JP2011014229A5 - - Google Patents

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Publication number
JP2011014229A5
JP2011014229A5 JP2010151009A JP2010151009A JP2011014229A5 JP 2011014229 A5 JP2011014229 A5 JP 2011014229A5 JP 2010151009 A JP2010151009 A JP 2010151009A JP 2010151009 A JP2010151009 A JP 2010151009A JP 2011014229 A5 JP2011014229 A5 JP 2011014229A5
Authority
JP
Japan
Prior art keywords
workpiece
carrier plate
annular
electrode
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010151009A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011014229A (ja
JP5758594B2 (ja
Filing date
Publication date
Priority claimed from US12/496,369 external-priority patent/US10026436B2/en
Application filed filed Critical
Publication of JP2011014229A publication Critical patent/JP2011014229A/ja
Publication of JP2011014229A5 publication Critical patent/JP2011014229A5/ja
Application granted granted Critical
Publication of JP5758594B2 publication Critical patent/JP5758594B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010151009A 2009-07-01 2010-07-01 プラズマ処理中にワークピースを支持する装置及び方法 Expired - Fee Related JP5758594B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/496,369 2009-07-01
US12/496,369 US10026436B2 (en) 2009-07-01 2009-07-01 Apparatus and methods for supporting workpieces during plasma processing

Publications (3)

Publication Number Publication Date
JP2011014229A JP2011014229A (ja) 2011-01-20
JP2011014229A5 true JP2011014229A5 (https=) 2013-06-27
JP5758594B2 JP5758594B2 (ja) 2015-08-05

Family

ID=43412054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010151009A Expired - Fee Related JP5758594B2 (ja) 2009-07-01 2010-07-01 プラズマ処理中にワークピースを支持する装置及び方法

Country Status (6)

Country Link
US (1) US10026436B2 (https=)
JP (1) JP5758594B2 (https=)
KR (2) KR20110002432A (https=)
CN (1) CN101944366B (https=)
SG (1) SG186675A1 (https=)
TW (1) TWI536447B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9685186B2 (en) * 2009-02-27 2017-06-20 Applied Materials, Inc. HDD pattern implant system
US8556566B1 (en) * 2011-09-30 2013-10-15 WD Media, LLC Disk stacking method and apparatus
KR101419515B1 (ko) * 2012-09-24 2014-07-15 피에스케이 주식회사 배플 및 배플의 표면처리장치, 그리고 기판 처리 장치 및 표면 처리 방법
CN105529283B (zh) * 2014-09-29 2020-06-30 盛美半导体设备(上海)股份有限公司 晶圆的双面气相刻蚀装置
JP7451490B2 (ja) * 2018-07-30 2024-03-18 ノードソン コーポレーション プラズマを用いたワーク処理用のシステム
WO2021235912A1 (ko) * 2020-05-22 2021-11-25 이창훈 대기압 플라즈마 발생 장치를 이용한 원통형 및 환형 피처리물의 표면처리 시스템 및 방법
KR102440727B1 (ko) * 2020-12-17 2022-09-05 현대자동차주식회사 소음 및 진동 측정 장치 및 이를 이용한 소음 및 진동 측정 방법
DE102021003326B3 (de) 2021-06-28 2022-09-08 Singulus Technologies Aktiengesellschaft Substratträger
DE102021003330B3 (de) 2021-06-28 2022-09-01 Singulus Technologies Aktiengesellschaft Substratträger

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JPS63287933A (ja) 1987-05-21 1988-11-25 Canon Inc 交換レンズのレンズキヤツプ
EP0529687B1 (en) * 1988-03-30 1996-05-29 Rohm Co., Ltd. Molecular beam epitaxy apparatus
JPH04173974A (ja) 1990-11-02 1992-06-22 Tdk Corp 反応性連続スパッタ方法、磁気ディスクの製造方法および基板搬送用トレー
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JP2009116927A (ja) 2007-11-02 2009-05-28 Hitachi High-Technologies Corp ディスク反転機構、ディスクの表面処理方法およびディスクの表面処理装置

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