JP2005064488A5 - - Google Patents
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- Publication number
- JP2005064488A5 JP2005064488A5 JP2004215754A JP2004215754A JP2005064488A5 JP 2005064488 A5 JP2005064488 A5 JP 2005064488A5 JP 2004215754 A JP2004215754 A JP 2004215754A JP 2004215754 A JP2004215754 A JP 2004215754A JP 2005064488 A5 JP2005064488 A5 JP 2005064488A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor film
- crystalline semiconductor
- ridges
- manufacturing
- metal element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004215754A JP4602023B2 (ja) | 2003-07-31 | 2004-07-23 | 半導体装置の作製方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003284462 | 2003-07-31 | ||
| JP2004215754A JP4602023B2 (ja) | 2003-07-31 | 2004-07-23 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005064488A JP2005064488A (ja) | 2005-03-10 |
| JP2005064488A5 true JP2005064488A5 (enExample) | 2007-07-12 |
| JP4602023B2 JP4602023B2 (ja) | 2010-12-22 |
Family
ID=34380271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004215754A Expired - Fee Related JP4602023B2 (ja) | 2003-07-31 | 2004-07-23 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4602023B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5063867B2 (ja) * | 2005-04-21 | 2012-10-31 | 株式会社Ｓｕｍｃｏ | Ｓｏｉ基板の製造方法 |
| JP2007048772A (ja) * | 2005-08-05 | 2007-02-22 | Rohm Co Ltd | 有機エレクトロルミネセンス素子 |
| JP5090690B2 (ja) * | 2006-08-28 | 2012-12-05 | 三菱電機株式会社 | 半導体薄膜の製造方法、薄膜トランジスタの製造方法、及び半導体薄膜の製造装置 |
| US8080450B2 (en) | 2007-04-18 | 2011-12-20 | Mitsubishi Electric Corporation | Method of manufacturing semiconductor thin film |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3471966B2 (ja) * | 1995-03-16 | 2003-12-02 | 株式会社半導体エネルギー研究所 | 薄膜半導体装置の作製方法 |
| JPH09213630A (ja) * | 1996-02-05 | 1997-08-15 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP3476320B2 (ja) * | 1996-02-23 | 2003-12-10 | 株式会社半導体エネルギー研究所 | 半導体薄膜およびその作製方法ならびに半導体装置およびその作製方法 |
| JP3389022B2 (ja) * | 1996-09-27 | 2003-03-24 | シャープ株式会社 | 半導体装置 |
| JP5222450B2 (ja) * | 2000-09-01 | 2013-06-26 | 株式会社半導体エネルギー研究所 | レーザー照射装置及び半導体装置の作製方法 |
| JP2002270510A (ja) * | 2000-12-26 | 2002-09-20 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP4827305B2 (ja) * | 2001-03-16 | 2011-11-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
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2004
- 2004-07-23 JP JP2004215754A patent/JP4602023B2/ja not_active Expired - Fee Related