JP2005108891A - 入出力端子および半導体素子収納用パッケージならびに半導体装置 - Google Patents
入出力端子および半導体素子収納用パッケージならびに半導体装置 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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Abstract
【解決手段】入出力端子3は、上面に形成された2本の平行な線路導体3bから成る第一の差動線路Aおよび第一の接地導体3cが形成された平板部3aと、第一の差動線路Aおよび第一の接地導体3cの他辺側の端部を覆うように平板部3aの上面に接合された立壁部3dと、立壁部3dの上側主面に形成された2本の平行な線路導体3b’から成る第二の差動線路Bおよび第二の接地導体3c’と、立壁部3dに形成された、第一および第二の差動線路導体A、Bを電気的に接続する信号用貫通導体9と、立壁部3dに形成された、第一および第二の接地導体3c,3c’を電気的に接続する接地用貫通導体10とを具備している。
【選択図】図2
Description
平板部3aおよび立壁部3dは、AlNセラミックス、Al2O3セラミックス、ガラスセラミックス等の絶縁材料からなる。
1a:載置部
2:枠体
2a:取付部
2b:貫通孔
3a:平板部
3b,3b’:線路導体
3c:第一の接地導体
3c’:第二の接地導体
3d:立壁部
4:固定部材
5:透光性部材
6:蓋体
7:光半導体素子(半導体素子)
9:信号用貫通導体
10:接地用貫通導体
A:第一の差動線路
B:第二の差動線路
Claims (5)
- 上面に一辺側から対向する他辺側に向かって延びるように形成された2本の平行な線路導体から成る第一の差動線路および該第一の差動線路の両側に等間隔をもって形成された第一の同一面接地導体が形成された直方体状の平板部と、前記第一の差動線路および前記第一の同一面接地導体の前記他辺側の端部を覆うように前記平板部の前記上面の前記他辺側から中央部にかけて接合された立壁部と、該立壁部の上側主面に前記他辺側の一端部から対向する他端部に向かって延びるように形成された2本の平行な線路導体から成る第二の差動線路および該第二の差動線路の両側に等間隔をもって形成された第二の同一面接地導体と、前記立壁部に形成された、前記第一および第二の差動線路導体を電気的に接続する信号用貫通導体と、前記立壁部に形成された、前記第一および第二の同一面接地導体を電気的に接続する接地用貫通導体とを具備していることを特徴とする入出力端子。
- 前記第一の差動線路を成す2本の線路導体間の間隔および前記第二の差動線路を成す2本の線路導体間の間隔をそれぞれG、前記第一の差動線路と前記第一の同一面接地導体との間隔および前記第二の差動線路と前記第二の同一面接地導体との間隔をW、前記平板部の厚みをtとしたときに、0.01mm≦G≦3tかつt/3≦W≦3tであることを特徴とする請求項1記載の入出力端子。
- 前記接地用貫通導体は、前記第一および第二の差動線路の両側に前記第一および第二の差動線路と平行に一定の間隔で複数形成されていることを特徴とする請求項1または請求項2記載の入出力端子。
- 上面に半導体素子が載置される載置部を有する基体と、該基体の前記上面に前記載置部を囲繞するように取着されるとともに側部に貫通孔または切欠きから成る入出力端子の取付部が形成された枠体と、前記取付部に嵌着された請求項1乃至請求項3のいずれかに記載の入出力端子とを具備していることを特徴とする半導体素子収納用パッケージ。
- 請求項4記載の半導体素子収納用パッケージと、前記載置部に載置されるとともに電極が前記入出力端子に電気的に接続された半導体素子と、前記枠体の上面に取着された蓋体とを具備していることを特徴とする半導体装置。
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JP2003336279A JP4172783B2 (ja) | 2003-09-26 | 2003-09-26 | 入出力端子および半導体素子収納用パッケージならびに半導体装置 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009057691A1 (ja) * | 2007-10-30 | 2009-05-07 | Kyocera Corporation | 接続端子及びこれを用いたパッケージ並びに電子装置 |
WO2009096542A1 (ja) * | 2008-01-30 | 2009-08-06 | Kyocera Corporation | 接続端子及びこれを用いたパッケージ並びに電子装置 |
JP2012234879A (ja) * | 2011-04-28 | 2012-11-29 | Kyocera Corp | 素子収納用パッケージおよびこれを備えた半導体装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04336702A (ja) * | 1991-05-14 | 1992-11-24 | Mitsubishi Electric Corp | パッケージ |
JP2001185636A (ja) * | 1999-12-27 | 2001-07-06 | Kyocera Corp | 半導体素子収納用パッケージ |
JP2001230342A (ja) * | 2000-02-14 | 2001-08-24 | Kyocera Corp | 高周波回路部品搭載用基板の実装構造 |
JP2003100922A (ja) * | 2001-09-27 | 2003-04-04 | Kyocera Corp | 入出力端子および半導体素子収納用パッケージ |
-
2003
- 2003-09-26 JP JP2003336279A patent/JP4172783B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04336702A (ja) * | 1991-05-14 | 1992-11-24 | Mitsubishi Electric Corp | パッケージ |
JP2001185636A (ja) * | 1999-12-27 | 2001-07-06 | Kyocera Corp | 半導体素子収納用パッケージ |
JP2001230342A (ja) * | 2000-02-14 | 2001-08-24 | Kyocera Corp | 高周波回路部品搭載用基板の実装構造 |
JP2003100922A (ja) * | 2001-09-27 | 2003-04-04 | Kyocera Corp | 入出力端子および半導体素子収納用パッケージ |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009057691A1 (ja) * | 2007-10-30 | 2009-05-07 | Kyocera Corporation | 接続端子及びこれを用いたパッケージ並びに電子装置 |
EP2221867A1 (en) * | 2007-10-30 | 2010-08-25 | Kyocera Corporation | Connection terminal, package using the same, and electronic device |
US8344259B2 (en) | 2007-10-30 | 2013-01-01 | Kyocera Corporation | Connection terminal, package using the same, and electronic apparatus |
EP2221867A4 (en) * | 2007-10-30 | 2013-02-13 | Kyocera Corp | TERMINAL OF CONNECTION, HOUSING USING THE SAME, AND ELECTRONIC DEVICE |
JP5189597B2 (ja) * | 2007-10-30 | 2013-04-24 | 京セラ株式会社 | 接続端子及びこれを用いたパッケージ並びに電子装置 |
WO2009096542A1 (ja) * | 2008-01-30 | 2009-08-06 | Kyocera Corporation | 接続端子及びこれを用いたパッケージ並びに電子装置 |
JP5383512B2 (ja) * | 2008-01-30 | 2014-01-08 | 京セラ株式会社 | 接続端子及びこれを用いたパッケージ並びに電子装置 |
JP2012234879A (ja) * | 2011-04-28 | 2012-11-29 | Kyocera Corp | 素子収納用パッケージおよびこれを備えた半導体装置 |
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