DE10355679B4 - Substratträger, Vorrichtung und Verfahren zum Handhaben des Substratträgers und Verwendung in Beschichtungsprozessen - Google Patents

Substratträger, Vorrichtung und Verfahren zum Handhaben des Substratträgers und Verwendung in Beschichtungsprozessen Download PDF

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Publication number
DE10355679B4
DE10355679B4 DE10355679A DE10355679A DE10355679B4 DE 10355679 B4 DE10355679 B4 DE 10355679B4 DE 10355679 A DE10355679 A DE 10355679A DE 10355679 A DE10355679 A DE 10355679A DE 10355679 B4 DE10355679 B4 DE 10355679B4
Authority
DE
Germany
Prior art keywords
substrate carrier
substrate
gripping
wall
median plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10355679A
Other languages
German (de)
English (en)
Other versions
DE10355679A1 (de
Inventor
Stefan Kempf
Thomas Merz
Steffen Dr. Runkel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Singulus Technologies AG
Original Assignee
Singulus Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE10355679A priority Critical patent/DE10355679B4/de
Application filed by Singulus Technologies AG filed Critical Singulus Technologies AG
Priority to DE502004007214T priority patent/DE502004007214D1/de
Priority to ES04027863T priority patent/ES2305651T3/es
Priority to AT04027863T priority patent/ATE396288T1/de
Priority to EP04027863A priority patent/EP1538236B1/de
Priority to US10/998,206 priority patent/US20050142290A1/en
Priority to JP2004344301A priority patent/JP2005200214A/ja
Publication of DE10355679A1 publication Critical patent/DE10355679A1/de
Application granted granted Critical
Publication of DE10355679B4 publication Critical patent/DE10355679B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Recrystallisation Techniques (AREA)
  • Wire Bonding (AREA)
DE10355679A 2003-11-28 2003-11-28 Substratträger, Vorrichtung und Verfahren zum Handhaben des Substratträgers und Verwendung in Beschichtungsprozessen Expired - Fee Related DE10355679B4 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE10355679A DE10355679B4 (de) 2003-11-28 2003-11-28 Substratträger, Vorrichtung und Verfahren zum Handhaben des Substratträgers und Verwendung in Beschichtungsprozessen
ES04027863T ES2305651T3 (es) 2003-11-28 2004-11-24 Soporte de sustrato.
AT04027863T ATE396288T1 (de) 2003-11-28 2004-11-24 Substratträger
EP04027863A EP1538236B1 (de) 2003-11-28 2004-11-24 Substratträger
DE502004007214T DE502004007214D1 (de) 2003-11-28 2004-11-24 Substratträger
US10/998,206 US20050142290A1 (en) 2003-11-28 2004-11-26 Substrate support adapter system
JP2004344301A JP2005200214A (ja) 2003-11-28 2004-11-29 基板支持体アダプタシステム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10355679A DE10355679B4 (de) 2003-11-28 2003-11-28 Substratträger, Vorrichtung und Verfahren zum Handhaben des Substratträgers und Verwendung in Beschichtungsprozessen

Publications (2)

Publication Number Publication Date
DE10355679A1 DE10355679A1 (de) 2005-06-30
DE10355679B4 true DE10355679B4 (de) 2008-08-14

Family

ID=34442326

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10355679A Expired - Fee Related DE10355679B4 (de) 2003-11-28 2003-11-28 Substratträger, Vorrichtung und Verfahren zum Handhaben des Substratträgers und Verwendung in Beschichtungsprozessen
DE502004007214T Expired - Lifetime DE502004007214D1 (de) 2003-11-28 2004-11-24 Substratträger

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE502004007214T Expired - Lifetime DE502004007214D1 (de) 2003-11-28 2004-11-24 Substratträger

Country Status (6)

Country Link
US (1) US20050142290A1 (https=)
EP (1) EP1538236B1 (https=)
JP (1) JP2005200214A (https=)
AT (1) ATE396288T1 (https=)
DE (2) DE10355679B4 (https=)
ES (1) ES2305651T3 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005045718B4 (de) * 2005-09-24 2009-06-25 Applied Materials Gmbh & Co. Kg Träger für ein Substrat
DE102006046968A1 (de) * 2006-10-04 2008-04-10 Singulus Technologies Ag Oberflächenbehandlungssystem und darin verwendbare Lackiervorrichtung
DE102016214445A1 (de) 2016-08-04 2018-02-08 Meyer Burger (Germany) Ag Anpassungsvorrichtung für Substratträger
CN111430279B (zh) * 2020-04-30 2023-09-01 瑞安市荣海机电有限公司 一种准分子激光退火设备用基板支撑装置
DE102021002293B4 (de) 2021-04-30 2025-04-30 Singulus Technologies Aktiengesellschaft Substratträger mit Zentrierfunktion, Wechselstation mit einem Substratträger und Verfahren zum Behandeln eines Substrats
CN121451122B (zh) * 2026-01-05 2026-04-07 中国人民解放军国防科技大学 一种矫正陶瓷片翘曲的镀膜工装及电极制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19605598C1 (de) * 1996-02-15 1996-10-31 Singulus Technologies Gmbh Vorrichtung zum Greifen und Halten von Substraten

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7707767U1 (de) * 1977-03-14 1977-09-08 Balzers Hochvakuum Gmbh, 6200 Wiesbaden Halterung fuer substratplaettchen
DE2723284A1 (de) * 1977-05-24 1978-12-07 Leybold Heraeus Gmbh & Co Kg Transporteinrichtung fuer die bewegung von gegenstaenden in abgeschlossenen raeumen
JPH01103983A (ja) * 1988-09-19 1989-04-21 Hitachi Ltd 分子線エピタキシ装置用サセプタ
JP2747715B2 (ja) * 1989-01-24 1998-05-06 株式会社日平トヤマ 把握装置
DE3919611A1 (de) * 1989-06-15 1990-12-20 Wacker Chemitronic Haltevorrichtung zur aufnahme von scheibenfoermigen gegenstaenden, insbesondere halbleiterscheiben, und verfahren zu deren behandlung
DE69021952T2 (de) * 1989-06-29 1996-05-15 Applied Materials Inc Vorrichtung zur Handhabung von Halbleiterplättchen.
DE4446179C2 (de) * 1994-12-23 2003-08-21 Leybold Optics Gmbh Halterung für scheibenförmige Substrate
JPH11176916A (ja) * 1997-12-11 1999-07-02 Toshiba Mach Co Ltd ウェーハ支持体
JP2002307343A (ja) * 2001-04-12 2002-10-23 Matsushita Electric Ind Co Ltd 薄板材の移載方法および装置
JP2003124167A (ja) * 2001-10-10 2003-04-25 Sumitomo Heavy Ind Ltd ウエハ支持部材及びこれを用いる両頭研削装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19605598C1 (de) * 1996-02-15 1996-10-31 Singulus Technologies Gmbh Vorrichtung zum Greifen und Halten von Substraten

Also Published As

Publication number Publication date
US20050142290A1 (en) 2005-06-30
DE10355679A1 (de) 2005-06-30
EP1538236A2 (de) 2005-06-08
DE502004007214D1 (de) 2008-07-03
ATE396288T1 (de) 2008-06-15
EP1538236B1 (de) 2008-05-21
ES2305651T3 (es) 2008-11-01
JP2005200214A (ja) 2005-07-28
EP1538236A3 (de) 2005-08-10

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OP8 Request for examination as to paragraph 44 patent law
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee