JP2005174974A - 積層圧電体部品の製造方法 - Google Patents
積層圧電体部品の製造方法 Download PDFInfo
- Publication number
- JP2005174974A JP2005174974A JP2003408610A JP2003408610A JP2005174974A JP 2005174974 A JP2005174974 A JP 2005174974A JP 2003408610 A JP2003408610 A JP 2003408610A JP 2003408610 A JP2003408610 A JP 2003408610A JP 2005174974 A JP2005174974 A JP 2005174974A
- Authority
- JP
- Japan
- Prior art keywords
- internal electrode
- laminated
- piezoelectric
- ceramic composition
- piezoelectric ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 44
- 239000000203 mixture Substances 0.000 claims abstract description 40
- 239000002003 electrode paste Substances 0.000 claims abstract description 27
- 230000000930 thermomechanical effect Effects 0.000 claims abstract description 13
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910000464 lead oxide Inorganic materials 0.000 claims abstract description 9
- 238000010030 laminating Methods 0.000 claims abstract description 6
- 238000010304 firing Methods 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 19
- 230000008018 melting Effects 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 description 26
- 239000000843 powder Substances 0.000 description 23
- 230000000694 effects Effects 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011268 mixed slurry Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000007573 shrinkage measurement Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Compositions Of Oxide Ceramics (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
【解決手段】鉛酸化物を主成分の一つとする圧電磁器組成物のグリーンシートと、Agを主成分とする内部電極ペーストとを、交互に積層して得られる積層圧電体部品において、前記内部電極ペーストに、圧電磁器組成物および高融点酸化物を添加することによって、積層構造の形成部分と非形成部分との焼成収縮差を8%以下にし、変形やクラックの生じることのない積層圧電体部品を提供する。
【選択図】図2
Description
実施の形態を用いて、本発明の請求項1〜4に記載の発明について図面を参照しながら説明する。
2a 第1の入力用内部電極層
2b 第2の入力用内部電極層
2c 出力用内部電極層
3 積層構造の形成部分
4 積層構造の非形成部分
5a 第1の入力用外部電極
5b 第2の入力用外部電極
5c 出力用外部電極
6 素子の変形量
Claims (4)
- 鉛酸化物を主成分の一つとする圧電磁器組成物のグリーンシートと、Agを主成分とする内部電極ペーストとを、交互に積層、印刷して得られる積層圧電体部品において、前記内部電極ペーストに、圧電磁器組成物および高融点酸化物を添加することによって、熱機械分析装置により測定した所定の温度における積層構造の形成部分と非形成部分の焼成収縮差を8%以下とすることを特徴とする積層圧電体部品の製造方法。
- 高融点酸化物として、ZrO2,Nb2O5のうち少なくとも1種類を添加した内部電極ペーストを用いることを特徴とする請求項1に記載の積層圧電体部品の製造方法。
- 内部電極ペースト中に含有される導電性金属100に対し、圧電磁器組成物を30〜70の割合の重量を添加し、かつZrO2,Nb2O5のうち少なくとも1種類を添加したことを特徴とする請求項2に記載の積層圧電体部品の製造方法。
- ZrO2,Nb2O5の添加量は、導電性金属100に対して、5〜20の割合の重量であることを特徴とする請求項3に記載の積層圧電体部品の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003408610A JP2005174974A (ja) | 2003-12-08 | 2003-12-08 | 積層圧電体部品の製造方法 |
US10/998,034 US20050120528A1 (en) | 2003-12-08 | 2004-11-29 | Method of manufacturing piezoelectric ceramic device |
CNA2004100969897A CN1627545A (zh) | 2003-12-08 | 2004-12-07 | 压电陶瓷器件的制造方法 |
TW93137756A TW200525792A (en) | 2003-12-08 | 2004-12-07 | Method of manufacturing piezoelectric ceramic device |
KR1020040102105A KR20050055596A (ko) | 2003-12-08 | 2004-12-07 | 압전 자기 디바이스의 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003408610A JP2005174974A (ja) | 2003-12-08 | 2003-12-08 | 積層圧電体部品の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005174974A true JP2005174974A (ja) | 2005-06-30 |
Family
ID=34631786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003408610A Pending JP2005174974A (ja) | 2003-12-08 | 2003-12-08 | 積層圧電体部品の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050120528A1 (ja) |
JP (1) | JP2005174974A (ja) |
KR (1) | KR20050055596A (ja) |
CN (1) | CN1627545A (ja) |
TW (1) | TW200525792A (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007258370A (ja) * | 2006-03-22 | 2007-10-04 | Tdk Corp | 積層型圧電素子の製造方法 |
JP2009522793A (ja) * | 2006-01-02 | 2009-06-11 | セラムテック アクチエンゲゼルシャフト | 一体型曲げ部材 |
WO2009082006A1 (ja) | 2007-12-26 | 2009-07-02 | Kyocera Corporation | 積層型圧電素子、これを用いた噴射装置及び燃料噴射システム |
WO2010013670A1 (ja) | 2008-07-29 | 2010-02-04 | 京セラ株式会社 | 積層型圧電素子およびこれを用いた噴射装置ならびに燃料噴射システム |
WO2010024199A1 (ja) | 2008-08-26 | 2010-03-04 | 京セラ株式会社 | 積層型圧電素子およびこれを用いた噴射装置ならびに燃料噴射システム |
WO2012114874A1 (ja) * | 2011-02-24 | 2012-08-30 | 株式会社村田製作所 | 電子部品の実装構造 |
US8339017B2 (en) | 2005-08-29 | 2012-12-25 | Kyocera Corporation | Multi-layer piezoelectric element and injection apparatus using the same |
US8378554B2 (en) | 2005-10-28 | 2013-02-19 | Kyocera Corporation | Multi-layer piezoelectric element and injection apparatus using the same |
US8714141B2 (en) | 2009-03-04 | 2014-05-06 | Kyocera Corporation | Multi-layer piezoelectric element, and injection device and fuel injection system comprising the same |
US9455079B2 (en) | 2012-09-21 | 2016-09-27 | Samsung Electro-Mechanics Co., Ltd. | Multilayered power inductor and method for preparing the same |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100365889C (zh) * | 2006-05-18 | 2008-01-30 | 中微光电子(潍坊)有限公司 | 一种防止垂直腔面发射半导体激光器在湿法氧化时开裂的方法 |
JP4888853B2 (ja) | 2009-11-12 | 2012-02-29 | 学校法人慶應義塾 | 液晶表示装置の視認性改善方法、及びそれを用いた液晶表示装置 |
CN101767994B (zh) * | 2010-01-18 | 2012-05-09 | 哈尔滨理工大学 | 一种改性锆钛酸铅压电陶瓷粉体的制备方法 |
EP2587304B1 (en) | 2010-06-22 | 2019-12-18 | Toyobo Co., Ltd. | Liquid crystal display device, polarizer and protective film |
DE102011001359A1 (de) | 2011-03-17 | 2012-09-20 | Gottfried Wilhelm Leibniz Universität Hannover | Verfahren und Vorrichtung zur Herstellung einer Piezoaktorenkomponente |
JPWO2014185322A1 (ja) * | 2013-05-14 | 2017-02-23 | 東洋紡株式会社 | 液晶表示装置、偏光板及び偏光子保護フィルム |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04324610A (ja) * | 1991-04-24 | 1992-11-13 | Taiyo Yuden Co Ltd | 希土類入り銀導電ペーストおよびこれを用いた電子部品 |
JPH0878267A (ja) * | 1994-09-08 | 1996-03-22 | Murata Mfg Co Ltd | 内部電極ペーストおよびそれを用いた積層セラミックコンデンサ |
JPH11232927A (ja) * | 1998-02-13 | 1999-08-27 | Murata Mfg Co Ltd | 導電ペースト |
JPH11302072A (ja) * | 1998-02-17 | 1999-11-02 | Murata Mfg Co Ltd | 誘電体セラミック、積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法 |
JP2002270916A (ja) * | 2001-03-13 | 2002-09-20 | Taiheiyo Cement Corp | 圧電トランス |
JP2003174206A (ja) * | 2001-12-04 | 2003-06-20 | Denso Corp | 積層型圧電体素子 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4426356A (en) * | 1982-09-30 | 1984-01-17 | E. I. Du Pont De Nemours And Company | Method for making capacitors with noble metal electrodes |
JPH0461293A (ja) * | 1990-06-29 | 1992-02-27 | Toshiba Corp | 回路基板及びその製造方法 |
TW340957B (en) * | 1996-02-01 | 1998-09-21 | Canon Hanbai Kk | Plasma processor and gas release device |
US6798959B2 (en) * | 2001-09-03 | 2004-09-28 | Ngk Insulators, Ltd. | Display device and method for producing the same |
US6749706B2 (en) * | 2001-12-26 | 2004-06-15 | Murata Manufacturing Co., Ltd. | Method of manufacturing monolithic piezoelectric ceramic device |
JP3982267B2 (ja) * | 2002-01-16 | 2007-09-26 | 株式会社村田製作所 | 積層型圧電セラミック素子の製造方法 |
US7067965B2 (en) * | 2002-09-18 | 2006-06-27 | Tdk Corporation | Piezoelectric porcelain composition, piezoelectric device, and methods of making thereof |
JP4438321B2 (ja) * | 2003-06-02 | 2010-03-24 | 株式会社デンソー | 積層型圧電体素子の製造方法 |
-
2003
- 2003-12-08 JP JP2003408610A patent/JP2005174974A/ja active Pending
-
2004
- 2004-11-29 US US10/998,034 patent/US20050120528A1/en not_active Abandoned
- 2004-12-07 TW TW93137756A patent/TW200525792A/zh unknown
- 2004-12-07 CN CNA2004100969897A patent/CN1627545A/zh active Pending
- 2004-12-07 KR KR1020040102105A patent/KR20050055596A/ko not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04324610A (ja) * | 1991-04-24 | 1992-11-13 | Taiyo Yuden Co Ltd | 希土類入り銀導電ペーストおよびこれを用いた電子部品 |
JPH0878267A (ja) * | 1994-09-08 | 1996-03-22 | Murata Mfg Co Ltd | 内部電極ペーストおよびそれを用いた積層セラミックコンデンサ |
JPH11232927A (ja) * | 1998-02-13 | 1999-08-27 | Murata Mfg Co Ltd | 導電ペースト |
JPH11302072A (ja) * | 1998-02-17 | 1999-11-02 | Murata Mfg Co Ltd | 誘電体セラミック、積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法 |
JP2002270916A (ja) * | 2001-03-13 | 2002-09-20 | Taiheiyo Cement Corp | 圧電トランス |
JP2003174206A (ja) * | 2001-12-04 | 2003-06-20 | Denso Corp | 積層型圧電体素子 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8339017B2 (en) | 2005-08-29 | 2012-12-25 | Kyocera Corporation | Multi-layer piezoelectric element and injection apparatus using the same |
EP2587563A2 (en) | 2005-10-28 | 2013-05-01 | Kyocera Corporation | Multi-layer piezoelectric element and injection apparatus using the same |
US8378554B2 (en) | 2005-10-28 | 2013-02-19 | Kyocera Corporation | Multi-layer piezoelectric element and injection apparatus using the same |
JP2009522793A (ja) * | 2006-01-02 | 2009-06-11 | セラムテック アクチエンゲゼルシャフト | 一体型曲げ部材 |
JP2007258370A (ja) * | 2006-03-22 | 2007-10-04 | Tdk Corp | 積層型圧電素子の製造方法 |
US8276567B2 (en) | 2007-12-26 | 2012-10-02 | Kyocera Corporation | Multi-layer piezoelectric element, and injection apparatus and fuel injection system that employ the same |
WO2009082006A1 (ja) | 2007-12-26 | 2009-07-02 | Kyocera Corporation | 積層型圧電素子、これを用いた噴射装置及び燃料噴射システム |
WO2010013670A1 (ja) | 2008-07-29 | 2010-02-04 | 京セラ株式会社 | 積層型圧電素子およびこれを用いた噴射装置ならびに燃料噴射システム |
US8578911B2 (en) | 2008-07-29 | 2013-11-12 | Kyocera Corporation | Multi-layer piezoelectric element, and injection device and fuel injection system using the same |
WO2010024199A1 (ja) | 2008-08-26 | 2010-03-04 | 京セラ株式会社 | 積層型圧電素子およびこれを用いた噴射装置ならびに燃料噴射システム |
US8714141B2 (en) | 2009-03-04 | 2014-05-06 | Kyocera Corporation | Multi-layer piezoelectric element, and injection device and fuel injection system comprising the same |
WO2012114874A1 (ja) * | 2011-02-24 | 2012-08-30 | 株式会社村田製作所 | 電子部品の実装構造 |
JP5668837B2 (ja) * | 2011-02-24 | 2015-02-12 | 株式会社村田製作所 | 電子部品の実装構造 |
US9153762B2 (en) | 2011-02-24 | 2015-10-06 | Murata Manufacturing Co., Ltd. | Electronic component package structure |
US9455079B2 (en) | 2012-09-21 | 2016-09-27 | Samsung Electro-Mechanics Co., Ltd. | Multilayered power inductor and method for preparing the same |
Also Published As
Publication number | Publication date |
---|---|
US20050120528A1 (en) | 2005-06-09 |
TW200525792A (en) | 2005-08-01 |
CN1627545A (zh) | 2005-06-15 |
KR20050055596A (ko) | 2005-06-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7227690B2 (ja) | 積層セラミックコンデンサおよびその製造方法 | |
JP2005174974A (ja) | 積層圧電体部品の製造方法 | |
JPWO2006100807A1 (ja) | 圧電素子、及び圧電素子の製造方法 | |
JP3958668B2 (ja) | 圧電磁器組成物、圧電素子および圧電素子の製造方法 | |
JP6624473B2 (ja) | 積層セラミックコンデンサ | |
JP2018032788A (ja) | 積層セラミックコンデンサおよびその製造方法 | |
JPWO2017094882A1 (ja) | 誘電体磁器組成物、積層セラミックコンデンサ、及び積層セラミックコンデンサの製造方法 | |
JP5192737B2 (ja) | 非鉛系圧電セラミックス用焼結助剤、非鉛系圧電セラミックスおよび非鉛系圧電セラミックスの製造方法 | |
JP5527404B2 (ja) | 積層セラミック電子部品 | |
JP4066432B2 (ja) | 積層型圧電セラミックス素子の製造方法 | |
JP5641139B2 (ja) | 積層セラミック電子部品、および積層セラミック電子部品の製造方法 | |
JP4992192B2 (ja) | 圧電磁器の製造方法及び圧電素子 | |
JP5527405B2 (ja) | 積層セラミック電子部品 | |
JP2003209304A (ja) | 積層型圧電セラミック素子の製造方法 | |
KR20210045925A (ko) | 세라믹 전자 부품 및 그 제조 방법 | |
JP5527403B2 (ja) | 積層セラミック電子部品 | |
JP5527400B2 (ja) | 積層セラミック電子部品 | |
JP5527401B2 (ja) | 積層セラミック電子部品 | |
JP4882778B2 (ja) | 積層セラミック電子部品の製造方法 | |
JP5303823B2 (ja) | 圧電素子 | |
JP2006036578A (ja) | 圧電材料の製造方法およびこれを用いた圧電材料 | |
JP2019067827A (ja) | 積層電子部品 | |
JP5000088B2 (ja) | 誘電体磁器組成物の製造方法と磁器コンデンサの製造方法 | |
JP2006096626A (ja) | 圧電磁器の製造方法、圧電素子の製造方法、圧電素子 | |
JP5429393B2 (ja) | 積層セラミック電子部品、および積層セラミック電子部品の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061003 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20061114 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20091120 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100723 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100803 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20101130 |