JP2005094011A - レーザサブマウント - Google Patents
レーザサブマウント Download PDFInfo
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- JP2005094011A JP2005094011A JP2004268250A JP2004268250A JP2005094011A JP 2005094011 A JP2005094011 A JP 2005094011A JP 2004268250 A JP2004268250 A JP 2004268250A JP 2004268250 A JP2004268250 A JP 2004268250A JP 2005094011 A JP2005094011 A JP 2005094011A
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- submount
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
【解決手段】光電子デバイス(150)は、サブマウント(80)とリッド(130)を含む。サブマウントは、基板(54)とレンズ(52)とレーザ(122)とを基板上に有する。リッドは、反射材料でコートされ45°ミラー(135)を形成する表面(132)を有するキャビティ(131)を画定する。ミラーは、レーザーダイからレンズへと光(152)を反射し、光はサブマウントを通り光電子デバイスを抜ける。
【選択図】図1
Description
図1は、本発明の一実施態様におけるレーザサブマウント80およびリッド130を備える光電子チップエンクロージャ(OECE)150(図16)を製造する方法10のフローチャートである。
t=λ/(N(Δni))
上記の方程式中、tは位相シフトレンズ層、λは目標波長、Nは位相シフトレンズ層の数、Δniは、位相シフトレンズ材料と、その環境の屈折率(ni)の差である。一実施態様では、λが1310nm、Nが8個、非晶質シリコンのniが3.6、二酸化シリコンのniが1.46の場合、非晶質シリコン層の一般的な厚さは765Åである。
図17は、光ファイバ(FO)トランシーバの製造における共通の構成単位である従来の光学アセンブリ(OSA)212を示す。OSA212は、電気信号を光信号に変換して、ファイバなどの光導波管214(図18)内に光のこうしたパルスをラウンチする。一般に、ファイバ214は、コネクタ本体218内に収容されるセラミックフェルール216内に実装される。コネクタ本体218は、スモールフォームファクタ(SFF)FOコネクタ、たとえば、一般にLCコネクタとして周知され、ルーセントテクノロジー(Lucent Technologies)が開発したルーセントコネクタなどで良い。その他のタイプのFOコネクタ、たとえばSCコネクタ、STコネクタおよびFCコネクタを使用しても良い。
Claims (10)
- レーザサブマウントであって、
基板と、
前記基板上のレンズと、
前記基板上の相互接続層と、
前記相互接続層上の誘電層と、
前記誘電層上のレーザと、
を備えるレーザサブマウント。 - 前記基板が、シリコン、石英、ホウケイ酸ナトリウムガラス、サファイア、ヒ化ガリウム、炭化ケイ素またはリン化ガリウムからなる群から選択される、請求項1に記載のレーザサブマウント。
- 前記誘電層上の接触パッドをさらに備え、前記レーザが前記接触パッドに電気的に接続される、請求項1に記載のレーザサブマウント。
- 前記誘電層上の封止リングをさらに備え、該封止リングは前記接触パッドおよび前記レーザダイを取り囲む、請求項3に記載のレーザサブマウント。
- 受動集積回路および能動集積回路の少なくとも一方をさらに備える、請求項1に記載のレーザサブマウント。
- サブマウントを形成するための方法であって、
基板上にレンズを形成するステップと、
前記基板上に相互接続層を形成するステップと、
前記相互接続層上に誘電層を形成するステップと、
前記基板上の前記サブマウントにレーザを取り付けるステップと、
を有する方法。 - 前記基板が、シリコン、石英、ホウケイ酸ナトリウムガラス、サファイア、ヒ化ガリウム、炭化ケイ素またはリン化ガリウムからなる群から選択される、請求項6に記載の方法。
- 前記誘電層を形成するステップ後であって、前記レーザを取り付けるステップの前に、
前記誘電層上に接触パッドを形成するステップをさらに有し、前記レーザが前記接触パッドに電気的に接続される、請求項6に記載の方法。 - 前記誘電層を形成するステップ後で、前記レーザを取り付けるステップの前に、
封止リングを前記誘電層上に形成するステップと、
前記接触パッドと前記レーザとを取り囲むステップと、
をさらに有する請求項8に記載の方法。 - 受動集積回路および能動集積回路の少なくとも一方を前記サブマウント内に形成するステップをさらに有する、請求項6に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/666,442 US20050063431A1 (en) | 2003-09-19 | 2003-09-19 | Integrated optics and electronics |
US10/666,442 | 2003-09-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005094011A true JP2005094011A (ja) | 2005-04-07 |
JP5015422B2 JP5015422B2 (ja) | 2012-08-29 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004268250A Expired - Fee Related JP5015422B2 (ja) | 2003-09-19 | 2004-09-15 | 光電子デバイス及び光電子デバイスを製造する方法 |
Country Status (4)
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US (2) | US20050063431A1 (ja) |
JP (1) | JP5015422B2 (ja) |
CN (1) | CN100391066C (ja) |
DE (1) | DE102004028117B4 (ja) |
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- 2004-06-09 DE DE102004028117A patent/DE102004028117B4/de not_active Expired - Fee Related
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JP5015422B2 (ja) | 2012-08-29 |
DE102004028117B4 (de) | 2010-11-11 |
CN1595741A (zh) | 2005-03-16 |
CN100391066C (zh) | 2008-05-28 |
US20050265722A1 (en) | 2005-12-01 |
US20050063431A1 (en) | 2005-03-24 |
US7413917B2 (en) | 2008-08-19 |
DE102004028117A1 (de) | 2005-05-04 |
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