JP2018511180A5 - - Google Patents
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- Publication number
- JP2018511180A5 JP2018511180A5 JP2017550148A JP2017550148A JP2018511180A5 JP 2018511180 A5 JP2018511180 A5 JP 2018511180A5 JP 2017550148 A JP2017550148 A JP 2017550148A JP 2017550148 A JP2017550148 A JP 2017550148A JP 2018511180 A5 JP2018511180 A5 JP 2018511180A5
- Authority
- JP
- Japan
- Prior art keywords
- cobalt
- connection layer
- layer
- containing connection
- bond pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/665,799 US9960135B2 (en) | 2015-03-23 | 2015-03-23 | Metal bond pad with cobalt interconnect layer and solder thereon |
| US14/665,799 | 2015-03-23 | ||
| PCT/US2016/023785 WO2016154315A1 (en) | 2015-03-23 | 2016-03-23 | Metal bond pad with cobalt interconnect layer and solder thereon |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018511180A JP2018511180A (ja) | 2018-04-19 |
| JP2018511180A5 true JP2018511180A5 (https=) | 2019-04-04 |
Family
ID=56975786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017550148A Pending JP2018511180A (ja) | 2015-03-23 | 2016-03-23 | コバルト相互接続層及びその上のはんだを備えた金属ボンドパッド |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9960135B2 (https=) |
| EP (1) | EP3275009A4 (https=) |
| JP (1) | JP2018511180A (https=) |
| CN (1) | CN107431000A (https=) |
| WO (1) | WO2016154315A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9971970B1 (en) * | 2015-04-27 | 2018-05-15 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with VIAS and methods for making the same |
| US10160639B2 (en) | 2016-06-27 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structure for MEMS Device |
| US10131541B2 (en) | 2016-07-21 | 2018-11-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | MEMS devices having tethering structures |
| US11121301B1 (en) | 2017-06-19 | 2021-09-14 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafers and their methods of manufacture |
| US11183472B2 (en) * | 2017-11-28 | 2021-11-23 | Sony Semiconductor Solutions Corporation | Semiconductor device and manufacturing method of semiconductor device for improving solder connection strength |
| US10546852B2 (en) * | 2018-05-03 | 2020-01-28 | Qualcomm Incorporated | Integrated semiconductor devices and method of fabricating the same |
| US10840185B2 (en) | 2019-03-05 | 2020-11-17 | Texas Instruments Incorporated | Semiconductor device with vias having a zinc-second metal-copper composite layer |
| US12607594B2 (en) | 2020-09-03 | 2026-04-21 | Texas Instruments Incorporated | ISFET biosensor |
| CN114765125B (zh) * | 2021-01-12 | 2025-11-25 | 联华电子股份有限公司 | 集成电路结构及其制作方法 |
| US11676920B2 (en) | 2021-01-26 | 2023-06-13 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
| US20230187390A1 (en) * | 2021-12-15 | 2023-06-15 | Texas Instruments Incorporated | Semiconductor die with dissolvable metal layer |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5260234A (en) | 1990-12-20 | 1993-11-09 | Vlsi Technology, Inc. | Method for bonding a lead to a die pad using an electroless plating solution |
| US5344793A (en) | 1993-03-05 | 1994-09-06 | Siemens Aktiengesellschaft | Formation of silicided junctions in deep sub-micron MOSFETs by defect enhanced CoSi2 formation |
| US5976344A (en) * | 1996-05-10 | 1999-11-02 | Lucent Technologies Inc. | Composition for electroplating palladium alloys and electroplating process using that composition |
| JPH11340265A (ja) * | 1998-05-22 | 1999-12-10 | Sony Corp | 半導体装置及びその製造方法 |
| US6452271B2 (en) | 1998-07-31 | 2002-09-17 | Micron Technology, Inc. | Interconnect component for a semiconductor die including a ruthenium layer and a method for its fabrication |
| US6534192B1 (en) * | 1999-09-24 | 2003-03-18 | Lucent Technologies Inc. | Multi-purpose finish for printed wiring boards and method of manufacture of such boards |
| DE10231385B4 (de) * | 2001-07-10 | 2007-02-22 | Samsung Electronics Co., Ltd., Suwon | Halbleiterchip mit Bondkontaktstellen und zugehörige Mehrchippackung |
| US20040096592A1 (en) | 2002-11-19 | 2004-05-20 | Chebiam Ramanan V. | Electroless cobalt plating solution and plating techniques |
| US7064446B2 (en) * | 2004-03-29 | 2006-06-20 | Intel Corporation | Under bump metallization layer to enable use of high tin content solder bumps |
| US7410833B2 (en) * | 2004-03-31 | 2008-08-12 | International Business Machines Corporation | Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
| US8148822B2 (en) * | 2005-07-29 | 2012-04-03 | Megica Corporation | Bonding pad on IC substrate and method for making the same |
| US8399989B2 (en) * | 2005-07-29 | 2013-03-19 | Megica Corporation | Metal pad or metal bump over pad exposed by passivation layer |
| US8771804B2 (en) * | 2005-08-31 | 2014-07-08 | Lam Research Corporation | Processes and systems for engineering a copper surface for selective metal deposition |
| KR100804392B1 (ko) * | 2005-12-02 | 2008-02-15 | 주식회사 네패스 | 반도체 패키지 및 그 제조 방법 |
| US20070158199A1 (en) * | 2005-12-30 | 2007-07-12 | Haight Scott M | Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps |
| US8367543B2 (en) * | 2006-03-21 | 2013-02-05 | International Business Machines Corporation | Structure and method to improve current-carrying capabilities of C4 joints |
| US7752996B2 (en) * | 2006-05-11 | 2010-07-13 | Lam Research Corporation | Apparatus for applying a plating solution for electroless deposition |
| US20080003803A1 (en) | 2006-06-30 | 2008-01-03 | Pei-Haw Tsao | Semiconductor package substrate for flip chip packaging |
| US7498646B2 (en) * | 2006-07-19 | 2009-03-03 | Advanced Chip Engineering Technology Inc. | Structure of image sensor module and a method for manufacturing of wafer level package |
| TWI370515B (en) * | 2006-09-29 | 2012-08-11 | Megica Corp | Circuit component |
| US20090174069A1 (en) * | 2008-01-04 | 2009-07-09 | National Semiconductor Corporation | I/o pad structure for enhancing solder joint reliability in integrated circuit devices |
| US8158519B2 (en) | 2008-10-20 | 2012-04-17 | Eon Silicon Solution Inc. | Method of manufacturing non-volatile memory cell using self-aligned metal silicide |
| US20100099250A1 (en) * | 2008-10-21 | 2010-04-22 | Samsung Electronics Co., Ltd. | Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers |
| JP5457374B2 (ja) * | 2009-01-29 | 2014-04-02 | Ｊｘ日鉱日石金属株式会社 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
| US8563396B2 (en) * | 2011-01-29 | 2013-10-22 | International Business Machines Corporation | 3D integration method using SOI substrates and structures produced thereby |
| US9012265B2 (en) * | 2012-03-26 | 2015-04-21 | Ge Yi | Magnet assisted alignment method for wafer bonding and wafer level chip scale packaging |
| KR101890711B1 (ko) * | 2012-05-03 | 2018-08-22 | 에스케이하이닉스 주식회사 | 범프 버퍼 스프링패드부를 포함하는 전자 소자의 패키지 및 제조 방법 |
| US9716035B2 (en) * | 2014-06-20 | 2017-07-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Combination interconnect structure and methods of forming same |
| TWI550803B (zh) * | 2015-02-17 | 2016-09-21 | 南茂科技股份有限公司 | 封裝半導體裝置 |
-
2015
- 2015-03-23 US US14/665,799 patent/US9960135B2/en active Active
-
2016
- 2016-03-23 JP JP2017550148A patent/JP2018511180A/ja active Pending
- 2016-03-23 WO PCT/US2016/023785 patent/WO2016154315A1/en not_active Ceased
- 2016-03-23 EP EP16769611.1A patent/EP3275009A4/en active Pending
- 2016-03-23 CN CN201680018085.3A patent/CN107431000A/zh active Pending
-
2018
- 2018-03-27 US US15/936,748 patent/US20180218993A1/en not_active Abandoned
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