JP2005216508A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005216508A5 JP2005216508A5 JP2004018102A JP2004018102A JP2005216508A5 JP 2005216508 A5 JP2005216508 A5 JP 2005216508A5 JP 2004018102 A JP2004018102 A JP 2004018102A JP 2004018102 A JP2004018102 A JP 2004018102A JP 2005216508 A5 JP2005216508 A5 JP 2005216508A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- metal paste
- resist
- organic solvent
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 8
- 239000004065 semiconductor Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 4
- 238000001035 drying Methods 0.000 claims 3
- 239000003960 organic solvent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 238000005245 sintering Methods 0.000 claims 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims 1
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229920000180 alkyd Polymers 0.000 claims 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims 1
- 239000012461 cellulose resin Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims 1
- 238000005553 drilling Methods 0.000 claims 1
- 150000002148 esters Chemical group 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000010665 pine oil Substances 0.000 claims 1
- 229940116411 terpineol Drugs 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004018102A JP4255847B2 (ja) | 2004-01-27 | 2004-01-27 | 金属ペーストを用いた半導体ウェハーへのバンプの形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004018102A JP4255847B2 (ja) | 2004-01-27 | 2004-01-27 | 金属ペーストを用いた半導体ウェハーへのバンプの形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005216508A JP2005216508A (ja) | 2005-08-11 |
| JP2005216508A5 true JP2005216508A5 (https=) | 2006-03-09 |
| JP4255847B2 JP4255847B2 (ja) | 2009-04-15 |
Family
ID=34902707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004018102A Expired - Lifetime JP4255847B2 (ja) | 2004-01-27 | 2004-01-27 | 金属ペーストを用いた半導体ウェハーへのバンプの形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4255847B2 (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7766218B2 (en) | 2005-09-21 | 2010-08-03 | Nihon Handa Co., Ltd. | Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board |
| JP4770643B2 (ja) | 2005-10-12 | 2011-09-14 | エプソントヨコム株式会社 | 圧電デバイス及び、その製造方法 |
| EP2012352A4 (en) * | 2006-04-24 | 2012-07-25 | Murata Manufacturing Co | ELECTRONIC COMPONENT, ELECTRONIC COMPONENT DEVICE THEREFOR AND METHOD OF MANUFACTURING THEREOF |
| JP4638382B2 (ja) * | 2006-06-05 | 2011-02-23 | 田中貴金属工業株式会社 | 接合方法 |
| JP5065718B2 (ja) * | 2006-06-20 | 2012-11-07 | 田中貴金属工業株式会社 | 圧電素子の気密封止方法、及び、圧電デバイスの製造方法 |
| WO2008114784A1 (ja) | 2007-03-22 | 2008-09-25 | Tanaka Kikinzoku Kogyo K. K. | 封止用の金属ペースト及び圧電素子の気密封止方法並びに圧電デバイス |
| JP5119866B2 (ja) * | 2007-03-22 | 2013-01-16 | セイコーエプソン株式会社 | 水晶デバイス及びその封止方法 |
| US8069549B2 (en) | 2007-03-22 | 2011-12-06 | Seiko Epson Corporation | Method for sealing a quartz crystal device |
| JP2009200675A (ja) * | 2008-02-20 | 2009-09-03 | Epson Toyocom Corp | 圧電デバイス及び圧電デバイスの製造方法 |
| JP5363839B2 (ja) * | 2008-05-12 | 2013-12-11 | 田中貴金属工業株式会社 | バンプ及び該バンプの形成方法並びに該バンプが形成された基板の実装方法 |
| JP5076166B2 (ja) * | 2008-05-16 | 2012-11-21 | セイコーエプソン株式会社 | 圧電デバイス及びその封止方法 |
| US10046418B2 (en) | 2010-03-18 | 2018-08-14 | Furukawa Electric Co., Ltd. | Electrically conductive paste, and electrically conducive connection member produced using the paste |
| US10177079B2 (en) | 2010-03-19 | 2019-01-08 | Furukawa Electric Co., Ltd. | Conductive connecting member and manufacturing method of same |
| JP5520097B2 (ja) | 2010-03-23 | 2014-06-11 | 富士フイルム株式会社 | 微小構造体の製造方法 |
| US9539671B2 (en) | 2010-10-08 | 2017-01-10 | Tanaka Kikinzoku K.K. | Precious metal paste for bonding semiconductor element |
| JP4859996B1 (ja) * | 2010-11-26 | 2012-01-25 | 田中貴金属工業株式会社 | 金属配線形成用の転写基板による金属配線の形成方法 |
| JP5202714B1 (ja) | 2011-11-18 | 2013-06-05 | 田中貴金属工業株式会社 | 金属配線形成用の転写基板及び前記転写用基板による金属配線の形成方法 |
| JP6049121B2 (ja) * | 2012-01-10 | 2016-12-21 | 有限会社 ナプラ | 機能性材料、電子デバイス、電磁波吸収／遮蔽デバイス及びそれらの製造方法 |
| JP5978840B2 (ja) * | 2012-08-02 | 2016-08-24 | 住友金属鉱山株式会社 | 銀粉及びその製造方法、並びに銀ペースト |
| JP2016093830A (ja) * | 2014-11-14 | 2016-05-26 | 千住金属工業株式会社 | 無残渣型継手形成用Ａｇナノペースト |
| TW202541302A (zh) * | 2019-02-04 | 2025-10-16 | 日商索尼半導體解決方案公司 | 電子裝置 |
| US20230005870A1 (en) * | 2021-07-01 | 2023-01-05 | Macom Technology Solutions Holdings, Inc. | 3d printed interconnects and resonators for semiconductor devices |
-
2004
- 2004-01-27 JP JP2004018102A patent/JP4255847B2/ja not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2005216508A5 (https=) | ||
| JP4255847B2 (ja) | 金属ペーストを用いた半導体ウェハーへのバンプの形成方法 | |
| JP2014503936A5 (https=) | ||
| EP1713092A3 (en) | Conductive compositions and processes for their use in the manufacture of semiconductor devices | |
| WO2008114784A1 (ja) | 封止用の金属ペースト及び圧電素子の気密封止方法並びに圧電デバイス | |
| US20130313687A1 (en) | Through via/the buried via elrctrolde material and the said via structure and the said via manufacturing method | |
| EP1684559A4 (en) | Conductive Paste and Multi-Layered Ceramic Substrate | |
| JP2005026702A5 (https=) | ||
| JP2018511180A5 (https=) | ||
| TW200739629A (en) | Release layer paste and method of production of a multilayer type electronic device | |
| JP2014517531A5 (https=) | ||
| JP2011023574A5 (https=) | ||
| CN104517922B (zh) | 层叠式封装结构及其制法 | |
| JP2017501578A5 (https=) | ||
| JP2019536286A5 (https=) | ||
| JP4859996B1 (ja) | 金属配線形成用の転写基板による金属配線の形成方法 | |
| JP2005059125A5 (ja) | 構造体及びその製造方法 | |
| US9589864B2 (en) | Substrate with embedded sintered heat spreader and process for making the same | |
| JP2010123830A5 (https=) | ||
| CN105849893A (zh) | 气密性密封封装体构件及其制造方法、以及使用了该气密性密封封装体构件的气密性密封封装体的制造方法 | |
| CN107267938A (zh) | 一种新型抗氧化纳米铜焊膏及其制备方法和应用 | |
| JP2006512765A5 (https=) | ||
| TWI301740B (en) | Method for fabricating circuit board with electrically connected structure | |
| JP2011003859A5 (https=) | ||
| JP2011192947A (ja) | 焼結層の製造方法及び構造体 |