JP2005101602A - 高耐圧電界効果トランジスタ及びこれの形成方法 - Google Patents
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
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Abstract
【解決手段】 有効チャンネル長(effective channel length)を増加させ、ゲートの角部分での電界の集中を避けるために、チャンネル領域に凹部を形成し、凹部上に保護酸化膜を形成し、保護酸化膜の下部に低濃度ソース/ドレイン領域を形成する。凹部上に形成された保護酸化膜は低濃度ソース/ドレイン領域を保護し、電界の集中を防止する。また、低濃度ソース/ドレイン領域にはトランジスタの外部から電源が直接接触されなく、高濃度ソース/ドレイン領域を通じて接続されるので有効チャンネル長を増加させる役割をする。
【選択図】 図2
Description
図1を参照すると、しきい電圧(threshold voltage)Vtが正の値を有し、ゲートとソースとの間の電圧Vgsがしきい電圧Vt以上であるとき、チャンネル領域に反転層が形成されてトランジスタは導通される。
図2は、本発明の第1実施例によって製造された電界効果トランジスタの断面図である。
図12乃至図20は、本発明の第2実施例によって電界効果トランジスタの製造方法を図示した断面図である。
102 パッド酸化膜
104 窒化物
106 絶縁物層
108 凹部
109 スクリーン酸化膜
110 酸化膜
112 n−/p−領域
114 保護酸化膜
116 誘電膜
118 導電層
120 n+/p+領域
Claims (15)
- アクティブ領域を定義するために素子分離用トレンチを埋め立てる絶縁物層を有して前記アクティブ領域上に形成された少なくとも一つの凹部を有する半導体基板と、
前記アクティブ領域中央の上部に形成されたゲートと、
前記ゲートと前記絶縁物層との間に形成され、前記凹部を埋め立てる保護酸化膜と、
前記凹部の表面部位に形成された低濃度ソース/ドレインと、
前記保護酸化膜と絶縁層との間の前記半導体基板表面の部位に形成された高濃度ソース/ドレインと、を含む高耐圧電界効果トランジスタ。 - 前記絶縁物層は、SiO2からなることを特徴とする請求項1記載の高耐圧電界効果トランジスタ。
- 前記ゲートは、チャンネル領域の上部に形成された誘電層及び前記誘電層上に形成された導電層を含むことを特徴とする請求項1記載の高耐圧電界効果トランジスタ。
- 前記チャンネル領域は、電荷運搬体(charge carrier)として、電子又は正孔を有することを特徴とする請求項3記載の高耐圧電界効果トランジスタ。
- 前記保護酸化膜は、一つのアクティブ領域に二つが形成されたことを特徴とする請求項1記載の高耐圧電界効果トランジスタ。
- 前記保護酸化膜は、SiO2からなることを特徴とする請求項1記載の高耐圧電界効果トランジスタ。
- 半導体基板にアクティブ領域を定義する段階と、
前記アクティブ領域に少なくとも一つの凹部を形成するために前記アクティブ領域を選択的にエッチングする段階と、
前記凹部を完全に埋め立てる酸化物層を形成するために酸化物を蒸着する段階と、
前記凹部の表面部位に低濃度ソース/ドレインを形成するために前記酸化物が形成された前記凹部に低濃度のイオンを注入する段階と、
前記凹部を埋め立てる前記酸化物以外の前記アクティブ領域上に形成された前記酸化物を除去して前記凹部上の保護酸化膜を形成する段階と、
前記保護酸化膜の間にゲートを形成する段階と、
前記保護酸化膜と前記絶縁物の間に高濃度のソース/ドレインを形成するために高濃度のイオンを注入する段階と、を含むことを特徴とする高耐圧電界効果トランジスタの形成方法。 - 前記アクティブ領域を定義する段階は、
前記半導体基板上にパッド酸化膜を成長させる段階と、
前記パッド酸化膜上に窒化膜を蒸着する段階と、
前記窒化膜を選択的にエッチングして前記パッド酸化膜を部分的に露出する段階と、
トレンチを形成するために前記露出されたパッド酸化膜及び下部基板をエッチングする段階と、
前記トレンチを完全に埋め立てるように前記トレンチ及び前記窒化膜に絶縁物を蒸着する段階と、
前記窒化膜上の絶縁膜を除去する段階と、
前記窒化膜及びパッド酸化膜を除去する段階と、を含むことを特徴とする請求項7記載の高耐圧電界効果トランジスタの形成方法。 - 前記パッド酸化膜を成長させる段階は、900℃乃至1200℃の温度で酸素を供給して前記半導体基板表面を酸化させる乾式酸化法を用いることを特徴とする請求項8記載の高耐圧電界効果トランジスタの形成方法。
- 前記露出されたパッド酸化膜及び下部基板をエッチングする段階の後、前記半導体基板を酸化性雰囲気で熱処理して前記トレンチが形成された基板をキュアリングする段階を更に含むことを特徴とする請求項8記載の高耐圧電界効果トランジスタの形成方法。
- 前記絶縁物を除去する段階は、前記窒化膜を阻止膜として前記絶縁膜の表面に対して化学的機械的研磨工程を遂行することを特徴とする請求項8記載の高耐圧電界効果トランジスタの形成方法。
- 前記ゲートを形成する段階は、
前記保護酸化膜が形成された前記半導体の基板上に誘電膜を形成する段階と、
前記誘電膜上に導電層を形成する段階と、
前記保護酸化膜の間の誘電膜及び前記導電層以外の前記誘電膜及び前記導電層を除去する段階と、を含むことを特徴とする請求項7記載の高耐圧電界効果トランジスタの形成方法。 - 前記誘電膜を形成する段階は、
前記半導体基板を高温の酸化性雰囲気で誘電体を成長させる段階と、
前記誘電体上に成長された誘電体と同じ物質を蒸着させる段階と、を含むことを特徴とする請求項12記載の高耐圧電界効果トランジスタの形成方法。 - 半導体基板にアクティブ領域を定義するために素子分離用トレンチを絶縁物で埋め立てる段階と、
前記アクティブ領域の左右側に凹部を形成するために前記アクティブ領域を選択的にエッチングする段階と、
前記凹部が形成された前記半導体の基板上にスクリーン酸化膜を成長させる段階と、
前記スクリーン酸化膜が成長された凹部の表面部位に低濃度ソース/ドレインを形成するために低濃度のイオンを注入する段階と、
前記凹部が形成された半導体基板の表面を露出させるためにスクリーン酸化膜を除去する段階と、
前記露出された半導体基板の表面に前記凹部を完全に埋め立てる酸化物を蒸着する段階と、
前記凹部を埋め立てる前記酸化物以外の前記アクティブ領域上に形成された前記酸化物を除去して前記凹部上の保護酸化膜を形成する段階と、
前記保護酸化膜の間にゲートを形成する段階と、
前記保護酸化膜と前記絶縁物との間に高濃度のソース/ドレインを形成するために高濃度のイオンを注入する段階と、を含むことを特徴とする高耐圧電界効果トランジスタの形成方法。 - 前記半導体の基板上にスクリーン酸化膜を成長させる段階は、高温の雰囲気で酸素を供給して前記半導体基板の表面を酸化させる乾式酸化方法を使うことを特徴とする請求項14記載の高耐圧電界効果トランジスタの形成方法。
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US8614468B2 (en) * | 2011-06-16 | 2013-12-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mask-less and implant free formation of complementary tunnel field effect transistors |
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CN102403233B (zh) * | 2011-12-12 | 2014-06-11 | 复旦大学 | 垂直沟道的隧穿晶体管的制造方法 |
KR102078340B1 (ko) | 2013-07-17 | 2020-02-18 | 삼성디스플레이 주식회사 | 정전기 보호 회로 및 이를 구비한 전자 장치 |
US10224407B2 (en) | 2017-02-28 | 2019-03-05 | Sandisk Technologies Llc | High voltage field effect transistor with laterally extended gate dielectric and method of making thereof |
CN112825301B (zh) * | 2019-11-21 | 2022-08-12 | 东南大学 | 绝缘栅双极型晶体管器件及其制造方法 |
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JP2000307104A (ja) * | 1999-04-23 | 2000-11-02 | Sanyo Electric Co Ltd | 半導体装置とその製造方法 |
JP2001015734A (ja) * | 1999-05-12 | 2001-01-19 | United Microelectronics Corp | トランジスタ素子製造におけるトレンチ分離構造を利用した高圧素子と低圧素子の整合方法 |
JP2001352058A (ja) * | 2000-06-09 | 2001-12-21 | Toshiba Corp | 半導体装置の製造方法 |
KR20030073403A (ko) * | 2002-03-11 | 2003-09-19 | 삼성전자주식회사 | 정전기 방전 보호를 위한 반도체 장치 및 그 제조 방법 |
JP2005045147A (ja) * | 2003-07-25 | 2005-02-17 | Seiko Epson Corp | 半導体装置およびその製造方法 |
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JP2927161B2 (ja) | 1993-10-25 | 1999-07-28 | ヤマハ株式会社 | 半導体メモリとその製法 |
US5899726A (en) * | 1995-12-08 | 1999-05-04 | Advanced Micro Devices, Inc. | Method of forming oxide isolation in a semiconductor device |
US5923999A (en) * | 1996-10-29 | 1999-07-13 | International Business Machines Corporation | Method of controlling dopant diffusion and metal contamination in thin polycide gate conductor of mosfet device |
KR100206957B1 (ko) | 1996-11-08 | 1999-07-01 | 구본준 | 고전압 반도체소자 및 그 제조방법 |
KR100216321B1 (ko) | 1997-04-02 | 1999-08-16 | 구본준 | 트랜지스터 및 그 제조방법 |
US6239472B1 (en) * | 1998-09-01 | 2001-05-29 | Philips Electronics North America Corp. | MOSFET structure having improved source/drain junction performance |
KR20000065719A (ko) * | 1999-04-08 | 2000-11-15 | 김영환 | 반도체 소자 및 그 제조방법 |
US6144538A (en) * | 1999-12-20 | 2000-11-07 | United Microelectronics Corp. | High voltage MOS transistor used in protection circuits |
KR100324339B1 (ko) | 2000-02-29 | 2002-03-13 | 박종섭 | 반도체 소자의 제조 방법 |
US6333234B1 (en) * | 2001-03-13 | 2001-12-25 | United Microelectronics Corp. | Method for making a HVMOS transistor |
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2003
- 2003-09-23 KR KR10-2003-0065891A patent/KR100525615B1/ko not_active IP Right Cessation
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2004
- 2004-09-08 US US10/935,890 patent/US7033896B2/en not_active Expired - Fee Related
- 2004-09-13 JP JP2004265863A patent/JP2005101602A/ja active Pending
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0425134A (ja) * | 1990-05-21 | 1992-01-28 | Seiko Instr Inc | 半導体装置 |
JPH1126766A (ja) * | 1997-06-27 | 1999-01-29 | New Japan Radio Co Ltd | Mos型電界効果トランジスタおよびその製造方法 |
JP2000307104A (ja) * | 1999-04-23 | 2000-11-02 | Sanyo Electric Co Ltd | 半導体装置とその製造方法 |
JP2001015734A (ja) * | 1999-05-12 | 2001-01-19 | United Microelectronics Corp | トランジスタ素子製造におけるトレンチ分離構造を利用した高圧素子と低圧素子の整合方法 |
JP2001352058A (ja) * | 2000-06-09 | 2001-12-21 | Toshiba Corp | 半導体装置の製造方法 |
KR20030073403A (ko) * | 2002-03-11 | 2003-09-19 | 삼성전자주식회사 | 정전기 방전 보호를 위한 반도체 장치 및 그 제조 방법 |
JP2005045147A (ja) * | 2003-07-25 | 2005-02-17 | Seiko Epson Corp | 半導体装置およびその製造方法 |
Also Published As
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KR100525615B1 (ko) | 2005-11-02 |
KR20050029564A (ko) | 2005-03-28 |
US20060141726A1 (en) | 2006-06-29 |
US7465978B2 (en) | 2008-12-16 |
US20050062104A1 (en) | 2005-03-24 |
US7033896B2 (en) | 2006-04-25 |
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