JP2005139516A5 - - Google Patents

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Publication number
JP2005139516A5
JP2005139516A5 JP2003377719A JP2003377719A JP2005139516A5 JP 2005139516 A5 JP2005139516 A5 JP 2005139516A5 JP 2003377719 A JP2003377719 A JP 2003377719A JP 2003377719 A JP2003377719 A JP 2003377719A JP 2005139516 A5 JP2005139516 A5 JP 2005139516A5
Authority
JP
Japan
Prior art keywords
plating
substrate
film thickness
measuring device
load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003377719A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005139516A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003377719A priority Critical patent/JP2005139516A/ja
Priority claimed from JP2003377719A external-priority patent/JP2005139516A/ja
Priority to US10/980,320 priority patent/US20050126919A1/en
Publication of JP2005139516A publication Critical patent/JP2005139516A/ja
Publication of JP2005139516A5 publication Critical patent/JP2005139516A5/ja
Pending legal-status Critical Current

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JP2003377719A 2003-11-07 2003-11-07 めっき方法およびめっき装置 Pending JP2005139516A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003377719A JP2005139516A (ja) 2003-11-07 2003-11-07 めっき方法およびめっき装置
US10/980,320 US20050126919A1 (en) 2003-11-07 2004-11-04 Plating method, plating apparatus and a method of forming fine circuit wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003377719A JP2005139516A (ja) 2003-11-07 2003-11-07 めっき方法およびめっき装置

Publications (2)

Publication Number Publication Date
JP2005139516A JP2005139516A (ja) 2005-06-02
JP2005139516A5 true JP2005139516A5 (https=) 2007-01-11

Family

ID=34688323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003377719A Pending JP2005139516A (ja) 2003-11-07 2003-11-07 めっき方法およびめっき装置

Country Status (1)

Country Link
JP (1) JP2005139516A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
JP2007100113A (ja) * 2005-09-30 2007-04-19 Meiko:Kk 銅めっき方法とそれに用いる塩素イオン電解除去装置
JP4816901B2 (ja) * 2005-11-21 2011-11-16 上村工業株式会社 電気銅めっき浴
KR101417986B1 (ko) 2007-05-21 2014-07-09 우에무라 고교 가부시키가이샤 전기 구리 도금욕

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