Publication number | Publication date |
---|---|
KR100649893B1 (ko) | 2006-11-27 |
KR20050083021A (ko) | 2005-08-24 |
US20050184128A1 (en) | 2005-08-25 |
JP4535235B2 (ja) | 2010-09-01 |
TWI330873B (ja) | 2010-09-21 |
US7565994B2 (en) | 2009-07-28 |
TW200529341A (en) | 2005-09-01 |
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