JP2005011312A - 透明タッチパネル - Google Patents
透明タッチパネル Download PDFInfo
- Publication number
- JP2005011312A JP2005011312A JP2004010095A JP2004010095A JP2005011312A JP 2005011312 A JP2005011312 A JP 2005011312A JP 2004010095 A JP2004010095 A JP 2004010095A JP 2004010095 A JP2004010095 A JP 2004010095A JP 2005011312 A JP2005011312 A JP 2005011312A
- Authority
- JP
- Japan
- Prior art keywords
- touch panel
- conductive layer
- transparent touch
- substrate
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 11
- 239000000057 synthetic resin Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229920005749 polyurethane resin Polymers 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000002245 particle Substances 0.000 description 12
- 238000001514 detection method Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920006289 polycarbonate film Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006258 conductive agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Position Input By Displaying (AREA)
- Push-Button Switches (AREA)
Abstract
【解決手段】上電極2及び下電極4に接着接続される配線基板9の配線パターン8端部上に、合成樹脂内に導電金属粉が分散された接続層12を印刷形成して透明タッチパネルを構成することによって、上下基板と配線基板の接着接続が確実で、安定した電気的接続の透明タッチパネルを得ることができる。
【選択図】図1
Description
図1は本発明の一実施の形態による透明タッチパネルの断面図であり、同図において、1は厚さ150〜200μm前後のポリエチレンテレフタレートやポリカーボネートフィルム等の光透過性の上基板で、この下面には、酸化インジウム錫や酸化錫等の、光透過性の上導電層2が真空スパッタ等によって形成されている。
2 上導電層
3 下基板
4 下導電層
5 ドットスペーサ
6 上電極
7 下電極
8 配線パターン
8A 接続部
9 配線基板
10 異方導電接着剤
10A 合成樹脂
10B 導電粒子
12 接続層
Claims (2)
- 下面に上導電層及びこの上導電層の両端から延出する上電極が形成された光透過性の上基板と、上面に上記上導電層と所定の間隙を空けて対向する下導電層、及びこの下導電層の上記上導電層とは直交方向の両端から延出する下電極が形成された光透過性の下基板と、上面または下面の少なくとも一方に形成された導電金属製の複数の配線パターン端部が、異方導電接着剤により上記上電極及び上記下電極に接着接続された配線基板からなり、上記配線基板の配線パターン端部上に、合成樹脂内に導電金属粉が分散された接続層を印刷形成した透明タッチパネル。
- 銀粉を分散したポリウレタン樹脂を印刷して接続層を形成した請求項1記載の透明タッチパネル。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004010095A JP4622249B2 (ja) | 2003-05-29 | 2004-01-19 | 透明タッチパネル |
US10/850,262 US6969264B2 (en) | 2003-05-29 | 2004-05-20 | Transparent touch panel |
CNB2004100478490A CN100345095C (zh) | 2003-05-29 | 2004-05-31 | 透明接触板 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003152491 | 2003-05-29 | ||
JP2004010095A JP4622249B2 (ja) | 2003-05-29 | 2004-01-19 | 透明タッチパネル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005011312A true JP2005011312A (ja) | 2005-01-13 |
JP4622249B2 JP4622249B2 (ja) | 2011-02-02 |
Family
ID=33455569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004010095A Expired - Lifetime JP4622249B2 (ja) | 2003-05-29 | 2004-01-19 | 透明タッチパネル |
Country Status (3)
Country | Link |
---|---|
US (1) | US6969264B2 (ja) |
JP (1) | JP4622249B2 (ja) |
CN (1) | CN100345095C (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100428125C (zh) * | 2005-12-01 | 2008-10-22 | 松下电器产业株式会社 | 触摸面板 |
US7494358B2 (en) | 2007-03-14 | 2009-02-24 | Panasonic Corporation | Touch panel |
JP2016157477A (ja) * | 2010-09-27 | 2016-09-01 | エルジー イノテック カンパニー リミテッド | タッチスクリーンパネル及びこれを含むタッチスクリーンアセンブリー |
JPWO2017022398A1 (ja) * | 2015-07-31 | 2017-08-03 | 株式会社フジクラ | 配線体アセンブリ、導体層付き構造体、及びタッチセンサ |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019393A (ja) * | 2003-06-05 | 2005-01-20 | Sharp Corp | 異方性導電物、表示装置、表示装置の製造方法および導電部材 |
JP2007065983A (ja) * | 2005-08-31 | 2007-03-15 | Matsushita Electric Ind Co Ltd | タッチパネル |
US7422970B2 (en) * | 2005-12-29 | 2008-09-09 | Integrated Service Technology Inc. | Method for modifying circuit within substrate |
US7582403B2 (en) * | 2006-07-17 | 2009-09-01 | E. I. Du Pont De Nemours And Company | Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom |
JP2008235556A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
CN101689090A (zh) * | 2007-06-28 | 2010-03-31 | 京瓷株式会社 | 触摸面板及解摸面板型显示装置 |
US8149223B2 (en) * | 2009-02-09 | 2012-04-03 | Teh-Zheng Lin | Touch panel with stacking assembly |
CN103367947A (zh) * | 2012-04-10 | 2013-10-23 | 宸鸿科技(厦门)有限公司 | 接合结构 |
US10921945B2 (en) * | 2018-12-03 | 2021-02-16 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Resistive force touch control device |
US11175755B1 (en) * | 2020-06-08 | 2021-11-16 | Wacom Co., Ltd. | Input system and input method |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58183781U (ja) * | 1982-06-01 | 1983-12-07 | 信越ポリマー | 電気電子部品 |
JPH046771A (ja) * | 1990-04-24 | 1992-01-10 | Shin Etsu Polymer Co Ltd | 電気回路接続用ヒートシールコネクターおよびその接続方法 |
JPH0722099A (ja) * | 1993-06-17 | 1995-01-24 | Nissha Printing Co Ltd | フィルム状コネクタ及びその製造方法 |
JPH1083252A (ja) * | 1996-09-06 | 1998-03-31 | Hitachi Aic Inc | タッチパネル |
JPH1091345A (ja) * | 1996-09-11 | 1998-04-10 | Hitachi Aic Inc | タッチパネル |
JPH11307313A (ja) * | 1998-04-24 | 1999-11-05 | Mitsubishi Electric Corp | 避雷器およびその製造方法 |
JP2002041231A (ja) * | 2000-05-17 | 2002-02-08 | Hitachi Ltd | 画面入力型表示装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4644101A (en) * | 1985-12-11 | 1987-02-17 | At&T Bell Laboratories | Pressure-responsive position sensor |
JPS63199428U (ja) * | 1987-06-15 | 1988-12-22 | ||
JPH01206575A (ja) * | 1988-02-15 | 1989-08-18 | Shin Etsu Polymer Co Ltd | 接着性熱融着形コネクタ |
JP2598152B2 (ja) | 1990-04-28 | 1997-04-09 | シャープ株式会社 | タッチパネル |
JP4038931B2 (ja) | 1999-04-15 | 2008-01-30 | 松下電器産業株式会社 | 透明タッチパネル |
US6847355B1 (en) * | 1999-06-17 | 2005-01-25 | Nissha Printing Co., Ltd. | High-reliability touch panel |
-
2004
- 2004-01-19 JP JP2004010095A patent/JP4622249B2/ja not_active Expired - Lifetime
- 2004-05-20 US US10/850,262 patent/US6969264B2/en not_active Expired - Lifetime
- 2004-05-31 CN CNB2004100478490A patent/CN100345095C/zh not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58183781U (ja) * | 1982-06-01 | 1983-12-07 | 信越ポリマー | 電気電子部品 |
JPH046771A (ja) * | 1990-04-24 | 1992-01-10 | Shin Etsu Polymer Co Ltd | 電気回路接続用ヒートシールコネクターおよびその接続方法 |
JPH0722099A (ja) * | 1993-06-17 | 1995-01-24 | Nissha Printing Co Ltd | フィルム状コネクタ及びその製造方法 |
JPH1083252A (ja) * | 1996-09-06 | 1998-03-31 | Hitachi Aic Inc | タッチパネル |
JPH1091345A (ja) * | 1996-09-11 | 1998-04-10 | Hitachi Aic Inc | タッチパネル |
JPH11307313A (ja) * | 1998-04-24 | 1999-11-05 | Mitsubishi Electric Corp | 避雷器およびその製造方法 |
JP2002041231A (ja) * | 2000-05-17 | 2002-02-08 | Hitachi Ltd | 画面入力型表示装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100428125C (zh) * | 2005-12-01 | 2008-10-22 | 松下电器产业株式会社 | 触摸面板 |
US7538831B2 (en) | 2005-12-01 | 2009-05-26 | Panasonic Corporation | Touch panel |
US7494358B2 (en) | 2007-03-14 | 2009-02-24 | Panasonic Corporation | Touch panel |
JP2016157477A (ja) * | 2010-09-27 | 2016-09-01 | エルジー イノテック カンパニー リミテッド | タッチスクリーンパネル及びこれを含むタッチスクリーンアセンブリー |
JPWO2017022398A1 (ja) * | 2015-07-31 | 2017-08-03 | 株式会社フジクラ | 配線体アセンブリ、導体層付き構造体、及びタッチセンサ |
US9983448B2 (en) | 2015-07-31 | 2018-05-29 | Fujikura Ltd. | Wiring body assembly, structure with conductor layer, and touch sensor |
Also Published As
Publication number | Publication date |
---|---|
US20040238910A1 (en) | 2004-12-02 |
US6969264B2 (en) | 2005-11-29 |
JP4622249B2 (ja) | 2011-02-02 |
CN100345095C (zh) | 2007-10-24 |
CN1573802A (zh) | 2005-02-02 |
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