JP2005157324A5 - - Google Patents
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- Publication number
- JP2005157324A5 JP2005157324A5 JP2004312667A JP2004312667A JP2005157324A5 JP 2005157324 A5 JP2005157324 A5 JP 2005157324A5 JP 2004312667 A JP2004312667 A JP 2004312667A JP 2004312667 A JP2004312667 A JP 2004312667A JP 2005157324 A5 JP2005157324 A5 JP 2005157324A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- layer
- peeling
- optical film
- oxide layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 38
- 239000000758 substrate Substances 0.000 claims 26
- 239000012788 optical film Substances 0.000 claims 18
- 238000004519 manufacturing process Methods 0.000 claims 16
- 239000000853 adhesive Substances 0.000 claims 14
- 230000001070 adhesive effect Effects 0.000 claims 14
- 229910052751 metal Inorganic materials 0.000 claims 14
- 239000002184 metal Substances 0.000 claims 14
- 230000003287 optical effect Effects 0.000 claims 12
- 239000010408 film Substances 0.000 claims 8
- 229910044991 metal oxide Inorganic materials 0.000 claims 8
- 150000004706 metal oxides Chemical class 0.000 claims 8
- 238000000034 method Methods 0.000 claims 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 5
- 238000010030 laminating Methods 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 229910052779 Neodymium Inorganic materials 0.000 claims 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910001325 element alloy Inorganic materials 0.000 claims 1
- 238000004299 exfoliation Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910052741 iridium Inorganic materials 0.000 claims 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052762 osmium Inorganic materials 0.000 claims 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- 229910052703 rhodium Inorganic materials 0.000 claims 1
- 239000010948 rhodium Substances 0.000 claims 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 1
- 229910052707 ruthenium Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004312667A JP4939742B2 (ja) | 2003-10-28 | 2004-10-27 | 光学フィルムの作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003367326 | 2003-10-28 | ||
| JP2003367326 | 2003-10-28 | ||
| JP2004312667A JP4939742B2 (ja) | 2003-10-28 | 2004-10-27 | 光学フィルムの作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005157324A JP2005157324A (ja) | 2005-06-16 |
| JP2005157324A5 true JP2005157324A5 (enExample) | 2007-12-13 |
| JP4939742B2 JP4939742B2 (ja) | 2012-05-30 |
Family
ID=34741073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004312667A Expired - Fee Related JP4939742B2 (ja) | 2003-10-28 | 2004-10-27 | 光学フィルムの作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4939742B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005331796A (ja) * | 2004-05-21 | 2005-12-02 | Toppan Printing Co Ltd | カラーフィルタ及びカラーディスプレイ装置 |
| JP2007298602A (ja) * | 2006-04-28 | 2007-11-15 | Toppan Printing Co Ltd | 構造体、透過型液晶表示装置、半導体回路の製造方法および透過型液晶表示装置の製造方法 |
| JP5312728B2 (ja) * | 2006-04-28 | 2013-10-09 | 凸版印刷株式会社 | 表示装置およびその製造方法 |
| US7759629B2 (en) * | 2007-03-20 | 2010-07-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
| KR102383642B1 (ko) * | 2008-07-10 | 2022-04-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광장치 및 전자기기 |
| TW201511112A (zh) * | 2013-07-16 | 2015-03-16 | Sony Corp | 基板之製造方法及電子器件之製造方法 |
| JP2015195140A (ja) * | 2014-03-31 | 2015-11-05 | 株式会社東芝 | フレキシブル有機ｅｌ表示装置の製造方法 |
| CN111727664A (zh) | 2018-02-27 | 2020-09-29 | 堺显示器制品株式会社 | 柔性oled装置的制造方法以及支承基板 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3809712B2 (ja) * | 1996-08-27 | 2006-08-16 | セイコーエプソン株式会社 | 薄膜デバイスの転写方法 |
| JPH10150007A (ja) * | 1996-11-18 | 1998-06-02 | Toyo Chem Co Ltd | 半導体ウエハ固定用シート |
| JPH11243209A (ja) * | 1998-02-25 | 1999-09-07 | Seiko Epson Corp | 薄膜デバイスの転写方法、薄膜デバイス、薄膜集積回路装置、アクティブマトリクス基板、液晶表示装置および電子機器 |
| JP3974749B2 (ja) * | 2000-12-15 | 2007-09-12 | シャープ株式会社 | 機能素子の転写方法 |
| JP4027740B2 (ja) * | 2001-07-16 | 2007-12-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6888305B2 (en) * | 2001-11-06 | 2005-05-03 | Universal Display Corporation | Encapsulation structure that acts as a multilayer mirror |
-
2004
- 2004-10-27 JP JP2004312667A patent/JP4939742B2/ja not_active Expired - Fee Related
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