JP2005175039A - 発光素子搭載用基板及び発光素子 - Google Patents

発光素子搭載用基板及び発光素子 Download PDF

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Publication number
JP2005175039A
JP2005175039A JP2003409959A JP2003409959A JP2005175039A JP 2005175039 A JP2005175039 A JP 2005175039A JP 2003409959 A JP2003409959 A JP 2003409959A JP 2003409959 A JP2003409959 A JP 2003409959A JP 2005175039 A JP2005175039 A JP 2005175039A
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Japan
Prior art keywords
light
emitting element
sintered body
substrate
light emitting
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Pending
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JP2003409959A
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English (en)
Japanese (ja)
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JP2005175039A5 (enrdf_load_stackoverflow
Inventor
Kenichiro Miyahara
健一郎 宮原
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Priority to JP2003409959A priority Critical patent/JP2005175039A/ja
Priority to KR1020057024140A priority patent/KR20060031629A/ko
Priority to PCT/JP2004/000033 priority patent/WO2005004246A1/ja
Publication of JP2005175039A publication Critical patent/JP2005175039A/ja
Publication of JP2005175039A5 publication Critical patent/JP2005175039A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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JP2003409959A 2003-06-30 2003-12-09 発光素子搭載用基板及び発光素子 Pending JP2005175039A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003409959A JP2005175039A (ja) 2003-12-09 2003-12-09 発光素子搭載用基板及び発光素子
KR1020057024140A KR20060031629A (ko) 2003-06-30 2004-01-07 발광소자 탑재용 기판 및 발광소자
PCT/JP2004/000033 WO2005004246A1 (ja) 2003-06-30 2004-01-07 発光素子搭載用基板及び発光素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003409959A JP2005175039A (ja) 2003-12-09 2003-12-09 発光素子搭載用基板及び発光素子

Publications (2)

Publication Number Publication Date
JP2005175039A true JP2005175039A (ja) 2005-06-30
JP2005175039A5 JP2005175039A5 (enrdf_load_stackoverflow) 2007-02-01

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JP2003409959A Pending JP2005175039A (ja) 2003-06-30 2003-12-09 発光素子搭載用基板及び発光素子

Country Status (1)

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JP (1) JP2005175039A (enrdf_load_stackoverflow)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007088909A1 (ja) * 2006-01-31 2007-08-09 Kyocera Corporation 発光装置および発光モジュール
JP2007207895A (ja) * 2006-01-31 2007-08-16 Kyocera Corp 発光装置および発光モジュール
JP2007273754A (ja) * 2006-03-31 2007-10-18 Kyocera Corp 発光装置および発光モジュール
JP2007273753A (ja) * 2006-03-31 2007-10-18 Kyocera Corp 発光装置および発光モジュール
JP2010518569A (ja) * 2007-02-07 2010-05-27 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 合成モノリシックセラミック発光変換体を含む照明システム
JP2011090325A (ja) * 2010-12-15 2011-05-06 Kyocera Corp 光反射体、発光素子搭載用配線基板、および発光装置
JP5147997B2 (ja) * 2010-11-04 2013-02-20 パナソニック株式会社 発光装置、電球形ランプ及び照明装置
JP2015057826A (ja) * 2013-09-16 2015-03-26 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
JP2017152530A (ja) * 2016-02-24 2017-08-31 京セラ株式会社 撮像素子用パッケージ、撮像装置および撮像モジュール
KR101935117B1 (ko) * 2009-02-20 2019-01-03 다이니폰 인사츠 가부시키가이샤 도전성 기판
CN114988697A (zh) * 2022-06-14 2022-09-02 成都光明光电股份有限公司 闪烁玻璃、闪烁玻璃面板及其制造方法
JP2022165826A (ja) * 2021-04-20 2022-11-01 日亜化学工業株式会社 発光装置

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60193254A (ja) * 1984-03-15 1985-10-01 Tokuyama Soda Co Ltd 発光管
JPS60262476A (ja) * 1984-06-08 1985-12-25 Matsushita Electric Ind Co Ltd 発光素子
JPH01249663A (ja) * 1988-03-31 1989-10-04 Toshiba Corp 透光性酸窒化アルミニウム焼結体の製造方法
JPH02137765A (ja) * 1988-11-17 1990-05-28 Tech Res & Dev Inst Of Japan Def Agency 透明な酸窒化アルミニウム複合焼結体の製造方法
JPH054529U (ja) * 1991-06-27 1993-01-22 ローム株式会社 チツプ型発光ダイオードの構造
JPH05335627A (ja) * 1992-05-27 1993-12-17 Kyocera Corp 発光素子収納用パッケージ
JPH0945965A (ja) * 1995-07-26 1997-02-14 Nichia Chem Ind Ltd セラミックスｌｅｄパッケージおよびその製造方法
JPH1192229A (ja) * 1987-05-08 1999-04-06 Toshiba Corp 高熱伝導性窒化アルミニウム焼結体の製造方法
JP2002289925A (ja) * 2001-03-23 2002-10-04 Citizen Electronics Co Ltd 発光ダイオード
JP2002353515A (ja) * 2001-05-24 2002-12-06 Samsung Electro Mech Co Ltd 発光ダイオード及びこれを用いた発光装置とその製造方法
JP2003282950A (ja) * 2002-03-22 2003-10-03 Sanyu Rec Co Ltd ２側面発光型ｌｅｄの製造方法
JP2003282948A (ja) * 2002-03-20 2003-10-03 Sharp Corp 発光装置およびその製造方法
WO2003096387A2 (en) * 2002-05-08 2003-11-20 Phoseon Technology, Inc. High efficiency solid-state light source and methods of use and manufacture
JP2003347600A (ja) * 2002-05-28 2003-12-05 Matsushita Electric Works Ltd Ｌｅｄ実装基板

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60193254A (ja) * 1984-03-15 1985-10-01 Tokuyama Soda Co Ltd 発光管
JPS60262476A (ja) * 1984-06-08 1985-12-25 Matsushita Electric Ind Co Ltd 発光素子
JPH1192229A (ja) * 1987-05-08 1999-04-06 Toshiba Corp 高熱伝導性窒化アルミニウム焼結体の製造方法
JPH01249663A (ja) * 1988-03-31 1989-10-04 Toshiba Corp 透光性酸窒化アルミニウム焼結体の製造方法
JPH02137765A (ja) * 1988-11-17 1990-05-28 Tech Res & Dev Inst Of Japan Def Agency 透明な酸窒化アルミニウム複合焼結体の製造方法
JPH054529U (ja) * 1991-06-27 1993-01-22 ローム株式会社 チツプ型発光ダイオードの構造
JPH05335627A (ja) * 1992-05-27 1993-12-17 Kyocera Corp 発光素子収納用パッケージ
JPH0945965A (ja) * 1995-07-26 1997-02-14 Nichia Chem Ind Ltd セラミックスｌｅｄパッケージおよびその製造方法
JP2002289925A (ja) * 2001-03-23 2002-10-04 Citizen Electronics Co Ltd 発光ダイオード
JP2002353515A (ja) * 2001-05-24 2002-12-06 Samsung Electro Mech Co Ltd 発光ダイオード及びこれを用いた発光装置とその製造方法
JP2003282948A (ja) * 2002-03-20 2003-10-03 Sharp Corp 発光装置およびその製造方法
JP2003282950A (ja) * 2002-03-22 2003-10-03 Sanyu Rec Co Ltd ２側面発光型ｌｅｄの製造方法
WO2003096387A2 (en) * 2002-05-08 2003-11-20 Phoseon Technology, Inc. High efficiency solid-state light source and methods of use and manufacture
JP2003347600A (ja) * 2002-05-28 2003-12-05 Matsushita Electric Works Ltd Ｌｅｄ実装基板

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007207895A (ja) * 2006-01-31 2007-08-16 Kyocera Corp 発光装置および発光モジュール
WO2007088909A1 (ja) * 2006-01-31 2007-08-09 Kyocera Corporation 発光装置および発光モジュール
US7943953B2 (en) 2006-01-31 2011-05-17 Kyocera Corporation Light emitting device and light emitting module
CN101501871B (zh) * 2006-01-31 2012-04-18 京瓷株式会社 发光装置以及发光组件
JP2007273754A (ja) * 2006-03-31 2007-10-18 Kyocera Corp 発光装置および発光モジュール
JP2007273753A (ja) * 2006-03-31 2007-10-18 Kyocera Corp 発光装置および発光モジュール
US10023796B2 (en) 2007-02-07 2018-07-17 Lumileds Llc Illumination system comprising composite monolithic ceramic luminescence converter
JP2010518569A (ja) * 2007-02-07 2010-05-27 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 合成モノリシックセラミック発光変換体を含む照明システム
KR101935117B1 (ko) * 2009-02-20 2019-01-03 다이니폰 인사츠 가부시키가이샤 도전성 기판
JP5147997B2 (ja) * 2010-11-04 2013-02-20 パナソニック株式会社 発光装置、電球形ランプ及び照明装置
JP2011090325A (ja) * 2010-12-15 2011-05-06 Kyocera Corp 光反射体、発光素子搭載用配線基板、および発光装置
JP2015057826A (ja) * 2013-09-16 2015-03-26 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
JP2017152530A (ja) * 2016-02-24 2017-08-31 京セラ株式会社 撮像素子用パッケージ、撮像装置および撮像モジュール
JP2022165826A (ja) * 2021-04-20 2022-11-01 日亜化学工業株式会社 発光装置
JP7387978B2 (ja) 2021-04-20 2023-11-29 日亜化学工業株式会社 発光装置
CN114988697A (zh) * 2022-06-14 2022-09-02 成都光明光电股份有限公司 闪烁玻璃、闪烁玻璃面板及其制造方法
CN114988697B (zh) * 2022-06-14 2023-09-05 成都光明光电股份有限公司 闪烁玻璃、闪烁玻璃面板及其制造方法

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