JP2005139516A - めっき方法およびめっき装置 - Google Patents

めっき方法およびめっき装置 Download PDF

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Publication number
JP2005139516A
JP2005139516A JP2003377719A JP2003377719A JP2005139516A JP 2005139516 A JP2005139516 A JP 2005139516A JP 2003377719 A JP2003377719 A JP 2003377719A JP 2003377719 A JP2003377719 A JP 2003377719A JP 2005139516 A JP2005139516 A JP 2005139516A
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JP
Japan
Prior art keywords
plating
leveler
plating solution
dechlorination
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003377719A
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English (en)
Japanese (ja)
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JP2005139516A5 (https=
Inventor
Takeshi Sahoda
毅 佐保田
Tsutomu Nakada
勉 中田
Koji Mishima
浩二 三島
Ryoichi Kimizuka
亮一 君塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
JCU Corp
Original Assignee
Ebara Corp
Ebara Udylite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Ebara Udylite Co Ltd filed Critical Ebara Corp
Priority to JP2003377719A priority Critical patent/JP2005139516A/ja
Priority to US10/980,320 priority patent/US20050126919A1/en
Publication of JP2005139516A publication Critical patent/JP2005139516A/ja
Publication of JP2005139516A5 publication Critical patent/JP2005139516A5/ja
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2003377719A 2003-11-07 2003-11-07 めっき方法およびめっき装置 Pending JP2005139516A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003377719A JP2005139516A (ja) 2003-11-07 2003-11-07 めっき方法およびめっき装置
US10/980,320 US20050126919A1 (en) 2003-11-07 2004-11-04 Plating method, plating apparatus and a method of forming fine circuit wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003377719A JP2005139516A (ja) 2003-11-07 2003-11-07 めっき方法およびめっき装置

Publications (2)

Publication Number Publication Date
JP2005139516A true JP2005139516A (ja) 2005-06-02
JP2005139516A5 JP2005139516A5 (https=) 2007-01-11

Family

ID=34688323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003377719A Pending JP2005139516A (ja) 2003-11-07 2003-11-07 めっき方法およびめっき装置

Country Status (1)

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JP (1) JP2005139516A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007100113A (ja) * 2005-09-30 2007-04-19 Meiko:Kk 銅めっき方法とそれに用いる塩素イオン電解除去装置
JP2007138265A (ja) * 2005-11-21 2007-06-07 C Uyemura & Co Ltd 電気銅めっき浴
JP2007146285A (ja) * 2005-09-30 2007-06-14 Rohm & Haas Electronic Materials Llc レベラー化合物
US8679317B2 (en) 2007-05-21 2014-03-25 C. Uyemura & Co., Ltd. Copper electroplating bath

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007100113A (ja) * 2005-09-30 2007-04-19 Meiko:Kk 銅めっき方法とそれに用いる塩素イオン電解除去装置
JP2007146285A (ja) * 2005-09-30 2007-06-14 Rohm & Haas Electronic Materials Llc レベラー化合物
JP2007138265A (ja) * 2005-11-21 2007-06-07 C Uyemura & Co Ltd 電気銅めっき浴
US8679317B2 (en) 2007-05-21 2014-03-25 C. Uyemura & Co., Ltd. Copper electroplating bath

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