JP2005200214A5 - - Google Patents

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Publication number
JP2005200214A5
JP2005200214A5 JP2004344301A JP2004344301A JP2005200214A5 JP 2005200214 A5 JP2005200214 A5 JP 2005200214A5 JP 2004344301 A JP2004344301 A JP 2004344301A JP 2004344301 A JP2004344301 A JP 2004344301A JP 2005200214 A5 JP2005200214 A5 JP 2005200214A5
Authority
JP
Japan
Prior art keywords
substrate support
substrate
gripping means
roller
operating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004344301A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005200214A (ja
Filing date
Publication date
Priority claimed from DE10355679A external-priority patent/DE10355679B4/de
Application filed filed Critical
Publication of JP2005200214A publication Critical patent/JP2005200214A/ja
Publication of JP2005200214A5 publication Critical patent/JP2005200214A5/ja
Pending legal-status Critical Current

Links

JP2004344301A 2003-11-28 2004-11-29 基板支持体アダプタシステム Pending JP2005200214A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10355679A DE10355679B4 (de) 2003-11-28 2003-11-28 Substratträger, Vorrichtung und Verfahren zum Handhaben des Substratträgers und Verwendung in Beschichtungsprozessen

Publications (2)

Publication Number Publication Date
JP2005200214A JP2005200214A (ja) 2005-07-28
JP2005200214A5 true JP2005200214A5 (https=) 2007-07-19

Family

ID=34442326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004344301A Pending JP2005200214A (ja) 2003-11-28 2004-11-29 基板支持体アダプタシステム

Country Status (6)

Country Link
US (1) US20050142290A1 (https=)
EP (1) EP1538236B1 (https=)
JP (1) JP2005200214A (https=)
AT (1) ATE396288T1 (https=)
DE (2) DE10355679B4 (https=)
ES (1) ES2305651T3 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005045718B4 (de) * 2005-09-24 2009-06-25 Applied Materials Gmbh & Co. Kg Träger für ein Substrat
DE102006046968A1 (de) * 2006-10-04 2008-04-10 Singulus Technologies Ag Oberflächenbehandlungssystem und darin verwendbare Lackiervorrichtung
DE102016214445A1 (de) 2016-08-04 2018-02-08 Meyer Burger (Germany) Ag Anpassungsvorrichtung für Substratträger
CN111430279B (zh) * 2020-04-30 2023-09-01 瑞安市荣海机电有限公司 一种准分子激光退火设备用基板支撑装置
DE102021002293B4 (de) 2021-04-30 2025-04-30 Singulus Technologies Aktiengesellschaft Substratträger mit Zentrierfunktion, Wechselstation mit einem Substratträger und Verfahren zum Behandeln eines Substrats
CN121451122B (zh) * 2026-01-05 2026-04-07 中国人民解放军国防科技大学 一种矫正陶瓷片翘曲的镀膜工装及电极制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7707767U1 (de) * 1977-03-14 1977-09-08 Balzers Hochvakuum Gmbh, 6200 Wiesbaden Halterung fuer substratplaettchen
DE2723284A1 (de) * 1977-05-24 1978-12-07 Leybold Heraeus Gmbh & Co Kg Transporteinrichtung fuer die bewegung von gegenstaenden in abgeschlossenen raeumen
JPH01103983A (ja) * 1988-09-19 1989-04-21 Hitachi Ltd 分子線エピタキシ装置用サセプタ
JP2747715B2 (ja) * 1989-01-24 1998-05-06 株式会社日平トヤマ 把握装置
DE3919611A1 (de) * 1989-06-15 1990-12-20 Wacker Chemitronic Haltevorrichtung zur aufnahme von scheibenfoermigen gegenstaenden, insbesondere halbleiterscheiben, und verfahren zu deren behandlung
DE69021952T2 (de) * 1989-06-29 1996-05-15 Applied Materials Inc Vorrichtung zur Handhabung von Halbleiterplättchen.
DE4446179C2 (de) * 1994-12-23 2003-08-21 Leybold Optics Gmbh Halterung für scheibenförmige Substrate
DE19605598C1 (de) * 1996-02-15 1996-10-31 Singulus Technologies Gmbh Vorrichtung zum Greifen und Halten von Substraten
JPH11176916A (ja) * 1997-12-11 1999-07-02 Toshiba Mach Co Ltd ウェーハ支持体
JP2002307343A (ja) * 2001-04-12 2002-10-23 Matsushita Electric Ind Co Ltd 薄板材の移載方法および装置
JP2003124167A (ja) * 2001-10-10 2003-04-25 Sumitomo Heavy Ind Ltd ウエハ支持部材及びこれを用いる両頭研削装置

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